Abstract: A semiconductor package structure includes a semiconductor die having an active surface, a conductive bump electrically coupled to the active surface, and a dielectric layer surrounding the conductive bump. The conductive bump and the dielectric layer form a planar surface at a distal end of the conductive bump with respect to the active surface. The distal end of the conductive bump is wider than a proximal end of the conductive bump with respect to the active surface.

Abstract: A parking management system and a parking space management method are provided. In this system, intelligent parking locks are capable of performing two-way data communication with a cloud platform and executing an action instruction issued by the cloud platform, which realizes parking space sharing, open and intelligent management and monitoring. One-key navigation parking and one-key car searching can be realized since the intelligent parking locks include Bluetooth positioning and/or multiple GPS combined with mobile internet applications. The problems in searching for a parking space and searching for one's own car are hence well solved. The induction type parking locks control system ensures automatic locking and unlocking operations according to the distance between the mobile terminal and the parking locks, which significantly improves user's experiences.

Abstract: A method for performing memory access includes: performing a first sensing operation corresponding to a first sensing voltage and performing at least a second sensing operation corresponding to a second sensing voltage to respectively generate a first digital value of a Flash cell of a Flash memory and a second digital value of the Flash cell of the Flash memory; using the first digital value, the second digital value, and charge distribution statistics information of the Flash memory to obtain soft information of a bit stored in the Flash cell, wherein the soft information corresponds to a threshold voltage of the Flash cell; and using the soft information to perform soft decoding.

Abstract: A semiconductor device package includes a circuit layer, an electronic component, an electronic component, a first passivation layer and a second passivation layer. The circuit layer has a first surface. The electronic component is disposed on the first surface of the circuit layer. The first passivation layer is disposed on the first surface of the circuit layer. The first passivation layer has a first surface facing away the circuit layer. The second passivation layer is disposed on the first surface of the first passivation layer. The second passivation layer has a second surface facing away the circuit layer. A uniformity of the first surface of the first passivation layer is greater than a uniformity of the second surface of the second passivation layer.

Abstract: A substrate structure is provided. The substrate structure includes a substrate, a first redistribution structure, a first adhesive layer and a first connecting component. The substrate includes a first conductor on a first surface thereof. The first redistribution structure is disposed over the substrate. The first adhesive layer is disposed between the substrate and the first redistribution structure. The first connecting component is electrically connected with the first conductor, penetrates through the first adhesive layer into the first redistribution structure, and electrically connects the substrate to the first redistribution structure.

Abstract: A substrate panel structure includes a plurality of sub-panels and a dielectric portion. Each of the sub-panels includes a plurality of substrate units. The dielectric portion is disposed between the sub-panels.

Abstract: A lamp, a light emitting module, and a combined lens thereof are provided. The combined lens includes a first lens portion and a second lens portion. The first lens portion has a surrounding lateral surface, an incident surface arranged inside of the surrounding lateral surface, and an exit surface opposite to the incident surface. The second lens portion includes a light diffusion surface and a light output surface. The light diffusion surface is spaced apart from and face toward the exit surface, and has a plurality of light diffusion microstructures that are arranged on a projection region defined by orthogonally projecting the exit surface onto the light diffusion surface. The combined lens is configured to guide light therein to travel out through the light output surface by passing through the exit surface and the light diffusion microstructures.

Abstract: A display apparatus is provided. The display apparatus includes a display panel, a backlight module, a power-supply circuit, and a system-control circuit. The display panel is configured to display an image signal. The backlight module is configured to provide backlight to the display panel. The power-supply circuit is configured to convert an alternating current (AC) source to a direct current (DC) voltage. The system-control circuit includes a power-loss-detection circuit and a display controller. The power-loss-detection circuit is configured to detect whether the DC voltage from the power-supply circuit has a power-loss event. The display controller is configured to control the display panel and the backlight module. In response to the power-loss-detection circuit detecting that the DC voltage has the power-loss event, the display controller performs a predetermined shutdown procedure to sequentially turn off the backlight module and the display panel.

Abstract: A laser preheating control method is applied to a laser preheating control device. When a cutter processes a workpiece along a process path, a laser source of the device is provided to output a laser beam to the workpiece for selectively forming a laser spot on the workpiece surface. And according to a movement direction of the cutter, a laser controller of the device is provided to form the laser spot only on a preheating region of the workpiece, where in front of the cutter in the process path, for preheating the workpiece in the preheating region. As a result, the laser spot will not repeatedly heat the workpiece behind the cutter in the process path, and the qualitative change of the workpiece caused by repeating heating is preventable.

Abstract: A semiconductor packaging device includes a first patterned insulation layer, a patterned conductive layer, a semiconductor device and an encapsulant. The first patterned insulation layer has a first surface, a second surface opposite the first surface, and an island portion having the first surface. The first patterned insulation layer defines a tapered groove surrounding the island portion. The patterned conductive layer is disposed on the first surface of the island portion. The semiconductor device electrically connects to the patterned conductive layer. The encapsulant encapsulates the semiconductor device, the first patterned insulation layer and the patterned conductive layer.

