Abstract: A coupling element, an injection molding object with the coupling element implanted therein are provided. The coupling element has two reversely extended fixing ribs. The injection mold has a first mold and a second mold. The first mold has a first molding cavity and two positioning blocks separated by the first molding cavity. The second mold has a second molding cavity. When the first mold and the second mold are shut together and their molding cavities combine to define a closed room, the positioning blocks hold the coupling element by clamping the fixing ribs so the coupling element is suspended in midair of the closed room.

Abstract: Packaging devices and packaging methods are disclosed. In some embodiments, a method of manufacturing a packaging device includes forming a plurality of through-substrate vias (TSVs) in an interposer substrate. The interposer substrate is recessed or a thickness of the plurality of TSVs is increased to expose portions of the plurality of TSVs. A conductive ball is coupled to the exposed portion of each of the plurality of TSVs.

Abstract: This invention discloses a double Through Silicon Via (TSV) structure, including a first die unit, a first signal path, a second signal path, a receiving unit and a second die unit. The first and the second signal paths respectively include a driving unit and a TSV unit. Each driving unit includes a first end, a second end and a third end. The invention divides the signal paths of the conventional double TSV into two different signal paths by two driving units and the receiving unit having OR gate or NOR gate, to avoid generating the problem of signal degradation from the TSV unit with short defect. The invention further disposes a first switch unit, a second switch unit, a first exchange unit, a second exchange unit, a first VDD keeper and a second VDD keeper, to avoid generating the problems of open defect and leakage current.

Abstract: An image processing circuit and a light illumination module are provided. The light illumination module has an integrated circuit and a plurality of light emitting diode (LED) strings connected in parallel. The integrated circuit could be the image processing circuit. Each of the LED strings has a plurality of LEDs connected in series. The integrated circuit has a driving circuit coupled to the LED strings. The driving circuit supplies a driving voltage to first ends of the LED strings to drive the LED strings. The driving circuit is also configured to maintain a voltage value of the driving voltage obtained while all of the strings of the light emitting diodes are turned on, until all of the LED strings are turned on again. Accordingly, the interference of the LED strings is decreased, and the LED strings operate more stably.

Abstract: A method and system for detecting a virtual electrode (VE) on a coronary sinus (CS) catheter in a fluoroscopic image sequence is disclosed. User inputs indicating locations of CS catheter electrodes and a location of a VE are received. A catheter electrode model and a VE part model is initialized in a first frame of the fluoroscopic image sequence. The VE is tracked by detecting electrode position candidates and catheter body point candidates in the subsequent frames of the fluoroscopic image sequence using respective trained detectors, tracking the catheter electrode model in the subsequent frames based on the detected electrode position candidates, generating VE part hypotheses in the subsequent frames based on detection of the most proximal electrode (MPE) in each subsequent frame, calculating a probability score for each of the VE part hypotheses, and selecting an VE part hypothesis with the highest probability score.

Abstract: A semiconductor package includes a semiconductor substrate, a contact pad overlying the semiconductor substrate, an interconnect layer overlying the contact pad, a passivation layer formed between the contact pad and the interconnect layer, a bump overlying the interconnect layer, and a protection layer overlying the interconnect layer and the passivation layer and covering a lower portion of the bump. The protection layer includes a curved surface region.

Abstract: The mechanism of forming a metal bump structure described above resolves the delamination issues between a conductive layer on a substrate and a metal bump connected to the conductive layer. The conductive layer can be a metal pad, a post passivation interconnect (PPI) layer, or a top metal layer. By performing an in-situ deposition of a protective conductive layer over the conductive layer (or base conductive layer), the under bump metallurgy (UBM) layer of the metal bump adheres better to the conductive layer and reduces the occurrence of interfacial delamination. In some embodiments, a copper diffusion barrier sub-layer in the UBM layer can be removed. In some other embodiments, the UBM layer is not needed if the metal bump is deposited by a non-plating process and the metal bump is not made of copper.

Abstract: Nonvolatile memory elements that are based on resistive switching memory element layers are provided. A nonvolatile memory element may have a resistive switching metal oxide layer. The resistive switching metal oxide layer may have one or more layers of oxide. A resistive switching metal oxide may be doped with a dopant that increases its melting temperature and enhances its thermal stability. Layers may be formed to enhance the thermal stability of the nonvolatile memory element. An electrode for a nonvolatile memory element may contain a conductive layer and a buffer layer.

Abstract: A light transmission system includes a light guide support, a first convex lens, an optical waveguide member, and two second convex lenses. The light guide support includes a first surface, a second surface, a hollow space formed between the first surface and the second surface, and an inner reflecting surface forming an angle of 45 degrees relative to the first surface. The first convex lens is formed at the first surface, and configured for converging light to the inner reflecting surface. The optical waveguide member is located at the hollow space, and includes a main section parallel with the first surface, two first branch sections extending from and forming equal angles relative to the main section, and two second branch sections extending from the respective first branch sections. The two second convex lenses are formed at the second surface and aligned with the respective second branch sections.

