Abstract: A semiconductor substrate includes a first dielectric structure and a die. The first dielectric structure has a first surface and a second surface opposite to the first surface. The die is embedded within the first dielectric structure. The die includes an active surface facing the first surface of the first dielectric structure, a backside surface opposite to the active surface of the die and a metal layer disposed on the backside surface of the die. The metal layer is a recrystallized layer.

Abstract: A quantum device includes a qubit chip having a plurality of qubits and an interposer attached to and electrically connected to the qubit chip. The device also includes a substrate handler attached to one side of the qubit chip or to one side of the interposer, or both so as to be thermally in contact with the qubit chip or the interposer, or both. The substrate handler includes a plurality of vias, at least a portion of plurality of vias being filled with a non-superconducting material, the non-superconducting material being selected to dissipate heat generated in the qubit chip, the interposer or both.

Abstract: A lens assembly actuating module includes a holder, a metal yoke, a lens actuator and a Hall sensor. The holder includes a central opening, at least three metal connectors insert-molded with the holder, at least two metal terminals insert-molded with the holder, and a plurality of plated metal layers disposed on a surface of the holder. The metal yoke is coupled with the holder. The lens actuator is for carrying a lens unit including an optical axis. The lens actuator is movably disposed in the metal yoke. The lens actuator includes at least one elastic element and at least three metal hanging wires. The Hall sensor is disposed on one of the plated metal layers of the holder. The Hall sensor is for detecting a movement of the lens unit along a direction perpendicular to the optical axis.

Abstract: A semiconductor device package includes a first conductive structure, a stress buffering layer and a second conductive structure. The first conductive structure includes a substrate, at least one first electronic component embedded in the substrate, and a first circuit layer disposed on the substrate and electrically connected to the first electronic component. The first circuit layer includes a conductive wiring pattern. The stress buffering layer is disposed on the substrate. The conductive wiring pattern of the first circuit layer extends through the stress buffering layer. The second conductive structure is disposed on the stress buffering layer and the first circuit layer.

Abstract: A conductive structure includes a core portion, a plurality of electronic devices and a filling material. The core portion defines a cavity. The electronic devices are disposed in the cavity of the core portion. The filling material is disposed between the electronic devices and a sidewall of the cavity of the core portion.

Abstract: A semiconductor package structure includes a first substrate, a second substrate, a first redistribution layer, and a first reconnection layer. The first substrate may have a first surface. The second substrate can be spaced apart from the first substrate with a gap and may have a second surface. The first redistribution layer can be disposed between the first redistribution layer and the gap. The first substrate can be electrically connected to the second substrate via the first reconnection layer.

Abstract: Provided is a method of fabricating a semiconductor device, including the following steps. A first seal ring and a second seal ring that are separated from each other are formed on a substrate. A protective layer covering the first seal ring and the second seal ring is formed on the substrate. The protective layer between the first seal ring and the second seal ring includes a concave surface. The protective layer at the concave surface and a portion of the protective layer on the first seal ring are removed to form a spacer on a sidewall of the first seal ring, and form an opening in the protective layer. The width of the opening is greater than the width of the first seal ring, and the opening exposes a top surface of the first seal ring and the spacer.

Abstract: A photographing module includes a metal cover, a base, a lens portion and a leaf spring. The lens portion is displaceably disposed in an inner space. The leaf spring is assembled with the lens portion and includes an inner fixing portion, an outer fixing portion and an elastic portion. The inner fixing portion is assembled with the lens portion. The outer fixing portion contacts and is fixedly disposed with the metal cover. The elastic portion connects the inner fixing portion and the outer fixing portion. The leaf spring further includes a plurality of contact portions and a plurality of auxiliary elastic portions. Each of the auxiliary elastic portions connects the outer fixing portion and one of the contact portions. For the leaf spring, only the contact portions thereof contact side plates of the metal cover.

Abstract: A wiring structure includes a semiconductor assembly, a conductive structure, an adhesion layer and at least one through via. The semiconductor assembly includes a reconstitution module and a redistribution structure. The reconstitution module includes a plurality of semiconductor elements and an encapsulant. The semiconductor elements are disposed side by side. The encapsulant bonds the semiconductor elements together. The redistribution structure is in direct contact with the reconstitution module. The conductive structure includes at least one dielectric layer and at least one circuit layer in contact with the dielectric layer. The adhesion layer bonds the semiconductor assembly and the conductive structure together. The through via electrically connects the conductive structure and the redistribution structure of the semiconductor assembly.

Abstract: An intelligent bed monitoring system and device are provided in this disclosure. The system is applied to a bed frame, and the bed frame includes a bed board. The intelligent bed monitoring system includes a first server, an intelligent bed monitoring device and an electronic device. The intelligent bed monitoring device is communicated with the first server and the electronic device. The intelligent bed monitoring device further includes a pressure sensor, a processor, and a controlling module. The processor is electrically connected with the pressure sensor and the controlling module. The pressure sensor is configured to detect a vibration signal. The processor is configured to generate a physiological information according to the vibration signal, and transmit the physiological information to the first server via a communication interface. The controlling module is configured to control the bed board to adjust the bed board into a plurality of modes.

