Patents by Inventor Wen LONG

Wen LONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20210090947
    Abstract: A semiconductor substrate and a method of manufacturing the same are provided. The semiconductor substrate includes a dielectric layer, at least one first conductive trace, and a conductive via. The dielectric layer has a first dielectric surface and a second dielectric surface opposite to the first dielectric surface. The first conductive trace is disposed adjacent to the first dielectric surface of the dielectric layer. The conductive via is disposed adjacent to the second dielectric surface of the dielectric layer and connected to the first conductive trace, where the conductive via and the first conductive trace are connected at a first interface leveled with about a half thickness of the dielectric layer.
    Type: Application
    Filed: September 24, 2019
    Publication date: March 25, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Wen-Long LU
  • METHOD AND APPARATUS FOR PERFORMING DATA-ACCESSING MANAGEMENT IN A STORAGE SERVER
    Publication number: 20210081126
    Abstract: A method for performing data-accessing management in a storage server and associated apparatus such as a host device, a storage device, etc. are provided. The method includes: in response to a client request of writing a first set of data into the storage server, utilizing the host device within the storage server to trigger broadcasting an internal request corresponding to the client request toward each storage device of a plurality of storage devices within the storage server; and in response to the internal request corresponding to the client request, utilizing said each storage device of the plurality of storage devices to search for the first set of data in said each storage device to determine whether the first set of data has been stored in any storage device, for controlling the storage server completing the client request without duplication of the first set of data within the storage server.
    Type: Application
    Filed: November 30, 2020
    Publication date: March 18, 2021
    Inventors: Tsung-Chieh Yang, Wen-Long Wang
  • SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20210083388
    Abstract: A semiconductor device package includes a circuit layer and a first antenna structure. The circuit layer includes a first surface, and a second surface opposite to the first surface. The first antenna structure is disposed on the first surface and electrically connected to the circuit layer. The first antenna structure includes a first patch, a second patch, a third patch, a first dielectric layer and a second dielectric layer. The second patch is disposed on the first patch. The first dielectric layer has a first dielectric constant (Dk), and is disposed between the first patch and the second patch. The third patch is disposed on the second patch. The second dielectric layer has a second dielectric constant and is disposed between the second patch and the third patch. The first dielectric constant is smaller than the second dielectric constant.
    Type: Application
    Filed: September 18, 2019
    Publication date: March 18, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Wen-Long LU
  • Method for performing access management of memory device, associated memory device and controller thereof, associated host device and associated electronic device
    Patent number: 10942677
    Abstract: A method for performing access management of a memory device and associated apparatus (e.g. the memory device and controller thereof such as a memory controller within the memory device, an associated host device and an associated electronic device) are provided. The method may include: when the host device sends a host command to the memory device, utilizing the memory controller to estimate a completion time of the host command, to generate completion time information corresponding to the completion time; and utilizing the memory controller to send the completion time information to the host device, to allow the host device to perform polling after the completion time to obtain execution result of the host command.
    Type: Grant
    Filed: January 24, 2019
    Date of Patent: March 9, 2021
    Assignee: Silicon Motion, Inc.
    Inventors: Tsung-Chieh Yang, Wen-Long Wang
  • PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20210066188
    Abstract: A package structure includes a base material, at least one electronic device, at least one dummy pillar and an encapsulant. The electronic device is electrically connected to the base material. The dummy pillar is disposed on the base material. The encapsulant covers the electronic device and a top end of the dummy pillar.
    Type: Application
    Filed: August 30, 2019
    Publication date: March 4, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Wen-Long LU
  • SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20210066208
    Abstract: A semiconductor package and a method of manufacturing the same are provided. The semiconductor package includes a first dielectric layer, a first semiconductor element, a second dielectric layer, and at least one first conducive via. The first dielectric layer has a first top surface, a first bottom surface opposite to the first top surface, and a first side surface extending from the first top surface to the first bottom surface. The first semiconductor element is disposed adjacent to the first top surface of the first dielectric layer. The second dielectric layer has a second top surface, a second bottom surface opposite to the second top surface, and a second side surface extending from the second top surface to the second bottom surface, where the second dielectric layer covers a top surface of the first semiconductor element and the first side surface of the first dielectric layer.
    Type: Application
    Filed: August 29, 2019
    Publication date: March 4, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Wen-Long LU
  • PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20210066228
    Abstract: A package structure includes a base material, at least one electronic device, at least one encapsulant and a plurality of dummy pillars. The electronic device is electrically connected to the base material. The encapsulant covers the electronic device. The dummy pillars are embedded in the encapsulant. At least two of the dummy pillars have different heights.
