Patents by Inventor Wen Wu

Wen Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • DRIVING CIRCUIT AND TOUCH DISPLAY CAPABLE OF ENABLING A DISPLAY STRUCTURE TO PROVIDE A TOUCH FUNCTION
    Publication number: 20140160058
    Abstract: A driving circuit capable of enabling a display structure to provide a touch function, including: a first multiplexing interface for coupling with multiple gate driving lines; a second multiplexing interface for coupling with at least one storage capacitor driving line; a third multiplexing interface for coupling with multiple source driving lines; a fourth multiplexing interface for coupling with multiple transparent electrodes; and a control unit for driving the gate driving lines via the first multiplexing interface to form a capacitive network on a TFT display structure, and performing a capacitive touch detection procedure on the capacitive network via an interface selected from a group consisting of the second multiplexing interface, the third multiplexing interface, the fourth multiplexing interface, and any combination thereof.
    Type: Application
    Filed: February 26, 2013
    Publication date: June 12, 2014
    Applicant: RICH IP TECHNOLOGY INC.
    Inventors: Han-Chang CHEN, Yen-Hung TU, Chung-Lin CHIA, Chih-Wen WU
  • Soft material wafer bonding and method of bonding
    Patent number: 8748885
    Abstract: A semiconductor device including a first wafer assembly having a first substrate and a first oxide layer over the first substrate. The semiconductor device further includes a second wafer assembly having a second substrate and a second oxide layer over the second substrate. The first oxide layer and the second oxide layer are bonded together by van der Waals bonds or covalent bonds. A method of bonding a first wafer assembly and a second wafer assembly including forming a first oxide layer over a first substrate. The method further includes forming a second oxide layer over a second wafer assembly. The method further includes forming van der Waals bonds or covalent bonds between the first oxide layer and the second oxide layer.
    Type: Grant
    Filed: February 10, 2012
    Date of Patent: June 10, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tung-Ti Yeh, Chung-Yi Huang, Ya Wen Wu, Hui Mei Jao, Ting-Chun Wang, Shiu-Ko JangJian, Chia-Hung Chung
  • Optical adapter and optical signal transmission device including same
    Patent number: 8750656
    Abstract: An optical adapter includes a loading plate and a coupling lens. The coupling lens includes a main body, a first optical reflector, and a second optical reflector. The first optical reflector is positioned on the loading plate. The main body includes a top plate made of transparent material and spaced a predetermined distance from the loading plate. The second optical reflector is positioned on the first top plate. The first loading plate loads a portion of a planar optical waveguide of an optical printed circuit board. An optical signal from the planar optical waveguide is reflected by the first optical reflector to the second optical reflector, then is reflected by the second optical reflector to the outside of the optical adapter.
    Type: Grant
    Filed: July 30, 2012
    Date of Patent: June 10, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Kai-Wen Wu
  • DATA ERROR-DETECTION SYSTEM AND METHOD THEREOF
    Publication number: 20140157076
    Abstract: The present invention discloses a data error-detection system and the method thereof. The system includes an initializing module, an encoding module, a decoding module and a restoring module. The initializing module arranges the transmitting data in a 3D matrix to produce information data. The encoding module encodes the information data to produce checking data, and outputs encoding data which includes information data and checking data. The decoding module receives encoding data and detects information data according to the checking data to correct the information data and then produces 3D matrix receiving data. The restoring module produces receiving data according to the 3D matrix receiving data. Herewith, the effect of error-detection and correction of the data can be achieved.
    Type: Application
    Filed: March 15, 2013
    Publication date: June 5, 2014
    Applicant: NATIONAL TSING HUA UNIVERSITY
    Inventors: SHU-YU WU, CHENG-WEN WU
  • OPTICAL COMMUNICATION MODULE
    Publication number: 20140151536
    Abstract: An optical communication module includes a lens unit and an optical-electrical converter. The optical-electrical converter includes a circuit board and the lens unit is fixed on the circuit board. The lens unit has an extension portion, and the extension portion extends outwards from the lens unit and is parallel to the circuit board. Glue is located between the extension portion and the circuit board to secure the lens unit on the circuit board.
