Patents by Inventor Wen Peng

Wen Peng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060228527
    Abstract: A bubble wrapping sheet has a simple structure and can easily inflate all of the air bubbles to wrap a product to be protected. The air bubbles can be constructed by tube partition seals that create air tubes and by bubble partition seals that divide the air tubes into a plurality of series connected air bubbles. The shape and size of the tube partition seals and bubble partition seals can be modified to change the shape of air bubbles and the density of the air bubbles on the bubble wrapping sheet. A check valve for the bubble wrapping sheet is provided to each air tube. The check valve may be configured by an air flow maze portion having a zig-zag air passage and a common air duct portion which provides the air to the air flow maze portion of a current air tube as well as to the air flow maze portion of a next air tube.
    Type: Application
    Filed: April 11, 2005
    Publication date: October 12, 2006
    Inventors: Yasuzumi Tanaka, Wei-Wen Peng
  • Publication number: 20060158813
    Abstract: An electronic type protective relay integrates the mechanical structure into a single operation rod to protect electric machinery. The electronic type protective relay includes an insulating shell, a tripping rod, a magnetic-force device and an operation device. The tripping rod is pivoted in the inner part of the insulating shell and conducts two pairs of connection pins. The tripping rod includes a control magnetic core. The magnetic-force device includes a tripping electromagnet, a reset electromagnet, and a permanent magnet installed between the tripping electromagnet and the reset electromagnet. The operation device includes an auxiliary rod located on one side of the tripping rod, an operation rod installed between the tripping rod and the auxiliary rod and protruding beyond the insulating shell. The operation rod can be located at four locations and in cooperation with the auxiliary rod to stop or reset.
    Type: Application
    Filed: December 22, 2005
    Publication date: July 20, 2006
    Inventors: Seng-Wen Peng, Fong-Jhou Chen
  • Patent number: 7075790
    Abstract: A heat dissipating device includes a heat sink (50) and two clips (10) for mounting the heat sink to a retention module (60) which surrounds an electronic component (65). The heat sink provides two shoulders (72). Each clip includes a strap (21) supported on one shoulder, a lever (40) having a cam pivotally connected to the strap, two legs (30) pivotally connected to opposite end portions of the strap, and two spring fingers (26) integrally extending from opposite ends of the strap. In assembly, the straps are downwardly pressed and the retention module push the legs to pivot away from the feet from original states toward forced states. When the legs arrive openings of the retention module the fingers urge the legs to enter the openings. The levers are then pivoted to push the straps to move upwardly to thereby cause the legs to firmly engage in the openings.
    Type: Grant
    Filed: July 27, 2004
    Date of Patent: July 11, 2006
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Chun-Chi Chen, Xue-Wen Peng, Hsieh Kun Lee, Cheng-Tien Lai, Zhi-Yong Zhou
  • Patent number: 7040524
    Abstract: An automatic packaging method of optical elements includes a focusing platform set, a Z-axis feeder set and an automatic feeding set. The Z-axis feeder set is provided above the focusing platform set. An automatic feeding set is arranged on a horizontal plane between the Z-axis feeder set and the focusing platform set by an appropriate distance. An upper part and a lower part of an optical element are supported by the lower end of the Z-axis feeder set and the upper end of the focusing platform set, respectively. The lower end of the Z-axis feeder set is adjusted vertically and horizontally with respect to the focusing platform set such that the upper part and the lower part are arranged in a line and coincide with each other. Afterward, by using the automatic feeding set, the upper part and the lower part of the optical element are bound together via the solders.
