Abstract: An integrated fan-out package including an integrated circuit, an insulating encapsulation, and a redistribution circuit structure is provided. The integrated circuit includes an active surface, a plurality of sidewalls connected to the active surface, and a plurality of pads distributed on the active surface. The insulating encapsulation encapsulates the active surface and the sidewalls of the integrated circuit. The insulating encapsulation includes a plurality of first contact openings and a plurality of through holes, and the pads are exposed by the first contact openings. The redistribution circuit structure includes a redistribution conductive layer, wherein the redistribution conductive layer is disposed on the insulating encapsulation and is distributed in the first contact openings and the through holes. The redistribution conductive layer is electrically connected to the pads through the first contact openings. A method of fabricating the integrated fan-out package is also provided.

Abstract: A semiconductor arrangement and method of forming the same are described. A semiconductor arrangement includes a third metal connect in contact with a first metal connect in a first active region and a second metal connect in a second active region, and over a shallow trench isolation region located between the first active region and a second active region. A method of forming the semiconductor arrangement includes forming a first opening over the first metal connect, the STI region, and the second metal connect, and forming the third metal connect in the first opening. Forming the third metal connect over the first metal connect and the second metal connect mitigates RC coupling.

Abstract: The present application provides a light guide plate with annular microprism structures and its manufacturing method. The method includes the following steps: A) processing a diamond turning tool of a desired shape according to a shape of a second annular microprism of a light guide plate to be processed; B) turning a surface of a light guide plate mold core by the diamond turning tool, and processing the surface of the light guide plate mold core to form first annular microgrooves, wherein a first annular microprism is formed between two adjacent first annular microgrooves; and C) feeding an acrylic powder material to the light guide plate mold core finished in step B) in an injection molding machine, and performing micro-injection molding to form a light guide plate with second annular microprisms.

Abstract: Apparatus, systems, and methods for remotely dimming lights are disclosed. In one embodiment, a light-dimming apparatus for placement within a lighting enclosure of a lighting fixture is disclosed. The light-dimming apparatus can comprise a plurality of input and output terminals, a dimmer module, one or more motion sensing modules, a fail-safe module, and a microcontroller unit comprising a plurality of wireless communication modules, and one or more processor cores. The one or more processor cores can be programmed to execute instructions to receive a dimming command from another device via at least one of the plurality of wireless communication modules, receive zero-crossing signals from the dimmer module, and transmit switching signals to the dimmer module to modulate the power supplied to the lighting load to dim the brightness of the lighting load.

Abstract: Semiconductor devices and methods of fabricating semiconductor devices are provided. The present disclosure provides a semiconductor device that includes a first fin structure and a second fin structure each extending from a substrate; a first gate segment over the first fin structure and a second gate segment over the second fin structure; a first isolation feature separating the first and second gate segments; a first source/drain (S/D) feature over the first fin structure and adjacent to the first gate segment; a second S/D feature over the second fin structure and adjacent to the second gate segment; and a second isolation feature also disposed in the trench. The first and second S/D features are separated by the second isolation feature, and a composition of the second isolation feature is different from a composition of the first isolation feature.

Abstract: A method and device for processing a packet are provided in this disclosure. According to an example of the method, an HTTPS packet is received from a user host, and a non-online user session entry matching the HTTPs packet is searched for according to a source IP address and a destination IP address of the HTTPS packet. In case that the non-online user session entry is found, a token is obtained from a first token bucket if determining that a user session corresponding to the non-online user session entry has no token, where the number of tokens in the first token bucket is set based on processing capability of a CPU of the access gateway device. When the token is successfully obtained, the HTTPS packet is sent to the CPU for processing. When the token has failed to be obtained, the HTTPS packet is abandoned.

Abstract: A method includes providing a structure that includes a substrate; first and second gate structures over the substrate; first and second source/drain (S/D) features over the substrate; a first dielectric layer over sidewalls of the first and second gate structures and the first and second S/D features; and a second dielectric layer over the first dielectric layer. The first and second S/D features are adjacent to the first and second gate structures respectively. The first and second S/D features comprise different materials. The method further includes etching the first and second dielectric layers to expose the first and second S/D features; doping a p-type dopant to the first and second S/D features; and performing a selective etching process to the first and second S/D features after the doping of the p-type dopant. The selective etching process recesses the first S/D feature faster than it recesses the second S/D feature.

Abstract: A computer housing including a plurality of panels including a front panel, a top panel, a rear panel, a bottom panel, a left panel, and a right panel coupled together to form the computer housing. The computer housing also includes a beveled portion disposed between at least one of (i) the front panel and the top panel, (ii) the top panel and the rear panel, (iii) the rear panel and the bottom panel, and (iv) the bottom panel and the front panel, and at least two engagement members disposed in each corner of the computer housing. At least one engagement member is disposed in the beveled portion and the at least two engagement members are disposed at a same distance from each other in each corner. The computer housing further includes a supporting member removably attached to each beveled portion.

Abstract: A method includes aligning a first electrical connector of a first package component to a second electrical connector of a second package component. With the first electrical connector aligned to the second electrical connector, a metal layer is plated on the first and the second electrical connectors. The metal layer bonds the first electrical connector to the second electrical connector.