    Type: Application
    Filed: August 30, 2019
    Publication date: March 4, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Wen-Long LU
  • SEMICONDUCTOR PACKAGE DEVICE AND SEMICONDUCTOR PROCESS
    Publication number: 20210057356
    Abstract: A semiconductor package device includes a wiring structure, a semiconductor chip and an encapsulant. The semiconductor chip is electrically connected to the wiring structure. The encapsulant is disposed on the wiring structure and covers the semiconductor chip. A roughness (Ra) of a surface of the encapsulant is about 5 nm to about 50 nm.
    Type: Application
    Filed: August 21, 2019
    Publication date: February 25, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Wen-Long LU
  • Display apparatus and control method for high display bandwidth thereof
    Patent number: 10922256
    Abstract: A display apparatus is provided. The display apparatus includes a display panel and a display controller. The display controller is electrically connected to a USB Type-C interface of a host via a USB Type-C interface of the display apparatus. In response to the USB Type-C interface of the display apparatus being in a USB Type-C default pin-assignment mode, the display controller receives an image signal from the host via two USB SuperSpeed channels of the USB Type-C interface of display apparatus. In response to a display mode of the display apparatus satisfying a specific condition, the display controller controls the USB Type-C interface of the display apparatus to enter a USB Type-C first pin assignment mode, so that the host utilizes the four USB SuperSpeed channels of the USB Type-C interface of the display apparatus to transmit the image signal to the display controller.
    Type: Grant
    Filed: July 2, 2019
    Date of Patent: February 16, 2021
    Assignee: WISTRON CORP.
    Inventors: Li Fan Zheng, Yong Qiang Li, Yong Bo Li, Jun Xin Qiu, Wen Long Yang
  • SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20210035933
    Abstract: A semiconductor structure and a method of manufacturing the same are provided. The semiconductor structure includes a first semiconductor element and a first bonding structure. The first semiconductor element has a first element top surface and a first element bottom surface opposite to the element top surface. The first bonding structure is disposed adjacent to the element top surface of the first semiconductor element and includes a first electrical connector, a first insulation layer surrounding the first electrical connector, and a first metal layer surrounding the first insulation layer.
    Type: Application
    Filed: July 31, 2019
    Publication date: February 4, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Wen-Long LU
  • MEMORY ACCESS MODULE FOR PERFORMING A PLURALITY OF SENSING OPERATIONS TO GENERATE DIGITAL VALUES OF A STORAGE CELL IN ORDER TO PERFORM DECODING OF THE STORAGE CELL
    Publication number: 20210035632
    Abstract: A method for performing memory access of a Flash cell of a Flash memory includes: performing a first sensing operation corresponding to a first sensing voltage to generate a first digital value of the Flash cell; according to a result of the first sensing operation, performing a plurality of second sensing operations to generate a second digital value of the Flash cell representing at least one candidate threshold voltage of the Flash cell; determining the threshold voltage of the memory Flash cell according to the at least one candidate threshold voltage; determining soft information of a bit stored in the Flash cell according to the threshold voltage of the Flash cell; and using the soft information to perform soft decoding.
    Type: Application
    Filed: October 20, 2020
    Publication date: February 4, 2021
    Inventors: Tsung-Chieh Yang, Hsiao-Te Chang, Wen-Long Wang
  • Method of controlling an adjustable nozzle and method of making a semiconductor device
    Patent number: 10910199
    Abstract: A method of controlling a position of an adjustable nozzle includes depositing a film on a surface of a wafer. The method includes measuring a thickness profile of the surface of the wafer. The method includes comparing the measurement of the thickness profile with a reference value using a control unit. The method includes transmitting a control signal to the adjustable nozzle to alter the position of the adjustable nozzle based on the result of the comparison. The adjustable nozzle includes a base having a hollow center portion for conducting gas, the base configured for connection to a gas source. The adjust nozzle includes a tip coupled to the base and having an opening for conducting gas from the base to the exterior of the nozzle, wherein the base is configured for pivoting about a longitudinal axis of the base in response to the control signal.
    Type: Grant
    Filed: April 9, 2018
    Date of Patent: February 2, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Wei-Ching Wu, Wen-Long Lee, Ding-I Liu
  • SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20210028144
    Abstract: A semiconductor device package includes a first substrate having a first surface, a first electrical contact disposed on the first surface of the first substrate, a second substrate having a second surface facing the first surface of the first substrate, and a second electrical contact disposed on the second surface of the second substrate. The first electrical contact has a base portion and a protrusion portion. The second electrical contact covers at least a portion of the protrusion portion of the first electrical contact. The second electrical contact has a first surface facing the first substrate and a second surface facing the second substrate.
