Patents by Inventor Wen Hung (Steven) Lu

Wen Hung (Steven) Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for mitigating interference in a communications apparatus and a communications apparatus utilizing the same
    Patent number: 11324048
    Abstract: A communications apparatus includes a plurality of communications circuits and a coexistence management circuit. Each communications circuit is configured to provide wireless communications services in compliance with a protocol. The coexistence management circuit is configured to manage radio activities of the communications circuits. In response to a detection result of at least two radio activities to occur in a subsequent packet time, the coexistence management circuit is configured to determine whether an interference signal related to said at least two radio activities falls in a predetermined frequency band, and when the interference signal falls in the predetermined frequency band, the coexistence management circuit is configured to adjust a transmission power or an execution time of one of said at least two radio activities.
    Type: Grant
    Filed: June 17, 2020
    Date of Patent: May 3, 2022
    Assignee: MEDIATEK INC.
    Inventors: Yu-Ming Lai, Kai-Hsiang Yang, Wen-Ying Chien, Tsai-Yuan Hsu, Yu-Hsien Chang, Yu-Ming Wen, Ying-Che Hung, Pei-Wen Hung
  • Semiconductor package structures, semiconductor device packages and methods of manufacturing the same
    Patent number: 11322471
    Abstract: A semiconductor package structure includes a first substrate, a second substrate, a first redistribution layer, and a first reconnection layer. The first substrate may have a first surface. The second substrate can be spaced apart from the first substrate with a gap and may have a second surface. The first redistribution layer can be disposed between the first redistribution layer and the gap. The first substrate can be electrically connected to the second substrate via the first reconnection layer.
    Type: Grant
    Filed: November 12, 2019
    Date of Patent: May 3, 2022
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventor: Wen Hung Huang
  • Lens driving apparatus
    Patent number: 11314039
    Abstract: A lens driving apparatus includes a holder, a cover, a carrier, a first magnet, a coil, a spring, two second magnets and a hall sensor. The holder includes an opening hole. The cover is made of metal material and coupled to the holder. The carrier is movably disposed in the cover, and for coupling to a lens. The first magnet is connected to an inner side of the cover. The coil is wound around an outer side of the carrier, and adjacent to the first magnet. The spring is coupled to the carrier. The second magnets are disposed on one end of the carrier which is toward the holder. The hall sensor is for detecting a magnetic field of any one of the second magnets, wherein the magnetic field is varied according to a relative displacement between the hall sensor and the second magnet which is detected.
    Type: Grant
    Filed: December 19, 2019
    Date of Patent: April 26, 2022
    Assignee: LARGAN PRECISION CO., LTD.
    Inventors: Chun-Yi Lu, Te-Sheng Tseng, Wen-Hung Hsu
  • Saw tool
    Patent number: 11305361
    Abstract: A saw tool is provided, including: a rotatable member, a first end portion of the rotatable member being configured to be connected with a power source, a second end portion of the rotatable member including an insertion hole; and a driven assembly, driven by the rotatable member to be reciprocatably movable relative to the rotatable member; wherein the driven assembly includes a first end portion and a second end portion opposite to the first end portion, the first end portion being configured to be connected with a driving tool, the second end portion being slidably received within the insertion hole.
    Type: Grant
    Filed: September 28, 2020
    Date of Patent: April 19, 2022
    Assignee: SHIN YING ENTPR CO., LTD.
    Inventor: Wen-Hung Chiang
  • Semiconductor device package
    Patent number: 11309295
    Abstract: A semiconductor device package includes a first passive component having a first surface and a second passive component having a second surface facing the first surface of the first passive component. The first surface has a recessing portion and the second surface includes a protruding portion within the recessing portion of the first surface of the first passive component. A contour of the protruding portion and a contour of the recessing portion are substantially matched. A method of manufacturing a semiconductor device package is also disclosed.
    Type: Grant
    Filed: August 26, 2019
    Date of Patent: April 19, 2022
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Wen Hung Huang, Wen Chieh Yang
  • Photographing module with leaf spring and electronic device including same module
    Patent number: 11310406
    Abstract: A photographing module includes a metal cover, a base, a lens portion and a leaf spring. The lens portion is displaceably disposed in an inner space. The leaf spring is assembled with the lens portion and includes an inner fixing portion, an outer fixing portion and an elastic portion. The inner fixing portion is assembled with the lens portion. The outer fixing portion contacts and is fixedly disposed with the metal cover. The elastic portion connects the inner fixing portion and the outer fixing portion. The leaf spring further includes a plurality of contact portions and a plurality of auxiliary elastic portions. Each of the auxiliary elastic portions connects the outer fixing portion and one of the contact portions. For the leaf spring, only the contact portions thereof contact side plates of the metal cover.
    Type: Grant
    Filed: January 12, 2021
    Date of Patent: April 19, 2022
    Assignee: LARGAN DIGITAL CO., LTD.
