Abstract: An LED manufacturing method includes following steps: providing an LED die; providing an electrode layer having a first section and a second section electrically insulated from the first section, and arranging the LED die on the second section wherein an electrically conductive material electrical connects a bottom of the LED die with second section; forming a transparent conductive layer to electrically connect a top of the LED die with the first section; providing a base and coating an outer surface of the base with a layer of electrically conductive material, defining a continuous gap in the electrically conductive material to divide the electrically conductive material into a first electrode part, and a second electrode part, arranging the electrode layer on the base so that the first section contacts the first electrode part, and the second section contacts the second electrode part.

Abstract: A method of manufacturing is disclosed. An exemplary method includes providing a substrate and forming one or more layers over the substrate. The method further includes forming a surface layer over the one or more layers. The method further includes performing a patterning process on the surface layer thereby forming a pattern on the surface layer. The method further includes performing a cleaning process using a cleaning solution to clean a top surface of the substrate. The cleaning solution includes tetra methyl ammonium hydroxide (TMAH), hydrogen peroxide (H2O2) and water (H2O).

Abstract: A system of multimodality-appended rich media comments is provided. The system includes a server and an electronic device. The electronic device includes a network access module, at least one sensor and a processing unit. The network access module communicates with the server. The at least one sensor senses a user's behavior in a recording mode to obtain a sensing data. The processing unit performs an application to provide a source medium, wherein a rich media comment function of the application can be activated to provide multiple interactive objects for selection and then trigger the recording mode. The application uploads the sensing data to the server after the recording mode finishes. The server analyzes the sensing data and accordingly modifies the selected interactive object, combines the source medium with the modified interactive object into a rendered medium, and then delivers the rendered medium to the application.

Abstract: An integrated circuit (IC) and a seal ring thereof are provided. The IC includes a first seal ring. The first seal ring is disposed in the IC. The first seal ring includes at least one stagger structure. The at least one stagger structure includes at least one stagger unit. The at least one stagger unit makes staggered connection with another neighboring stagger unit.

Abstract: A variable-angle vortex generator (10) installed in an intake pipe (100) of an internal combustion engine includes a shaft seat (1), a plurality of vanes (2) and a position restoring mechanism (3). Each vane (2) is arranged radially with an interval apart from each other and pivotally coupled to the shaft seat (1) and each vane (2) has a movable end (21) at an edge of the vane (2). The position restoring mechanism (3) is installed at the shaft seat (1) and includes a synchronizing element (31) for connecting each movable end (21). Each vane (2) is pushed by a fluid to produce a swing movement and let the fluid in the intake pipe (100) form a smooth vortex.

Abstract: A cover-type containing structure for flexible enclosures primarily includes a front cover sheet, a rear cover sheet and a flexible enclosure. The front cover sheet includes a first joining edge and a cover piece, whereas the rear cover sheet includes a cover assembly corresponding to the cover piece. The flexible enclosure includes a second joining edge and by engaging the first joining edge with the second joining edge, the front cover sheet and the flexible enclosure are fixed. Besides, the containing structure further includes a holding portion. Under a contained state, the holding portion is used to contain smaller objectives; whereas, in an unfolded state, in addition to using the flexible enclosure to contain larger objectives, the holding portion can be also used to contain smaller objectives. The present invention can be also applied to a piece of clothing combined with a bag unit or other flexible enclosure.

Abstract: A semiconductor device includes a substrate including an isolation region, and a resistor disposed over the isolation region, wherein the resistor includes an implant with an inverse box-like dopant profile that minimizes resistance variation from subsequent planarization variation. A contact is disposed over the resistor. A method of fabricating such a semiconductor device is also provided.

Abstract: A kickstand includes a holder, a bar, a shaft assembly, a cam assembly, and at least one spring washer. The bar is pivotally connected to the holder by the shaft assembly. The cam assembly is engaged with the holder and the bar and pivotally connected to the shaft assembly, so as to allow the bar to rotate relative to the holder to a closing position or an opening position selectively. The spring washer is engaged with the shaft assembly and abuts against the cam assembly.

Abstract: An exemplary light emitting diode includes a first type semiconductor layer, a second type semiconductor layer, and a multi quantum well layer sandwiched between the first and second type semiconductor layers. The multi quantum well layer includes a first barrier layer, a second barrier layer, two well layers sandwiched between the first and second barrier layers, and a third barrier layer sandwiched between the two well layers. The first and second barrier layers each have an energy level of conduction band higher than that of the third barrier layer. The first and second barrier layers each have an energy level of valence band higher than that of the third barrier layer.