    Type: Grant
    Filed: December 29, 2003
    Date of Patent: May 9, 2006
    Assignee: Industrial Technology Research Institute
    Inventors: Chih-Hsien Chien, Shean-Son Chiou, Chin-Yi Tsai, Sung-Ho Liu, Wen-Peng Tseng
  • Publication number: 20060087817
    Abstract: A heat sink assembly includes a heat sink (10) deposited on a circuit board (100), a pair of bolts (30), and a clip (20) attached to the circuit board. The clip includes a pressing portion (22) engaging the circuit board, a first locking portion (26) and a second locking portion (28). The first locking portion defines an opening (42) and a slot (40) and the second locking portion defines a positioning groove (50). The clip further includes a clamping portion (70) linearly movably and rotatable mounted on the second locking portion. One bolt has a head engaging with the heat sink and a bead engaging with the first locking portion. The other bolt has a head engaging with the heat sink and a bead engaging with the clamping portion.
    Type: Application
    Filed: August 23, 2005
    Publication date: April 27, 2006
    Applicant: Foxconn Technology Co., Ltd
    Inventors: Xue-Wen Peng, Bing Chen
  • Patent number: 7019974
    Abstract: A heat dissipation device includes a first heat sink (10) mounted on one side of a video graphics adapter (VGA) card (70) on which a heat generating componnent (74) is mounted to dissipate heat generated by the heat generating componnent, a second heat sink (30) mounted on an opposite side of the card, a first heat pipe (50, 50?) thermally connected to the first heat sink, a second heat pipe (60, 60?) discrete from the first heat pipe thermally connected to the second heat sink, and a connecting member (80, 80?) connected between the first and second heat pipes for transferring heat from the first heat pipe to the second heat pipe.
    Type: Grant
    Filed: July 16, 2004
    Date of Patent: March 28, 2006
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Hsieh-Kun Lee, Xue-Wen Peng, Rui-Hua Chen
  • Publication number: 20060012959
    Abstract: A heat dissipation device includes a first heat sink (10) mounted on one side of a video graphics adapter (VGA) card (70) on which a heat generating componnent (74) is mounted to dissipate heat generated by the heat generating componnent, a second heat sink (30) mounted on an opposite side of the card, a first heat pipe (50, 50?) thermally connected to the first heat sink, a second heat pipe (60, 60?) discrete from the first heat pipe thermally connected to the second heat sink, and a connecting member (80, 80?) connected between the first and second heat pipes for transferring heat from the first heat pipe to the second heat pipe.
    Type: Application
    Filed: July 16, 2004
    Publication date: January 19, 2006
    Applicant: HON HAI Precision Industry CO., LTD.
    Inventors: Hsieh-Kun Lee, Xue-Wen Peng, Rui-Hua Chen
  • Publication number: 20050139638
    Abstract: An automatic packaging method of optical elements includes a focusing platform set, a Z-axis feeder set and an automatic feeding set. The Z-axis feeder set is provided above the focusing platform set. An automatic feeding set is arranged on a horizontal plane between the Z-axis feeder set and the focusing platform set by an appropriate distance. An upper part and a lower part of an optical element are supported by the lower end of the Z-axis feeder set and the upper end of the focusing platform set, respectively. The lower end of the Z-axis feeder set is adjusted vertically and horizontally with respect to the focusing platform set such that the upper part and the lower part are arranged in a line and coincide with each other. Afterward, by using the automatic feeding set, the upper part and the lower part of the optical element are bound together via the solders.
    Type: Application
    Filed: December 29, 2003
    Publication date: June 30, 2005
    Inventors: Chih-Hsien Chien, Shean-Son Chiou, Chin-Yi Tsai, Sung-Ho Liu, Wen-Peng Tseng
  • Publication number: 20050144010
    Abstract: The present invention relates to an interactive language learning method capable of speech recognition. The speech recognition technology is applied in the interactive language learning method for analyzing and comparing whether the language practiced by the user is correct. The present invention comprises a repetition mode or a conversation mode. First, this method accesses and plays any language voice data, and waits for a period to let the user input a practice voice signal. Then, the speech recognition is performed to generate the speech recognition data. The speech recognition data and the language voice data are compared to generate a similarity value. Finally, the similarity value and the predetermined adjustment value are compared, and correct/erroneous record regarding the language voice data practiced by the user is stored. Thereafter, all of the correct or erroneous information record regarding the user's practice is compiled.
