Abstract: An automatic packaging method of optical elements includes a focusing platform set, a Z-axis feeder set and an automatic feeding set. The Z-axis feeder set is provided above the focusing platform set. An automatic feeding set is arranged on a horizontal plane between the Z-axis feeder set and the focusing platform set by an appropriate distance. An upper part and a lower part of an optical element are supported by the lower end of the Z-axis feeder set and the upper end of the focusing platform set, respectively. The lower end of the Z-axis feeder set is adjusted vertically and horizontally with respect to the focusing platform set such that the upper part and the lower part are arranged in a line and coincide with each other. Afterward, by using the automatic feeding set, the upper part and the lower part of the optical element are bound together via the solders.

Abstract: A heat sink assembly includes a heat sink (10) deposited on a circuit board (100), a pair of bolts (30), and a clip (20) attached to the circuit board. The clip includes a pressing portion (22) engaging the circuit board, a first locking portion (26) and a second locking portion (28). The first locking portion defines an opening (42) and a slot (40) and the second locking portion defines a positioning groove (50). The clip further includes a clamping portion (70) linearly movably and rotatable mounted on the second locking portion. One bolt has a head engaging with the heat sink and a bead engaging with the first locking portion. The other bolt has a head engaging with the heat sink and a bead engaging with the clamping portion.

Abstract: A heat dissipation device includes a first heat sink (10) mounted on one side of a video graphics adapter (VGA) card (70) on which a heat generating componnent (74) is mounted to dissipate heat generated by the heat generating componnent, a second heat sink (30) mounted on an opposite side of the card, a first heat pipe (50, 50?) thermally connected to the first heat sink, a second heat pipe (60, 60?) discrete from the first heat pipe thermally connected to the second heat sink, and a connecting member (80, 80?) connected between the first and second heat pipes for transferring heat from the first heat pipe to the second heat pipe.

Abstract: A heat dissipation device includes a first heat sink (10) mounted on one side of a video graphics adapter (VGA) card (70) on which a heat generating componnent (74) is mounted to dissipate heat generated by the heat generating componnent, a second heat sink (30) mounted on an opposite side of the card, a first heat pipe (50, 50?) thermally connected to the first heat sink, a second heat pipe (60, 60?) discrete from the first heat pipe thermally connected to the second heat sink, and a connecting member (80, 80?) connected between the first and second heat pipes for transferring heat from the first heat pipe to the second heat pipe.

Abstract: An automatic packaging method of optical elements includes a focusing platform set, a Z-axis feeder set and an automatic feeding set. The Z-axis feeder set is provided above the focusing platform set. An automatic feeding set is arranged on a horizontal plane between the Z-axis feeder set and the focusing platform set by an appropriate distance. An upper part and a lower part of an optical element are supported by the lower end of the Z-axis feeder set and the upper end of the focusing platform set, respectively. The lower end of the Z-axis feeder set is adjusted vertically and horizontally with respect to the focusing platform set such that the upper part and the lower part are arranged in a line and coincide with each other. Afterward, by using the automatic feeding set, the upper part and the lower part of the optical element are bound together via the solders.

Abstract: The present invention relates to an interactive language learning method capable of speech recognition. The speech recognition technology is applied in the interactive language learning method for analyzing and comparing whether the language practiced by the user is correct. The present invention comprises a repetition mode or a conversation mode. First, this method accesses and plays any language voice data, and waits for a period to let the user input a practice voice signal. Then, the speech recognition is performed to generate the speech recognition data. The speech recognition data and the language voice data are compared to generate a similarity value. Finally, the similarity value and the predetermined adjustment value are compared, and correct/erroneous record regarding the language voice data practiced by the user is stored. Thereafter, all of the correct or erroneous information record regarding the user's practice is compiled.

Abstract: A fastener (10) for mounting a heat-radiator (20) to an electronic device (30) on a circuit board (40) is disclosed. The heat-radiator and the circuit board have aligned holes (22, 44). The fastener includes a head (11) having an upper portion (112) with a large diameter and a lower portion (113) with a smaller diameter, a cylindrical spring (14) captured around the lower portion of the head for exerting a spring force against the heat-radiator, and a metallic wire (15) having a first end portion fixed on said head and a second end portion bent to form an engaging portion (152). The engaging portion of the metallic wire compressively passes through the aligned holes of the heat-radiator and the circuit board and is engaged with an underside of the circuit board.

Abstract: A heat dissipating device includes a heat sink (50) and two clips (10) for mounting the heat sink to a retention module (60) which surrounds an electronic component (65). The heat sink provides two shoulders (72). Each clip includes a strap (21) supported on one shoulder, a lever (40) having a cam pivotally connected to the strap, two legs (30) pivotally connected to opposite end portions of the strap, and two spring fingers (26) integrally extending from opposite ends of the strap. In assembly, the straps are downwardly pressed and the retention module push the legs to pivot away from the feet from original states toward forced states. When the legs arrive openings of the retention module the fingers urge the legs to enter the openings. The levers are then pivoted to push the straps to move upwardly to thereby cause the legs to firmly engage in the openings.

Abstract: This invention features a dipyrazolo-pyridine compound of formula (I): each of R1, R2, R3, and R4, independently, is H, alkyl, alkenyl, cycloalkyl, aryl, or heteroaryl; and each of R5 and R6, independently, is aryl or heteroaryl, or R5 and R6, together with the N atom they are attached to, are heteroaryl. The dipyrazolo-pyridine compound can be used in an electro-luminescence device.