    Type: Application
    Filed: April 30, 2013
    Publication date: June 5, 2014
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: KAI-WEN WU
  • High-frequency transmission module and optical connector having stacked chips connected via wire bonding
    Patent number: 8740475
    Abstract: A high-frequency transmission module includes a first chip, a second chip, and a conductive wire. The first chip includes a first top surface and a number of pads arranged along a periphery of the first top surface. The pads include a first bonding pad. The second chip includes a second top surface and a second bonding pad on the second top surface. The second chip is positioned on the first top surface such that the pads are uncovered by the second chip and the second bonding pad is mostly closed to the first bonding pad. The conductive wire bonds to the first bonding pad and the second bonding pad to electrically connect the second chip to the first chip and is configured to transmit high-frequency signals between the first chip and the second chip.
    Type: Grant
    Filed: July 22, 2012
    Date of Patent: June 3, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Kai-Wen Wu
  • Double through silicon via structure
    Patent number: 8742839
    Abstract: This invention discloses a double Through Silicon Via (TSV) structure, including a first die unit, a first signal path, a second signal path, a receiving unit and a second die unit. The first and the second signal paths respectively include a driving unit and a TSV unit. Each driving unit includes a first end, a second end and a third end. The invention divides the signal paths of the conventional double TSV into two different signal paths by two driving units and the receiving unit having OR gate or NOR gate, to avoid generating the problem of signal degradation from the TSV unit with short defect. The invention further disposes a first switch unit, a second switch unit, a first exchange unit, a second exchange unit, a first VDD keeper and a second VDD keeper, to avoid generating the problems of open defect and leakage current.
    Type: Grant
    Filed: December 14, 2012
    Date of Patent: June 3, 2014
    Assignee: National Tsing Hua University
    Inventors: Hsiu-Chuan Shih, Cheng-Wen Wu
  • WOUND DRAINAGE THERAPY SYSTEM
    Publication number: 20140148768
    Abstract: A wound drainage therapy system includes a wound seal unit, a fluid collector unit, a vacuum driving unit and an actuator. The fluid collector unit is detachably connected with the wound seal unit, and the fluid collector unit has a multiple-pipe integration module and a collection bag. The multiple-pipe integration module has a first row connection port group and a second row connection port group. The vacuum driving unit has a vacuum generator. The actuator has a motor, a negative pressure detector and a positive pressure detector, wherein the motor is used to drive the vacuum generator to operate and the motor is detachably connected with the vacuum generator. A connection port of the negative pressure detector and a connection port of the positive pressure detector are detachably connected with another two connection ports of the second row connection port group respectively.
    Type: Application
    Filed: November 26, 2012
    Publication date: May 29, 2014
    Applicant: APEX MEDICAL CORP.
    Inventors: Nan-Kuang YAO, Luo-Hwa MIAO, Jhy-Wen WU, Yu-Yi CHIEN, Li-Ling LI, Chih-Tsan CHIEN
  • Method and apparatus for encoding and/or decoding video data using enhancement layer residual prediction for bit depth scalability
    Patent number: 8737474
    Abstract: A scalable video bitstream may have an H.264/AVC compatible base layer and a scalable enhancement layer, where scalability refers to color bit depth. The H.264/AVC scalability extension SVC provides also other types of scalability, e.g. spatial scalability where the number of pixels in BL and EL are different. According to the invention, BL information is upsampled in two logical steps, one being texture upsampling and the other being bit depth upsampling. Texture upsampling is a process that increases the number of pixels, and bit depth upsampling is a process that increases the number of values that each pixel can have, corresponding to the pixels color intensity. The upsampled BL data are used to predict the collocated EL. The BL information is upsampled at the encoder side and in the same manner at the decoder side, wherein the upsampling refers to spatial and bit depth characteristics.
