Abstract: A preliminary positioning method for a TPMS uses a receiver to receive a tire pressure signal, then obtains the ID code contained in the obtained tire pressure signal, then compares the ID code with the corresponding ID codes stored in the database, and defines the ID code as a known ID code, when the ID code is found to match with one of the corresponding ID codes prestored in the database. Repeating the above steps until the ID codes of all received tire pressure signals all have been compared. If the number of the known ID codes is equal to the number of the sensors, the known ID codes are designated as specific tires according to an indication of the respective tire pressure signals, so that the positioning function can be achieved in a short period of time.

Abstract: A method of transmitting a BGP message and a routing device are provided. According to an example of the method, a queue for holding BGP messages to be transmitted is partitioned into more than two subqueues according to types of BGP routes, where each of the subqueues is used to hold a BGP message carrying a corresponding type of BGP route. A BGP message carrying a BGP route to be advertised is placed into one of the more than two subqueues according to the type of the BGP route. A target subqueue is selected from the more than two subqueues according to a first scheduling algorithm, and a BGP message in the target subqueue is transmitted.

Abstract: Embodiments of the present disclosure relate to a method for I/O data transmission in a Hyper-Converged Storage System (HCSS). The HCSS comprises at least one storage node having at least one device constructed with virtualization technology and a storage I/O processing module for accessing persistent storage resource of the HCSS. According to the method, an I/O request of a first type is received from the device by a System Disk front-end driver (SFD), wherein the I/O request of the first type is an I/O request to a system disk of the device. The I/O request of the first type and its corresponding response of a first type are transferred by the SFD between the device and the storage I/O processing module via a first shared memory, wherein the first shared memory is created by allocating a first memory region of the HCSS as the first shared memory.

Abstract: The present invention provides an exchangeable-battery photocuring device, comprising a supporting frame, having a plurality of walls, wherein the plurality of walls constitutes a chamber having at least one opening; a UV LED module, disposed on the supporting frame; a outer housing, having an external opening corresponding to the opening of the supporting frame; a control module; an exchangeable battery module, disposed on the supporting frame, wherein the exchangeable battery module comprises a battery holder and a battery, and the exchangeable battery module is electrically connected to the control module, and a handle. The present invention applying an exchangeable battery module achieves that the photocuring device is used without being constrained by location and space. Furthermore, the present invention also provides an exchangeable-battery photocuring device with a slidable lid and a portable battery photocuring device with a slidable lid.

Abstract: Formation methods of a semiconductor device structure are provided. A method includes forming a dielectric layer over a first conductive feature and a second conductive feature. The method also includes depositing a conformal layer in a first via hole and a second via hole in the dielectric layer. The method further includes removing the conformal layer in the second via hole. The dielectric layer remains covered by the conformal layer in the first via hole. In addition, the method includes etching the conformal layer in the first via hole and the dielectric layer until the first conductive feature and the second conductive feature become exposed through the first via hole and the second via hole, respectively. The method also includes forming a third conductive feature in the first via hole and a fourth conductive feature in the second via hole.

Abstract: Embodiments are directed to classifying barcode tag conditions on sample tubes from top view images to streamline sample tube handling in advanced clinical laboratory automation systems. The classification of barcode tag conditions leads to the automatic detection of problematic barcode tags, allowing for a user to take necessary steps to fix the problematic barcode tags. A vision system is utilized to perform the automatic classification of barcode tag conditions on sample tubes from top view images. The classification of barcode tag conditions on sample tubes from top view images is based on the following factors: (1) a region-of-interest (ROI) extraction and rectification method based on sample tube detection; (2) a barcode tag condition classification method based on holistic features uniformly sampled from the rectified ROI; and (3) a problematic barcode tag area localization method based on pixel-based feature extraction.