Abstract: A touch panel including a touch region, a border region, a signal transmission device, and a light transmission pattern is provided. The border region is disposed on at least one side of the touch region. The signal transmission device is disposed in the border region. The light transmission pattern is disposed in the border region. The light transmission pattern partially overlaps the signal transmission device along a vertical projection direction. The signal transmission device includes at least one transparent conducting line. The transparent conducting line overlaps partial the light transmission pattern in the vertical projection direction.

Abstract: Provided are chimeric arginine deiminases, including pegylated chimeric arginine deiminases, and related compositions and methods of use thereof, including methods of treating cancer.

Abstract: A via or pillar structure, and a method of forming, is provided. In an embodiment, a polymer layer is formed having openings exposing portions of an underlying conductive pad. A conductive layer is formed over the polymer layer, filling the openings. The dies are covered with a molding material and a planarization process is performed to form pillars in the openings. In another embodiment, pillars are formed and then a polymer layer is formed over the pillars. The dies are covered with a molding material and a planarization process is performed to expose the pillars. In yet another embodiment, pillars are formed and a molding material is formed directly over the pillars. A planarization process is performed to expose the pillars. In still yet another embodiment, bumps are formed and a molding material is formed directly over the bumps. A planarization process is performed to expose the bumps.

Abstract: A method of forwarding a packet and a network device are provided. According to an example of the method, when serving as a previous-hop device of a destination device of a first tunnel, the network device receives a first notification message from the destination device of the first tunnel, where information relating the first tunnel is carried in the first notification message. The network device configures a forwarding entry, where a match domain of the forwarding entry includes the information relating the first tunnel. After an encapsulated data packet is received, and if the encapsulated data packet matches the forwarding entry, the network device decapsulates the encapsulated data packet and then forwards the decapsulated data packet to the destination device of the first tunnel.

Abstract: An integrated fan-out package includes a die, an insulating encapsulation, a redistribution circuit structure, conductive terminals, and barrier layers. The insulating encapsulation encapsulates the die. The redistribution circuit structure includes a first redistribution conductive layer on the insulating encapsulation, a first inter-dielectric layer covering the first redistribution conductive layer, and a second redistribution conductive layer on the first inter-dielectric layer. The first redistribution conductive layer includes conductive through vias extending from a first surface of the insulating encapsulation to a second surface of the insulating encapsulation. The first inter-dielectric layer includes contact openings, portions of the second redistribution conductive layer filled in the contact openings are in contact with the first redistribution conductive layer and offset from the conductive through vias.

Abstract: The present invention is related to an UV LED curing apparatus, and more particularly, to an UV LED curing apparatus with improved housing and switch controller. The light reflective inner casing is preferably provided as an effective UV light reflector and as a supporting substrate of the UV LED light source while being capable of transmitting heat from the UV LED light source away for further heat dissipation to the ambient by the outer casing. The outer casing is detachably attached to the inner casing and allows a greater user interaction for decorative and entertainment purposes while also being a protective and heat dissipation means.

Abstract: A semiconductor device and method of manufacturing is provided, whereby a support structure is utilized to provide additional support for a conductive element in order to eliminate or reduce the formation of a defective surface such that the conductive element may be formed to have a thinner structure without suffering deleterious structures.

Abstract: A bottom emission microLED display includes a microLED disposed above a transparent substrate; a light guiding layer surrounding the microLED to controllably guide light generated by the microLED towards the transparent substrate; and a reflecting layer formed over the light guiding layer to reflect the light generated by the microLED downwards and to confine the light generated by the microLED to prevent the light from leaking upwards or sidewards.

Abstract: A method and system for motion estimation modeling for cardiac and respiratory motion compensation is disclosed. Specifically, a coronary sinus catheter is tracked in a plurality of frames of a fluoroscopic image sequence; and cardiac and respiratory motion of a left atrium is estimated in each of the plurality of frames based on tracking results of the coronary sinus catheter using a trained motion estimation model.

Abstract: An apparatus may include a connector configured to receive an information handling resource, and a riser configured to provide mechanical support to the information handling resource when the information handling resource is received in the connector, wherein the riser is configured to accept a first type of information handling resource having a first length along a selected direction, and a second type of information handling resource having a second length along the selected direction, the second length being greater than the first length. The riser may include a fixed portion, and a rear portion rotatably coupled to the fixed portion, the rear portion including a slidable member configured to slide from a first position to a second position along the selected direction, the first position allowing the riser to accept the first type, and the second position allowing the riser to accept the second type of information handling resource.

Abstract: A semiconductor arrangement and method of forming the same are described. A semiconductor arrangement includes a third metal connect in contact with a first metal connect in a first active region and a second metal connect in a second active region, and over a shallow trench isolation region located between the first active region and a second active region. A method of forming the semiconductor arrangement includes forming a first opening over the first metal connect, the STI region, and the second metal connect, and forming the third metal connect in the first opening. Forming the third metal connect over the first metal connect and the second metal connect mitigates RC coupling.