    Type: Grant
    Filed: June 27, 2007
    Date of Patent: May 27, 2014
    Assignee: Thomson Licensing
    Inventors: Yong Ying Gao, Yu Wen Wu, Charles Chuanming Wang
  • Chip package and method for assembling chip package
    Patent number: 8736078
    Abstract: A chip package includes a PCB, a connecting pad fixed on a surface of the PCB and a chip fixed on the connecting pad. The connecting pad includes a first metal film on its surface facing away from the PCB. The chip includes a second metal film formed on its surface opposite to the PCB. The first and the second metal are connected to each other via a eutectic manner.
    Type: Grant
    Filed: June 27, 2012
    Date of Patent: May 27, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Kai-Wen Wu
  • Forming wafer-level chip scale package structures with reduced number of seed layers
    Patent number: 8735273
    Abstract: A method includes forming a passivation layer over a metal pad, which is overlying a semiconductor substrate. A first opening is formed in the passivation layer, with a portion of the metal pad exposed through the first opening. A seed layer is formed over the passivation layer and to electrically coupled to the metal pad. The seed layer further includes a portion over the passivation layer. A first mask is formed over the seed layer, wherein the first mask has a second opening directly over at least a portion of the metal pad. A PPI is formed over the seed layer and in the second opening. A second mask is formed over the first mask, with a third opening formed in the second mask. A portion of a metal bump is formed in the third opening. After the step of forming the portion of the metal bump, the first and the second masks are removed.
    Type: Grant
    Filed: July 8, 2011
    Date of Patent: May 27, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wen-Hsiung Lu, Ming-Da Cheng, Chih-Wei Lin, Yi-Wen Wu, Hsiu-Jen Lin, Chung-Shi Liu, Mirng-Ji Lii, Chen-Hua Yu
  • CIRCUIT BOARD AND OPTICAL-ELECTRICAL MODULE WITH SAME
    Publication number: 20140140667
    Abstract: A circuit board includes a mounting surface and a number of connecting pads on the mounting surface. Each of the connecting pads defines a mounting area for mounting an element thereon. At least two of the connecting pads are substantially circular-shaped.
    Type: Application
    Filed: April 30, 2013
    Publication date: May 22, 2014
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: KAI-WEN WU
  • CIRCUIT BOARD WITH SIGNAL ROUTING LAYER HAVING CONSISTENT IMPEDANCE
    Publication number: 20140138127
    Abstract: A circuit board includes a dielectric layer and a signal routing layer on the dielectric layer. The signal routing layer includes chip traces, connector traces, and signal traces connected with the chip traces and the connector traces. The dielectric layer includes a signal trace area for arraying the signal traces, a chip trace area for arraying the chip traces, and a connector trace area for arraying the connector traces. The dielectric coefficient of the signal trace area is smaller than the dielectric coefficient of the chip trace area and greater than the dielectric coefficient of the connector trace area.
    Type: Application
    Filed: February 1, 2013
    Publication date: May 22, 2014
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: KAI-WEN WU
  • LIGHT SOURCE USING LASER DIODES
    Publication number: 20140133798
    Abstract: A light source includes a base, a first bonding layer, at least two laser diodes, a second bonding layer, a substrate, and a planer waveguide. The laser diodes are fixed to and are electrically connected to the base using the first bonding layer, and each of the laser diodes includes a side surface for emitting light. The substrate is fixed to the base using the second bonding layer. The waveguide is formed on the substrate and includes an output section including an output end and at least two input branches branching off from an end of the output section opposite to the output end. Each of the input branches includes an input end opposite to the output section and aligning with a respective one of the side surfaces of the at least two laser diodes.
    Type: Application
    Filed: May 24, 2013
    Publication date: May 15, 2014
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: KAI-WEN WU
  • Circuit board assembly having optical transceivers for signal transmission
    Patent number: 8724940
    Abstract: A circuit board assembly includes a first circuit board, and a second circuit board, a first optical transceiver, a number of first light wave guides, a second optical transceiver, and a number of second light wave guides. The first circuit board defines a number of first through holes. The second circuit board defines a number of second and third through holes. Each of the third through holes is aligned with a respective first though hole. The first optical transceiver is optically coupled with the second through holes. The first light wave guides are mounted on one surface of the first circuit board and optically coupled with the second through holes. The second optical transceiver is optically coupled with the third through holes. The second light wave guides are mounted on another surface of the first circuit board and are optically coupled with the first through holes.