Abstract: A method for detecting properties of sample tubes is provided that includes extracting image patches substantially centered on a tube slot of a tray or a tube top in a slot. For each image patch, the method may include assigning a first location group defining whether the image patch is an image center, a corner of an image or a middle edge of an image, selecting a trained classifier based on the first location group and determining whether each tube slot contains a tube. The method may also include assigning a second location group defining whether the image patch is from an image center, a left corner of the image, a right corner of the image, a left middle of the image; a center middle of the image or a right middle of the image, selecting a trained classifier based on the second location group and determining a tube property.

Abstract: A synchronous backlight device and an operation method thereof are provided. The synchronous backlight device includes a pulse width modulation (PWM) control circuit and a backlight driving circuit. The PWM control circuit receives the video sync information from a video processing circuit and generates a PWM control signal. Wherein, the video sync information defines a plurality of video frame periods, the PWM control circuit at least divides each of the video frame periods into a first period and a second period, the lengths of the first periods of the video frame periods are equal to one another. The frequency of the PWM control signal in the first periods is different from the frequency of the PWM control signal in the second periods. The backlight driving circuit drives the backlight source of a display panel in accordance with the PWM control signal.

Abstract: A circuit arrangement for controlling a backlight source and an operation method are provided. The circuit arrangement includes a generator. The generator receives a sync signal and generates a pulse width modulation signal synchronous with the sync signal to control the backlight source. The sync signal indicates a frequency of a video including a series of image frames. The sync signal includes a sync period corresponding to a frame of the video. The pulse width modulation signal includes a first waveform pattern in a first sub-period of the sync period and a second waveform pattern in a second sub-period of the sync period. Each of the first waveform pattern and the second waveform pattern includes at least one active pulse. The first waveform pattern is substantially identical to the second waveform pattern.

Abstract: Apparatus, systems, and methods for remotely dimming lights are disclosed. In one embodiment, a light-dimming apparatus for placement within a lighting enclosure of a lighting fixture is disclosed. The light-dimming apparatus can comprise an AC live input terminal, an AC neutral input terminal, an AC live output terminal, an AC neutral output terminal, a dimmer module, one or more motion sensing modules, and a microcontroller unit comprising a plurality of wireless communication modules, and one or more processor cores. The one or more processor cores can be programmed to execute instructions to receive a dimming command from another device via at least one of the plurality of wireless communication modules, receive zero-crossing signals from the dimmer module, and transmit switching signals to the dimmer module to modulate the power supplied to the lighting load to dim the brightness of the lighting load.

Abstract: Semiconductor devices and methods of fabricating semiconductor devices are provided. The present disclosure provides a semiconductor device that includes a first fin structure and a second fin structure each extending from a substrate; a first gate segment over the first fin structure and a second gate segment over the second fin structure; first isolation feature separating the first and second gate segments; a first source/drain (S/D) feature over the first fin structure and adjacent to the first gate segment; a second S/D feature over the second fin structure and adjacent to the second gate segment; and a second isolation feature also disposed in the trench. The first and second S/D features are separated by the second isolation feature, and a composition of the second isolation feature is different from a composition of the first isolation feature.

Abstract: A semiconductor device and method of manufacturing is provided, whereby a support structure is utilized to provide additional support for a conductive element in order to eliminate or reduce the formation of a defective surface such that the conductive element may be formed to have a thinner structure without suffering deleterious structures.

Abstract: Provided is an integrated fan-out package including a die, an insulating encapsulation, a redistribution circuit structure, a conductive terminal, and a barrier layer. The die is encapsulated by the insulating encapsulation. The redistribution circuit structure includes a redistribution conductive layer. The redistribution conductive layer is disposed in the insulating encapsulation and extending from a first surface of the insulating encapsulation to a second surface of the insulating encapsulation. The conductive terminal is disposed over the second surface of the insulating encapsulation. The barrier layer is sandwiched between the redistribution conductive layer and the conductive terminal. A material of the barrier layer is different from a material of the redistribution conductive layer and a material of the conductive terminal. A method of fabricating the integrated fan-out package is also provided.