Abstract: A method for performing data-accessing management in a storage server and associated apparatus such as a host device, a storage device, etc. are provided. The method includes: in response to a client request of writing a first set of data into the storage server, utilizing the host device within the storage server to trigger broadcasting an internal request corresponding to the client request toward each storage device of a plurality of storage devices within the storage server; and in response to the internal request corresponding to the client request, utilizing said each storage device of the plurality of storage devices to search for the first set of data in said each storage device to determine whether the first set of data has been stored in any storage device, for controlling the storage server completing the client request without duplication of the first set of data within the storage server.

Abstract: An interconnection structure includes a first dielectric layer and a second dielectric layer. The second dielectric layer is disposed on the first dielectric layer. The second dielectric layer has a first surface and a second surface, both facing toward the first dielectric layer. The first surface of the second dielectric layer is recessed from the second surface of the second dielectric layer and defines a recess. A portion of the first dielectric layer is disposed within the recess.

Abstract: A method for performing data-compression management in a storage server may include: receiving data from a host device; performing entropy detection on a plurality of sets of partial data to generate entropy detection values of the plurality of sets of partial data, respectively; classifying the plurality of sets of partial data according to the entropy detection values of the plurality of sets of partial data, respectively, to perform data compression on at least one portion of the plurality of sets of partial data through a plurality of data compression modules, respectively, wherein the plurality of data compression modules correspond to different compression capabilities, respectively; and storing the plurality of sets of partial data into at least one storage device of the storage server and recording address mapping information of the plurality of sets of partial data, respectively. An associated apparatus is also provided.

Abstract: Methods and apparatus for physical vapor deposition are provided. The apparatus, for example, includes A PVD apparatus that includes a chamber including a chamber wall; a magnetron including a plurality of magnets configured to produce a magnetic field within the chamber; a pedestal configured to support a substrate; and a target assembly comprising a target made of gold and supported on the chamber wall via a backing plate coupled to a back surface of the target so that a front surface of the target faces the substrate, wherein a distance between a back surface formed in a recess of the backing plate and a bottom surface of the plurality of magnets is about 3.95 mm to about 4.45 mm, and wherein a distance between the front surface of the target and a front surface of the substrate is about 60.25 mm to about 60.75 mm.

Abstract: A system and a method for reducing computational complexity of neural networks are revealed. The method includes the steps of inputting weight values, input values and an enable signal into a first accumulator for starting inner product computation of the weight values and the input values by the enable signal and then performing a shift of the weight values and the input values; shifting a deviation value and performing an add operation of the shifted deviation value and both the weight values and the input values already being processed to get a first output value; and checking if the first output value is less than a threshold value and outputting a result value of zero (0) if the first output value is less than the threshold value. Thereby computational power of the neural network is decreased owing to omission of a part of computational process.

Abstract: A semiconductor device package includes a substrate, a semiconductor device, and an underfill. The semiconductor device is disposed on the substrate. The semiconductor device includes a first lateral surface. The underfill is disposed between the substrate and the semiconductor device. The underfill includes a first lateral surface. The first lateral surface of the underfill and the first lateral surface of the semiconductor device are substantially coplanar.

Abstract: A semiconductor device package is provided, which includes a substrate, a semiconductor device and an alignment structure. The semiconductor device and the alignment structure are disposed on the substrate. The alignment structure is in direct contact with the semiconductor device.

Abstract: A method for performing access management of a memory device and associated apparatus (e.g. the memory device and controller thereof such as a memory controller within the memory device, an associated host device and an associated electronic device) are provided. The method may include: when the host device sends a host command to the memory device, utilizing the memory controller to estimate a completion time of the host command, to generate completion time information corresponding to the completion time; and utilizing the memory controller to send the completion time information to the host device, to allow the host device to perform polling after the completion time to obtain execution result of the host command.

Abstract: A display apparatus is provided. The display apparatus includes a display panel and a display controller. The display controller is electrically connected to a USB Type-C interface of a host via a USB Type-C interface of the display apparatus. In response to the USB Type-C interface of the display apparatus being in a USB Type-C default pin-assignment mode, the display controller receives an image signal from the host via two USB SuperSpeed channels of the USB Type-C interface of display apparatus. In response to a display mode of the display apparatus satisfying a specific condition, the display controller controls the USB Type-C interface of the display apparatus to enter a USB Type-C first pin assignment mode, so that the host utilizes the four USB SuperSpeed channels of the USB Type-C interface of the display apparatus to transmit the image signal to the display controller.

Abstract: A display apparatus is provided. The display apparatus includes a display panel, a backlight module, a power-supply circuit, and a system-control circuit. The display panel is configured to display an image signal. The backlight module is configured to provide backlight to the display panel. The power-supply circuit is configured to convert an alternating current (AC) source to a direct current (DC) voltage. The system-control circuit includes a power-loss-detection circuit and a display controller. The power-loss-detection circuit is configured to detect whether the DC voltage from the power-supply circuit has a power-loss event. The display controller is configured to control the display panel and the backlight module. In response to the power-loss-detection circuit detecting that the DC voltage has the power-loss event, the display controller performs a predetermined shutdown procedure to sequentially turn off the backlight module and the display panel.