Abstract: An electronic device package includes a redistribution layer and a conductive substrate. The RDL includes a first surface. The conductive substrate is disposed on the first surface and electrically connected to the RDL. A circuit density of the RDL is higher than a circuit density of the conductive substrate, and an edge of the RDL laterally protrudes out from a respective edge of the conductive substrate.

Abstract: An electrical bed is provided in this disclosure. The electrical bed includes a frame, a plurality of bed plates, a first connector and a first driving unit. The frame includes a plurality of bed stands, and the bed plates are arranged on the bed stands. The first connector includes a first rotating member, a first connecting arm, a first transmission bar and a second connecting arm. The first rotating member is pivotally connected with the first connecting arm, and the first connecting arm is sleeved with the first transmission bar and fixed relative to each other, and the second connecting arm is sleeved with the first transmission bar and fixed relative to each other. The first driving unit is arranged to drive the first transmission bar to rotate and adjust one of the bed plates.

Abstract: An intelligent bed monitoring device and method are provided in this disclosure. The device is applied to a bed frame, and the bed frame includes a first bed board and a second bed board. The intelligent bed monitoring device includes a plurality of audio sensors, a processor and a controlling module. The processor is electrically connected to the audio sensors and the controlling module. The audio sensors are configured to detect a plurality of audio signals. The processor is configured to receive the audio signals, and calculate an audio source direction according to the audio signals. The controlling module is configured to control one of the first bed board and the second bed board according to the audio source direction to adjust one of the first bed board and the second bed board into a plurality of modes.

Abstract: A light-emitting element includes a semiconductor light-emitting stack including a first semiconductor layer, a second semiconductor layer formed on the first semiconductor layer, and an active layer formed therebetween; a first conductive layer disposed on the second semiconductor layer and electrically connecting the second semiconductor layer; a second conductive layer disposed on the second semiconductor layer and electrically connecting the first semiconductor layer; and a cushion part disposed on and directly contacts the first conductive layer, wherein in a top view, the cushion part is surrounded by and electrically isolated from the second conductive layer.

Abstract: A semiconductor wafer cleaning apparatus is provided. The semiconductor wafer cleaning apparatus includes a spin base having a through hole. The semiconductor wafer cleaning apparatus further includes a spindle extending through the through hole. The semiconductor wafer cleaning apparatus also includes a clamping member. The clamping member covers the through hole and connected to the spindle. A gap that communicates with the through hole is formed between the spin base and the clamping member. In addition, the semiconductor wafer cleaning apparatus includes a sealing ring. The sealing ring is positioned adjacent to the gap and located farther away from the spindle than the gap.

Abstract: A computer is provided, including a keyboard, a rotating plate, a pivot shaft and a screen. The rotating plate is movably disposed on the keyboard. The pivot shaft is connected to the rotating plate, and is movable relative to the keyboard. The screen is connected to the pivot shaft to move relative to the rotating plate.

Abstract: Provided are an image transform method and an image transform network. The method is for the image transform network including an image generator, a transform discriminator and a focus discriminator, and includes: generating a transformed image according to an un-transformed image and focus information by the image generator; computing a transform discrimination value according to the transformed image by the transform discriminator; computing a value of a first generator loss function and updating the image generator by the image generator; generating a focus discrimination value according to the un-transformed image, the transformed image, and the focus information by the focus discriminator; and computing a value of a second generator loss function according to the focus discrimination value and updating the image generator according to the value of the second generator loss function by the image generator.

Abstract: A light-emitting device comprises a semiconductor stack comprising a first semiconductor layer, a second semiconductor layer, and an active layer formed between the first semiconductor layer and the second semiconductor layer; a first contact layer on the first semiconductor layer; a second contact layer on the second semiconductor layer, wherein the first contact layer and the second contact layer comprise a metal material other than gold (Au) or copper (Cu); a first pad on the semiconductor stack; a second pad on the semiconductor stack.

Abstract: A wiring structure includes an upper conductive structure, a lower conductive structure and an intermediate layer. The upper conductive structure includes at least one upper dielectric layer and at least one upper circuit layer in contact with the dielectric layer. The lower conductive structure includes at least one lower dielectric layer and at least one lower circuit layer in contact with the lower dielectric layer. The at least one lower dielectric layer of the lower conductive structure is substantially free of glass fiber. The intermediate layer is disposed between the upper conductive structure and the lower conductive structure and bonds the upper conductive structure and the lower conductive structure together. The upper conductive structure is electrically connected to the lower conductive structure.

Abstract: A computer is provided, including a keyboard, a pivot shaft, a supporting plate and a screen. The pivot shaft is movably disposed on the keyboard. The supporting plate is connected to the pivot shaft, and is rotatable relative to the keyboard, and includes a supporting plate pivot. The screen is connected to the supporting plate pivot to rotate relative to the supporting plate.