    Type: Application
    Filed: July 24, 2019
    Publication date: January 28, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Wen-Long LU
  • Semiconductor device package and method of manufacturing the same
    Patent number: 10903151
    Abstract: A semiconductor substrate includes a dielectric layer, a first conductive layer, a first barrier layer and a conductive post. The dielectric layer has a first surface and a second surface opposite to the first surface. The first conductive layer is disposed adjacent to the first surface of the dielectric layer. The first barrier layer is disposed on the first conductive layer. The conductive post is disposed on the first barrier layer. A width of the conductive post is equal to or less than a width of the first barrier layer.
    Type: Grant
    Filed: May 23, 2018
    Date of Patent: January 26, 2021
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventor: Wen-Long Lu
  • SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20210020533
    Abstract: A semiconductor device package includes an electronic component, an encapsulation layer encapsulating the electronic component, and a passivation layer stacking with the encapsulation layer. The passivation layer has a first surface facing the encapsulation layer, a second surface opposite to the first surface, and a first sidewall connecting the first surface and the second surface. The first sidewall inclines with respect to the second surface, and a first projection width of the encapsulation layer is greater than a second projection width of the passivation layer.
    Type: Application
    Filed: July 18, 2019
    Publication date: January 21, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Wen-Long LU
  • SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20210020579
    Abstract: A semiconductor device package includes a substrate and an electronic component disposed on the substrate. The electronic component has an active surface facing away from the substrate. The substrate has a first conductive pad and a second conductive pad disposed thereon. The electronic component has a first electrical contact and a second electrical contact disposed on the active surface. The semiconductor device package further includes a first metal layer connecting the first electrical contact with the first conductive pad, a second metal layer connecting the second electrical contact with the second conductive pad, a first seed layer disposed below the first metal layer; and a first isolation layer disposed between the first metal layer and the second metal layer. A method of manufacturing a semiconductor device package is also disclosed.
    Type: Application
    Filed: July 15, 2019
    Publication date: January 21, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Wen-Long LU
  • Semiconductor device package and method of manufacturing the same
    Patent number: 10886233
    Abstract: A semiconductor device package is provided, which includes a substrate, a semiconductor device and an alignment structure. The semiconductor device and the alignment structure are disposed on the substrate. The alignment structure is in direct contact with the semiconductor device.
    Type: Grant
    Filed: January 31, 2019
    Date of Patent: January 5, 2021
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventor: Wen-Long Lu
  • Method and apparatus for performing data-accessing management in a storage server
    Patent number: 10884642
    Abstract: A method for performing data-accessing management in a storage server and associated apparatus such as a host device, a storage device, etc. are provided. The method includes: in response to a client request of writing a first set of data into the storage server, utilizing the host device within the storage server to trigger broadcasting an internal request corresponding to the client request toward each storage device of a plurality of storage devices within the storage server; and in response to the internal request corresponding to the client request, utilizing said each storage device of the plurality of storage devices to search for the first set of data in said each storage device to determine whether the first set of data has been stored in any storage device, for controlling the storage server completing the client request without duplication of the first set of data within the storage server.
    Type: Grant
    Filed: March 27, 2019
    Date of Patent: January 5, 2021
    Assignee: Silicon Motion, Inc.
    Inventors: Tsung-Chieh Yang, Wen-Long Wang
  • Semiconductor device package and method of manufacturing the same
    Patent number: 10886149
    Abstract: A semiconductor device package includes a substrate, a semiconductor device, and an underfill. The semiconductor device is disposed on the substrate. The semiconductor device includes a first lateral surface. The underfill is disposed between the substrate and the semiconductor device. The underfill includes a first lateral surface. The first lateral surface of the underfill and the first lateral surface of the semiconductor device are substantially coplanar.
    Type: Grant
    Filed: January 31, 2019
    Date of Patent: January 5, 2021
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventor: Wen-Long Lu
  • SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20200395261
    Abstract: A semiconductor package structure includes a first semiconductor die, an encapsulant surrounding the first semiconductor die, and a redistribution layer (RDL) electrically coupled to the first semiconductor die. The encapsulant has a first surface over the first semiconductor die and a second surface under the first semiconductor die. The RDL has a first portion under the first surface of the encapsulant and a second portion over the first surface of the encapsulant.
    Type: Application
    Filed: June 17, 2019
    Publication date: December 17, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Wen-Long LU