Abstract: The present invention generally provides a method of measuring the biological activity of Coagulation Factor VIIa (Factor VIIa). Specifically, the present invention provides a method for directly measuring the activity of Factor VIIa in a plasma sample. More specifically, the present invention provides a method for utilizing Factor VIIa activity as a bio-marker to monitor Factor VIIa inhibition to screen compounds which are able to inhibit the biological activity of Factor VIIa.

Abstract: A method of prevention maintenance preventing parts of an etcher from being eroded is disclosed. First, a layer of hydrogen-free chemical compound is formed on surface of the parts of the etcher according to one embodiment of the present invention. Otherwise, the parts of the etcher are immersed into a tank containing hydrogen-free chemical compound according to another embodiment of the present invention. After that, a standard process of prevention maintenance is performed by a cleaning agent.

Abstract: This invention features a dipyrazolo-pyridine compound of formula (I): 1

Abstract: A method for forming spacers in micro-displays to eliminate dark or white spots is disclosed. The method includes the steps of (1) providing a substrate for each of red, green and blue micro-displays with metallic reflective pads formed on the substrate, the pads being spaced from each other by non-reflective areas; (2) forming a coating of a transparent, non-conductive material on the substrate and over the reflective pads; (3) providing a mask associated with each substrate, each mask having a number of shielded zones that are not corresponding in location to each other; and (4) performing a lithographic operation on the transparent, non-conductive coating of each substrate of step (2) by using the associated mask of step (3) whereby portions of the transparent, non-conductive material that are corresponding to the shielded zones of the mask are left on the substrate, functioning as the spacers.

Abstract: The present invention generally provides a method of measuring the biological activity of Coagulation Factor VIIa (Factor VIIa). Specifically, the present invention provides a method for directly measuring the activity of Factor VIIa in a plasma sample. More specifically, the present invention provides a method for utilizing Factor VIIa activity as a bio-marker to monitor Factor VIIa inhibition to screen compounds which are able to inhibit the biological activity of Factor VIIa.

Abstract: A method of prevention maintenance preventing parts of an etcher from being eroded is disclosed. First, a layer of hydrogen-free chemical compound is formed on surface of the parts of the etcher according to one embodiment of the present invention. Otherwise, the parts of the etcher are immersed into a tank containing hydrogen-free chemical compound according to another embodiment of the present invention. After that, a standard process of prevention maintenance is performed by a cleaning agent.

Abstract: An apparatus and related method for preventing leakage of process gases or liquids from a semiconductor wafer processing system, such as an oxidizing furnace. A specific embodiment of the present invention provides a method of preventing leakage of process gases or liquids from a joint of external piping and piping in a semiconductor wafer processing system. The method includes installing as the external piping a tube. The tube has a flange shaped to accommodate an O-ring. The method also includes providing an O-ring for use with the flange, and fastening the O-ring between the flange and the piping with a fastening mechanism to prevent leakage of process gases or liquids from the joint. Yet another embodiment provides a retrofit to existing external piping. A further embodiment provides an apparatus for processing semiconductor substrates that includes use of the O-ring, fastening mechanism and tube with flange.

Abstract: An apparatus for maintaining semiconductor is disclosed. The cleaning apparatus includes two parts of a maintaining apparatus and gas-absorbing apparatus The maintaining apparatus mainly comprises a container using for isolating poison gas outside and a inner vessel, both being shaped as a cylinder, having an absorption exit with hose extending. There are an entrance and an exit end for absorption exit of container as well. This absorption exit is formed as for receiving and passing toxic gas. The vessel is as like cylinder shape and which has a hole on the top, also a plurality of holes embodied on the vessel for gas exiting. A disk is provided for covering the vessel container, and also for isolating toxic gas and the natural atmosphere. A plurality of rollers is for providing both functions of loading and rotation of vessel. The gas-absorbing apparatus can provide a source for absorbing gas quickly as well.

Abstract: A method used in some step of processing for ashing a photoresist resin film of a semiconductor wafer is disclosed. Generally the present method will conclude the following steps. Firstly adjusting Etch-Module-Asher endpoint is carried out. Then placing the substrate coated with the resist film in a vacuum chamber will be achieved. The next step is that positing silicon wafer into asher through the vacuum chamber having a wafer holding-set plate, it is for closely receiving and orderly stepped ranking the wafer. Here, the silicon wafer is pushed to the chamber. Finally, the last process is that adjusting second Etch-Module-Asher Endpoint. Simultaneously ashing the resist film by an oxygen plasma is carried out while heating the substrate to remove the resist film, therefore photoresist is peeled up a first end of the silicon wafer and the silicon wafer is cleaned up and the other end of the silicon wafer.

Abstract: The present invention relates to a method for prolonging life time of a dry etching chamber. A neck portion of the dry etching chamber, according to the present invention, is divided three sections, namely a first section, a second section and a third section in sequence from top of the neck portion to bottom thereof and each section has the same area. A first phase of a two-phase connection method, according to the present invention, then proceeds as the following. The first section is surrounded by an electrode coil connected to a rf power and the second section is surrounded by an electrode coil connected to the ground, not touching the electrode coil connected to the rf power, so that a plasma field within the dry etching chamber can be produced to perform a dry etching. The dry etching can be applied in production line until before life time of the first section comes to an end, i.e. about 95 % of life time of the dry etching chamber disclosed in prior art.