    Inventors: Te-Sheng Tseng, Wen-Hung Hsu, Ming-Ta Chou
  • Semiconductor device package
    Patent number: 11309264
    Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes an antenna layer, a first circuit layer and a second circuit layer. The antenna layer has a first coefficient of thermal expansion (CTE). The first circuit layer is disposed over the antenna layer. The first circuit layer has a second CTE. The second circuit layer is disposed over the antenna layer. The second circuit layer has a third CTE. A difference between the first CTE and the second CTE is less than a difference between the first CTE and the third CTE.
    Type: Grant
    Filed: March 27, 2020
    Date of Patent: April 19, 2022
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventor: Wen Hung Huang
  • SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20220115338
    Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes a first conductive component, a second conductive component, a planarization layer and an antenna layer. The second conductive component is disposed adjacent to the first conductive component. The second conductive component and the first conductive component have different thicknesses. The planarization layer is disposed on the first conductive component. The antenna layer is disposed on the first conductive component and the second conductive component.
    Type: Application
    Filed: October 9, 2020
    Publication date: April 14, 2022
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Wen Hung HUANG
  • Device structure and method for manufacturing the same
    Patent number: 11302619
    Abstract: A device structure includes a stacked structure, a dielectric material, and an electrode via. The stacked structure includes a first metal oxide layer, a second metal oxide layer and a metal layer. The second metal oxide layer is opposite to the first metal oxide layer. The metal layer is interposed between the first metal oxide layer and the second metal oxide layer. The dielectric material extends through the first metal oxide layer. The electrode via extends through the dielectric material and electrically connected to the metal layer.
    Type: Grant
    Filed: October 1, 2019
    Date of Patent: April 12, 2022
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventor: Wen Hung Huang
  • Circular saw that uses a prism to reflect the cut images
    Patent number: 11298764
    Abstract: A circular saw includes a housing, a sawing assembly including a motor and a saw blade located at two opposite sides of the housing and connected together so that the saw blasé can be driven by the motor to saw the workpiece and a saw blade shield secured to the housing and covering a part of the saw blade to prevent the saw blade from cutting the surrounding people, and a prism assembly including a protective cover affixed to the front end of the saw blade shield and a prism located in the protective cover to reflect the image of the saw blade sawing the workpiece through a window of the protective cover to the line of sight of the operator. In this way, the operator can clearly confirm whether the sawing path is skewed with the normal operating posture to improve the efficiency.
    Type: Grant
    Filed: June 29, 2020
    Date of Patent: April 12, 2022
    Assignee: DURQ MACHINERY CORP.
    Inventors: Chia-Sheng Liu, Yi-Li Cheng, Wen-Hung Lo
  • SAW TOOL
    Publication number: 20220097154
    Abstract: A saw tool is provided, including: a rotatable member, a first end portion of the rotatable member being configured to be connected with a power source, a second end portion of the rotatable member including an insertion hole; and a driven assembly, driven by the rotatable member to be reciprocatably movable relative to the rotatable member; wherein the driven assembly includes a first end portion and a second end portion opposite to the first end portion, the first end portion being configured to be connected with a driving tool, the second end portion being slidably received within the insertion hole.
    Type: Application
    Filed: September 28, 2020
    Publication date: March 31, 2022
    Inventor: WEN-HUNG CHIANG
  • Socket
    Patent number: 11285589
    Abstract: A socket is provided, including a socket main body, a switch member and at least one positioning unit. The socket main body has a working portion and a sleeve portion which are disposed along an extending direction of an axis, and the sleeve portion has a receiving space which is for the inserting portion of a driving tool to insert thereinto; the switch member is movable along the extending direction, disposed to the sleeve portion, and rotatable about the axis; the at least one positioning unit includes a first receiving portion penetrating through the sleeve portion and being lateral to the axis, a second receiving portion formed on the switch member and facing the sleeve portion, and a positioning member movably received in the first receiving portion, and a part of the positioning member protrudes beyond the first receiving portion.
    Type: Grant
    Filed: January 3, 2020
    Date of Patent: March 29, 2022
    Assignee: SHIN YING ENTPR CO., LTD.
    Inventors: Wen-Hung Chiang, Katsumi Osafune
  • QUICK-RELEASE TOOL CONNECTION ROD
    Publication number: 20220080565
    Abstract: A quick-release tool connection rod is provided, including a main member, a sleeve and at least one locking mechanism. The sleeve is movably on the main member. The at least one locking mechanism includes a skew guide face, an elongate hole and a locking ball, the skew guide face is disposed on the sleeve, the elongate hole is disposed on the main member, and the locking ball is disposed in the elongate hole.