Abstract: The present disclosure is directed to a semiconductor structure that includes a semiconductor substrate. A first interconnect layer is disposed over the semiconductor substrate. The first interconnect layer includes a first dielectric material having a conductive body embedded therein. The conductive body includes a first sidewall, a second sidewall, and a bottom surface. A spacer element has a sidewall which contacts the first sidewall of the conductive body and which contacts the bottom surface of the conductive body. A second interconnect layer overlies the first interconnect layer and includes a second dielectric material with at least one via therein. The at least one via is filled with a conductive material which is electrically coupled to the conductive body of the first interconnect layer.

Abstract: Embodiments provide a method of using image-based tube top circle detection that includes extracting, from one of a series of images of a tube tray, a region of interest (ROI) patch having a target tube top circle and boundaries constrained by two dimensional (2D) projections of different types of tube top circle centers. The method also includes calculating an edge gradient magnitude map of the ROI patch and constructing a three dimensional (3D) map of a circle parameter space, each location in the 3D map corresponding to a circle parameter having a center location and a diameter. The method further includes accumulating weighted votes in the 3D map from edge points in the edge gradient magnitude map along edge point gradient directions, determining locations in the 3D map as circle candidates based on the accumulated votes and selecting a target tube top circle based on the greatest accumulated votes.

Abstract: An intelligent hybrid touch display device, including: a touch display unit; a rotary mechanical switch, being integrated with the touch display unit in a body; and a control unit, located in the body and including: a first interface for driving the touch display unit; a second interface coupled with the rotary mechanical switch; a touch and switch detection unit coupled with the first interface and the second interface; a transmission interface for communicating with at least one external device; and a processor and an operating system stored in a memory, the processor being coupled with the touch and switch detection unit and the transmission interface, and being used for executing a control program with a support of the operating system, so that the touch display unit and the rotary mechanical switch can cooperate to provide a hybrid operation for selecting, changing or activating function options.

Abstract: A semiconductor arrangement and method of forming the same are described. A semiconductor arrangement includes a third metal connect in contact with a first metal connect in a first active region and a second metal connect in a second active region, and over a shallow trench isolation region located between the first active region and a second active region. A method of forming the semiconductor arrangement includes forming a first opening over the first metal connect, the STI region, and the second metal connect, and forming the third metal connect in the first opening. Forming the third metal connect over the first metal connect and the second metal connect mitigates RC coupling.

Abstract: An electronic device including a casing, a circuit board and a dipole antenna structure is provided. The circuit board is disposed in the casing and includes a ground end. The dipole antenna structure is disposed in the casing and includes a feeding end, a first radiator and a second radiator. The first radiator is connected to the feeding end, and the second radiator is connected to the ground end. The first radiator and the second radiator are mirror symmetrical to each other with respect to the feeding end. A length of a short side of the circuit board is less than a length of the first radiator, and the length of the short side of the circuit board is less than a length of the second radiator.

Abstract: A method for real-time collimation and ROI-filter positioning in X-ray imaging in interventional procedures includes acquiring an image of a region-of-interest (ROI) at a beginning of a medical intervention procedure on a subject, classifying the image based on low-level features in the image to determine a type of procedure being performed, determining a list of landmarks in the image from the type of procedure being performed, and loading a pre-trained landmark model for each landmark in the list of landmarks, where landmarks include anatomical structures of the subject and medical devices being used in the medical intervention procedure, and computing collimator settings of an X-ray imaging device from ROI filter margins and bounding boxes of the landmarks calculated using the landmark models.

Abstract: Methods of patterning a target material layer are provided herein. The method includes steps of positioning a semiconductor wafer having the target material layer thereon in an etch chamber and of providing a flow of etch gases into the etch chamber, the flow of etch gases etchant gas comprising a plurality of gases. The semiconductor wafer has a patterned hardmask feature formed from a compound on the target material layer. The method also includes steps of etching the target material layer using the patterned hardmask feature as a mask feature, wherein one of the gases chemically alters the patterned hardmask feature and at least one of the gases chemically repairs the patterned hardmask feature so that the patterned hardmask feature retains its dimensions during the etching. Associated semiconductor wafer are also provided herein.