    Type: Application
    Filed: December 31, 2003
    Publication date: June 30, 2005
    Inventor: Wen Peng
  • Publication number: 20050128714
    Abstract: A fastener (10) for mounting a heat-radiator (20) to an electronic device (30) on a circuit board (40) is disclosed. The heat-radiator and the circuit board have aligned holes (22, 44). The fastener includes a head (11) having an upper portion (112) with a large diameter and a lower portion (113) with a smaller diameter, a cylindrical spring (14) captured around the lower portion of the head for exerting a spring force against the heat-radiator, and a metallic wire (15) having a first end portion fixed on said head and a second end portion bent to form an engaging portion (152). The engaging portion of the metallic wire compressively passes through the aligned holes of the heat-radiator and the circuit board and is engaged with an underside of the circuit board.
    Type: Application
    Filed: September 23, 2004
    Publication date: June 16, 2005
    Inventors: Hsieh Lee, Wan-Lin Xia, Xue-Wen Peng, Jin-Song Feng
  • Publication number: 20050045311
    Abstract: A heat dissipating device includes a heat sink (50) and two clips (10) for mounting the heat sink to a retention module (60) which surrounds an electronic component (65). The heat sink provides two shoulders (72). Each clip includes a strap (21) supported on one shoulder, a lever (40) having a cam pivotally connected to the strap, two legs (30) pivotally connected to opposite end portions of the strap, and two spring fingers (26) integrally extending from opposite ends of the strap. In assembly, the straps are downwardly pressed and the retention module push the legs to pivot away from the feet from original states toward forced states. When the legs arrive openings of the retention module the fingers urge the legs to enter the openings. The levers are then pivoted to push the straps to move upwardly to thereby cause the legs to firmly engage in the openings.
    Type: Application
    Filed: July 27, 2004
    Publication date: March 3, 2005
    Inventors: Chun-Chi Chen, Xue-Wen Peng, Hsieh Lee, Cheng-Tien Lai, Zhi-Yong Zhou
  • Patent number: 6838193
    Abstract: This invention features a dipyrazolo-pyridine compound of formula (I): each of R1, R2, R3, and R4, independently, is H, alkyl, alkenyl, cycloalkyl, aryl, or heteroaryl; and each of R5 and R6, independently, is aryl or heteroaryl, or R5 and R6, together with the N atom they are attached to, are heteroaryl. The dipyrazolo-pyridine compound can be used in an electro-luminescence device.
    Type: Grant
    Filed: November 14, 2002
    Date of Patent: January 4, 2005
    Assignee: Academia Sinica
    Inventors: Yu-Tai Tao, Chung-Wen Ko, Chang-Hao Chuen, Jing-Wen Peng
  • Patent number: 6773896
    Abstract: The present invention generally provides a method of measuring the biological activity of Coagulation Factor VIIa (Factor VIIa). Specifically, the present invention provides a method for directly measuring the activity of Factor VIIa in a plasma sample. More specifically, the present invention provides a method for utilizing Factor VIIa activity as a bio-marker to monitor Factor VIIa inhibition to screen compounds which are able to inhibit the biological activity of Factor VIIa.
    Type: Grant
    Filed: May 8, 2002
    Date of Patent: August 10, 2004
    Assignee: Warner-Lambert Company
    Inventors: Liguo Chi, Robert Joseph Leadley, Jr., Yun-Wen Peng
  • Patent number: 6663720
    Abstract: A method of prevention maintenance preventing parts of an etcher from being eroded is disclosed. First, a layer of hydrogen-free chemical compound is formed on surface of the parts of the etcher according to one embodiment of the present invention. Otherwise, the parts of the etcher are immersed into a tank containing hydrogen-free chemical compound according to another embodiment of the present invention. After that, a standard process of prevention maintenance is performed by a cleaning agent.