    Type: Application
    Filed: September 16, 2020
    Publication date: March 17, 2022
    Inventor: WEN-HUNG CHIANG
  • CAMERA MODULE HAVING REFLECTIVE ELEMENT AND ELECTRONIC DEVICE
    Publication number: 20220082786
    Abstract: A camera module includes a base, a lens module, a reflection module, a longitudinal guiding bar, a transverse guiding bar and a shaft guiding bar. The lens module has an optical axis and is disposed on the base. The reflection module includes a reflective element disposed on the base and located on an object side of the lens module. The longitudinal and transverse guiding bars are disposed between the base and the lens module and respectively extend in a first direction parallel to the optical axis and a second direction perpendicular to the optical axis. The shaft guiding bar is disposed between the base and the reflection module and extends in the second direction. The lens module is movable along the longitudinal and transverse guiding bars, respectively, and the reflective element is rotatable by taking the shaft guiding bar as a rotation axis.
    Type: Application
    Filed: October 21, 2020
    Publication date: March 17, 2022
    Applicant: LARGAN DIGITAL CO.,LTD.
    Inventors: Lin An CHANG, Ming-Ta CHOU, Wen-Hung HSU, Te-Sheng TSENG
  • Decision feedback equalization embedded in a slicer
    Patent number: 11271783
    Abstract: An apparatus and method for providing a decision feedback equalizer are disclosed herein. In some embodiments, a method and apparatus for reduction of inter-symbol interference (ISI) caused by communication channel impairments is disclosed. In some embodiments, a decision feedback equalizer includes a plurality of delay latches connected in series, a slicer circuit configured to receive an input signal from a communication channel and delayed feedback signals from the plurality of delay latches and determine a logical state of the received input signal, wherein the slicer circuit further comprises a dynamic threshold voltage calibration circuit configured to regulate a current flow between output nodes of the slicer circuit and ground based on the received delayed feedback signal and impulse response coefficients of the communication channel.
    Type: Grant
    Filed: December 9, 2020
    Date of Patent: March 8, 2022
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shu-Chun Yang, Wen-Hung Huang
  • SUBSTRATE STRUCTURES AND METHODS FOR FORMING THE SAME AND SEMICONDUCTOR PACKAGE STRUCTURES
    Publication number: 20220068783
    Abstract: A substrate structure and a method for manufacturing the same are provided. The substrate structure includes a first conductive layer, a dielectric layer, a second conductive layer and a connection layer. The dielectric layer is disposed on the first conductive layer. The dielectric layer defines an opening exposing the first conductive layer. The second conductive layer is disposed on the dielectric layer. The connection layer extends from an upper surface of the first conductive layer to a lateral surface of the second conductive layer. A surface roughness of an upper surface of the second conductive layer ranges from about 0.5 ?m to about 1.25 ?m.
    Type: Application
    Filed: August 31, 2020
    Publication date: March 3, 2022
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Wen Hung HUANG
  • Semiconductor devices, semiconductor device packages and method for manufacturing the same
    Patent number: 11264340
    Abstract: A capacitor structure includes a first metal layer, a first metal oxide layer, a second metal oxide layer, a first conductive member, a second conductive member and a metal composite structure. The first metal layer has a first surface and a second surface opposite the first surface. The first metal oxide layer is formed on the first surface of the first metal layer. The second metal oxide layer is formed on the second surface of the first metal layer. The first conductive member penetrates through the capacitor structure and is electrically isolated from the first metal layer. The second conductive member is electrically connected to the first metal layer. The metal composite structure is disposed between the second conductive member and the first metal layer.
    Type: Grant
    Filed: November 26, 2019
    Date of Patent: March 1, 2022
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventor: Wen Hung Huang
  • Torque screwdriver device
    Patent number: 11253983
    Abstract: A torque screwdriver device is provided, including: a housing, including a barrel and a cover coveringly connected with the barrel; an input shaft portion, rotatably assembled with the barrel; an output shaft portion, rotatably assembled with the barrel and including a socket mechanism; a torque clutch mechanism, including a first engaging portion disposed on the input shaft portion and a second engaging portion disposed on the output shaft portion, an elastic preload member biasing one of the first and second engaging portions, and a first bearing mechanism, the first bearing mechanism including a stop member abutted against the housing, a support member and at least one low friction member disposed between the stop member and the support member, at least one of the stop member and the support member being movable relative to the at least one low friction member.
    Type: Grant
    Filed: January 6, 2020
    Date of Patent: February 22, 2022
    Assignee: SHIN YING ENTPR CO., LTD.
    Inventor: Wen-Hung Chiang
  • WIRING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20220037242
    Abstract: A wiring structure and a method for manufacturing the same are provided. The wiring structure includes a conductive structure and at least one conductive through via. The conductive structure includes a plurality of dielectric layers, a plurality of circuit layers in contact with the dielectric layers, and a plurality of dam portions in contact with the dielectric layers. The dam portions are substantially arranged in a row and spaced apart from one another. The conductive through via extends through the dam portions.
    Type: Application
    Filed: July 31, 2020
    Publication date: February 3, 2022
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Wen Hung HUANG, Min Lung HUANG
  • Soundbar
    Patent number: D949821
    Type: Grant
    Filed: October 4, 2021
    Date of Patent: April 26, 2022
    Assignee: Bose Corporation
    Inventors: Wei Wen Hung, Steven A. Silverstein