    Type: Grant
    Filed: August 2, 2012
    Date of Patent: May 13, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Kai-Wen Wu
  • Optical fiber connector assembly
    Patent number: 8721189
    Abstract: An optical fiber connector assembly includes a first, and second plug connectors, and a socket connector. The first plug connector includes a first main portion and a first plate with a first front surface defining alignment holes. A first distance is defined between the first front surface and the first main portion. The second plug connector includes a second main portion and a second plate with a second front surface. A second distance is defined between the second front surface and the second main portion. The socket connector includes a side surface defining a recess with a bottom surface. A third distance is defined between the side surface and the bottom surface. Alignment pins extend from the bottom surface. The length of each alignment pin is defined as a fourth distance. The third distance is equal to the first distance and greater than sum of the second and fourth distances.
    Type: Grant
    Filed: April 13, 2012
    Date of Patent: May 13, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Kai-Wen Wu
  • LIGHT SOURCE MODULE INCORPORATING LASER LIGHT SOURCE
    Publication number: 20140119017
    Abstract: A light source module includes a laser light source, and an optical lens facing the laser light source. The optical lens includes a first light reflecting face, a second light reflecting face facing the first light reflecting face, a light incident face connecting the first light reflecting face and the second light reflecting face, and a light emitting face opposite to the light incident face. Light emitted from the laser light source is firstly reflected to the second reflecting face by the first reflecting face, then reflected to the light incident face by the second reflecting face, and then entered into the optical lens from the light incident face, and transmitted in the optical lens, finally exited from the light emitting face.
    Type: Application
    Filed: August 21, 2013
    Publication date: May 1, 2014
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: KAI-WEN WU
  • ACIDOGENIC CLOSTRIDIA AND PROCESSES OF USING THEREOF FOR PRODUCING VOLATILE FATTY ACIDS
    Publication number: 20140120591
    Abstract: An isolated biologically pure culture of Clostridium tyrobutyricum ITRI04001 or an isolated biologically pure culture of Clostridium tyrobutyricum having the genotypic characteristics of ITRI04001 useful for syngas fermentation. Volatile free acids are produced by a method comprising culturing a microorganism having the genotypic characteristics of ITRI04001 in a medium; providing at least one substrate comprising at least one carbon source chosen from CO and CO2 to the microorganism; and recovering at least one free volatile free acid. Syngas can be the at least one substrate in these processes for producing volatile free acids.
    Type: Application
    Filed: October 2, 2013
    Publication date: May 1, 2014
    Applicant: Industrial Technology Research Institute
    Inventors: Chang-Chieh Chen, Yi-Te Chou, Shao-Wen Wu, Shi-Chan Tseng, Hsin-Tzu Kuo, Wan-Ting Ma
  • Resistive switching memory element including doped silicon electrode
    Patent number: 8698121
    Abstract: A resistive switching memory is described, including a first electrode comprising doped silicon having a first work function, a second electrode having a second work function that is different from the first work function by between 0.1 and 1.0 electron volts (eV), a metal oxide layer between the first electrode and the second electrode, the metal oxide layer switches using bulk-mediated switching using unipolar or bipolar switching voltages for switching from a low resistance state to a high resistance state and vice versa.
    Type: Grant
    Filed: July 3, 2013
    Date of Patent: April 15, 2014
    Assignee: Intermolecular, Inc.
    Inventors: Prashant B. Phatak, Tony P. Chiang, Michael Miller, Wen Wu
  • Techniques for updating filter coefficients of an adaptive filter
    Patent number: 8693677
    Abstract: A technique for updating filter coefficients of an adaptive filter includes filtering a signal with an adaptive filter, whose filter coefficients are grouped into filter blocks. In this case a number of the filter blocks is less than or equal to a number of the filter coefficients. During each update period, the filter coefficients for less than all of the filter blocks are updated based on a network echo path impulse response.
    Type: Grant
    Filed: April 27, 2010
    Date of Patent: April 8, 2014
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Hongyang Deng, Roman A. Dyba, Wen Wu Su