Abstract: A light source module includes a light guide plate, at least one light emitting element, a circuit board, and a heat conductive structure. The light guide plate has a light incident surface and a bottom surface adjacent to each other. The light emitting element is disposed beside the light incident surface. The circuit board has a bottom and a sidewall. The bottom extends toward the light guide plate from an end of the sidewall. The sidewall has a first surface facing the light incident surface, and the bottom has a second surface facing the bottom surface. The light emitting element is disposed on the first surface. The heat conductive structure is disposed on the circuit board contacted the first surface and the second surface of the circuit board, for transmitting heat generated by the light emitting element and the circuit board.

Abstract: A safety hook includes a hook body and a trigger unit. The hook body has an opening. The trigger unit includes a keeper member and a trigger member. The keeper member is connected to the hook body. The trigger member is connected to the keeper member. The keeper member is operable to pivot relative to the hook body. The trigger member engages the hook body, and is unable to pivot relative to the keeper member so as to block the opening of the hook body when the keeper member is at a released position. The trigger member is moved via the keeper member to be disengaged from the hook body, and is able to pivot to unblock the opening of the hook body when the keeper member is at a pressed position.

Abstract: A semiconductor device including a first gate structure associated with a first type of transistor and a second gate structure of a second type of transistor. The first gate structure includes a capping layer, a first metal layer having a first type of work function on the capping layer, and a second metal layer having a second type of work function, overlying the first metal layer and a fill layer on the second metal layer. The second type of work function is different than the first type of work function. The second gate structure includes the gate dielectric and the second metal layer formed on the gate dielectric, and the fill layer on the second metal layer.

Abstract: A light emitting diode (LED) comprises a substrate, an epitaxial layer and an aluminum nitride (AlN) layer sequentially disposed on the substrate. The AlN layer comprises a plurality of stacks separated from each other, wherein the epitaxial layer entirely covers the plurality of stacks of the AlN layer. The AlN layer with a plurality of stacks reflects upwardly light generated by the epitaxial layer and downwardly toward the substrate to an outside of LED through a top plan of the LED. A method for forming the LED is also disclosed.

Abstract: An integrated circuit includes a semiconductor substrate, a gate dielectric over the substrate, a metal gate structure over the semiconductor substrate and the gate dielectric, a dielectric film on the metal gate structure, the dielectric film comprising oxynitride combined with metal from the metal gate, and an interlayer dielectric (ILD) on either side of the metal gate structure.

Abstract: The present disclosure provides devices and methods for obtaining images of body parts, implants, bones, and other areas of a patient that are involved in plastic or reconstructive surgery. A scanning device obtains an image of a body part of a patient to be replicated, sends it to a computer for review and/or manipulation, and the computer sends it to a printer or fabricator for reproduction. The scanning device, computer, and/or printer can be co-located, meaning that they are within the same facility. As an alternative to scanning the patient's body part, the computer of the present disclosure can obtain an image of the required body part from a stored set of anthropometric data on a database. The surgeon can modify the part produced from the anthropometric data as needed.

Abstract: A communication administration system includes: a administration system, for managing basis information of at least one user; and a service system, for fetching basic information and current location information of a called party from the administration system in response to a communication request from a calling party, obtaining current location information and preference information of the called party from the called party, and generating a communication mechanism scenario according to a communication mechanism system for the calling party to make a selection and to make a call accordingly.

Abstract: A multi-quantum well structure includes two first barrier layers, two well layers sandwiched between the two first barrier layers, and a doped second barrier layer sandwiched between the two well layers. The second barrier layer has its conduction band and forbidden band gradually transiting to those of one of the well layers, and a dopant concentration of the second barrier layer gradually changes along a direction from one well layer to the other. The invention also relates to a light emitting diode structure having the multi-quantum well structure.

Abstract: A shift register for an LCD display includes N shift register units. Each shift register unit outputs a shift signal. An Nth shift register unit includes a waveform-shaping unit electrically coupled to an shift signal output terminal of the Nth register to perform a waveform-shaping operation on the Nth shift signal according to the (N+1)th shift signal output by an (N+1)th shift register, to reduce the feed-through effect which causes display flicker.

Abstract: A system and method for manufacturing multiple-gate semiconductor devices is disclosed. An embodiment comprises multiple fins, wherein intra-fin isolation regions extend into the substrate less than inter-fin isolation regions. Regions of the multiple fins not covered by the gate stack are removed and source/drain regions are formed from the substrate so as to avoid the formation of voids between the fins in the source/drain region.

Abstract: A method of fabricating a gate structure includes depositing a high dielectric constant (high-k) dielectric layer over a substrate. The method further includes performing a multi-stage preheat high-temperature anneal. Performing the multi-stage preheat high-temperature anneal includes performing a first stage preheat at a temperature in a range from about 400° C. to about 600° C., performing a second stage preheat at a temperature in a range from about 700° C. to about 900° C., and performing a high temperature anneal at a peak temperature in a range from 875° C. to about 1200° C.