    Type: Grant
    Filed: June 26, 2001
    Date of Patent: December 16, 2003
    Assignee: Mosel Vitelic Inc.
    Inventors: Chiang Wen-Peng, Hsu Ching-Ho
  • Publication number: 20030186082
    Abstract: This invention features a dipyrazolo-pyridine compound of formula (I): 1
    Type: Application
    Filed: November 14, 2002
    Publication date: October 2, 2003
    Inventors: Yu-Tai Tao, Chung-Wen Ko, Chang-Hao Chuen, Jing-Wen Peng
  • Publication number: 20030160930
    Abstract: A method for forming spacers in micro-displays to eliminate dark or white spots is disclosed. The method includes the steps of (1) providing a substrate for each of red, green and blue micro-displays with metallic reflective pads formed on the substrate, the pads being spaced from each other by non-reflective areas; (2) forming a coating of a transparent, non-conductive material on the substrate and over the reflective pads; (3) providing a mask associated with each substrate, each mask having a number of shielded zones that are not corresponding in location to each other; and (4) performing a lithographic operation on the transparent, non-conductive coating of each substrate of step (2) by using the associated mask of step (3) whereby portions of the transparent, non-conductive material that are corresponding to the shielded zones of the mask are left on the substrate, functioning as the spacers.
    Type: Application
    Filed: February 26, 2002
    Publication date: August 28, 2003
    Inventors: Ling-Yuan Tseng, Shang Wen Peng, Kuo Yen Peng
  • Publication number: 20020168700
    Abstract: The present invention generally provides a method of measuring the biological activity of Coagulation Factor VIIa (Factor VIIa). Specifically, the present invention provides a method for directly measuring the activity of Factor VIIa in a plasma sample. More specifically, the present invention provides a method for utilizing Factor VIIa activity as a bio-marker to monitor Factor VIIa inhibition to screen compounds which are able to inhibit the biological activity of Factor VIIa.
    Type: Application
    Filed: May 8, 2002
    Publication date: November 14, 2002
    Inventors: Liguo Chi, Robert Joseph Leadley, Jr., Yun-Wen Peng
  • Publication number: 20020074018
    Abstract: A method of prevention maintenance preventing parts of an etcher from being eroded is disclosed. First, a layer of hydrogen-free chemical compound is formed on surface of the parts of the etcher according to one embodiment of the present invention. Otherwise, the parts of the etcher are immersed into a tank containing hydrogen-free chemical compound according to another embodiment of the present invention. After that, a standard process of prevention maintenance is performed by a cleaning agent.
    Type: Application
    Filed: June 26, 2001
    Publication date: June 20, 2002
    Inventors: Wen-Peng Chiang, Ching-Ho Hsu
  • Patent number: 6375194
    Abstract: An apparatus and related method for preventing leakage of process gases or liquids from a semiconductor wafer processing system, such as an oxidizing furnace. A specific embodiment of the present invention provides a method of preventing leakage of process gases or liquids from a joint of external piping and piping in a semiconductor wafer processing system. The method includes installing as the external piping a tube. The tube has a flange shaped to accommodate an O-ring. The method also includes providing an O-ring for use with the flange, and fastening the O-ring between the flange and the piping with a fastening mechanism to prevent leakage of process gases or liquids from the joint. Yet another embodiment provides a retrofit to existing external piping. A further embodiment provides an apparatus for processing semiconductor substrates that includes use of the O-ring, fastening mechanism and tube with flange.
    Type: Grant
    Filed: August 23, 1996
    Date of Patent: April 23, 2002
    Assignee: Mosel Vitelic, Inc.
    Inventor: Jyh Wen Peng
  • Patent number: D509806
    Type: Grant
    Filed: July 16, 2004
    Date of Patent: September 20, 2005
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Hsieh-Kun Lee, Xue-Wen Peng, Rui-Hua Chen