Abstract: An electronic device with a function of searching images based on a facial feature is provided. The electronic device includes a capturing unit, a storage unit, an acquiring module, a searching module, and a folder establishing module. The capturing unit captures facial images. The storage unit stores a plurality of images. The acquiring module acquires facial features of the facial image captured by the capturing unit. The searching module searches for images that include the acquired facial feature from the plurality of images stored in the storage unit. The folder establishing module establishes a new folder and stores the searched images to the established new folder.

Abstract: A package-on-package (PoP) device comprises a bottom package on a substrate and a first set of conductive elements coupling the bottom package and the substrate. The PoP device further comprises a top package over the bottom package and a redistribution layer coupling the top package to the substrate. A method of forming a PoP device comprises coupling a first package to a substrate; and forming a redistribution layer over the first package and a top surface of the substrate. The method further comprises coupling a second package to the redistribution layer, wherein the redistribution layer couples the second package to the substrate.

Abstract: A coupling element, an injection molding object with the coupling element implanted therein, and an injection mold for manufacturing the injection molding object are provided. The coupling element has two reversely extended fixing ribs. The injection mold has a first mold and a second mold. The first mold has a first molding cavity and two positioning blocks separated by the first molding cavity. The second mold has a second molding cavity. When the first mold and the second mold are shut together and their molding cavities combine to define a closed room, the positioning blocks hold the coupling element by clamping the fixing ribs so the coupling element is suspended in midair of the closed room.

Abstract: A method and a composition of gene therapy for treating acute lung injury (ALI) and acute respiratory distress syndrome (ARDS) based on polyplexes formed between linear polyethyleneimine (PEI) and DNA comprising the ?2-Adrenergic Receptor (?2AR) gene are provided.

Abstract: A chip package includes a substrate, a pad, a double-sided adhesive tape, a chip, and a sealing member. The pad is arranged on the substrate and has a top surface facing away from the substrate. The double-sided adhesive tape includes a first paste surface and an opposing second paste surface. The first paste surface is attached to the top surface. The chip is attached onto the second paste surface and includes a light emitting surface or a light receiving surface facing away from the second paste surface. The sealing member is formed on the pad and tightly surrounds the chip and the double-sided adhesive.

Abstract: A method includes aligning a first electrical connector of a first package component to a second electrical connector of a second package component. With the first electrical connector aligned to the second electrical connector, a metal layer is plated on the first and the second electrical connectors. The metal layer bonds the first electrical connector to the second electrical connector.

Abstract: Methods and apparatuses for wafer level packaging (WLP) of semiconductor devices are disclosed. A contact pad of a circuit may be connected to a solder bump by way of a post passivation interconnect (PPI) line and a PPI pad. The PPI pad may comprise a hollow part and an opening. The PPI pad may be formed together with the PPI line as one piece. The hollow part of the PPI pad can function to control the amount of solder flux used in the ball mounting process so that any extra amount of solder flux can escape from an opening of the solid part of the PPI pad. A solder ball can be mounted to the PPI pad directly without using any under bump metal (UBM) as a normal WLP package would need.

Abstract: A method for compensating cardiac and respiratory motion in atrial fibrillation ablation procedures includes (a) simultaneously determining a position of a circumferential mapping (CFM) catheter and a coronary sinus (CS) catheter in two consecutive image frames of a series of first 2-D image frames; (b) determining a distance between a virtual electrode on the CS catheter and a center of the CFM catheter for a first image frame of the two consecutive image frames, and for a second image frame of the two consecutive image frames; and (c) if an absolute difference of the distance for the first image frame and the distance for the second image frame is greater than a predetermined threshold, compensating for motion of the CFM catheter in a second 2-D image.

Abstract: An optical connector includes a substrate, a number of light emitters, a number of light receivers, and a lens module. The light emitters and the light receivers are positioned on the substrate. The lens module is positioned on the substrate, and the light emitters and the light receivers are received in the lens module. The lens module includes a reflection surface, a number of first lenses, and a number of second lenses. Optical axes of the first lenses cross optical axes of the second lenses on the reflection surface. The first lenses are aligned with the light emitters and the light receivers.

Abstract: In a method for identifying differences between two images using a computing device, a digital image of the object is captured using an image capturing device, and a standard image of the object is obtained from a storage system of the computing device. A threshold value is generated according to pixel values of the digital image and the standard image. The method extracts first feature points from the digital image and second feature points from the second gray picture according to the threshold value. The method further determines a first feature area of the first gray picture according to the first feature points, determines a second feature area of the second gray picture according to the second feature points, and compares the first feature area with the second feature area to identify a difference between the digital image and the standard image.

Abstract: An optical fiber connector adapter for coupling a first optical fiber connector to a second optical fiber connector includes a lens body. The lens body includes a first surface and an opposite second surface. A positioning hole is defined in the first surface. A lens hole is defined in the first surface and a first lens is formed on a bottom in the lens hole. The first lens is beneath the first surface and adjacent to the positioning hole. A positioning post and a second lens protrude from the second surface. The second lens is aligned with the first lens. An optical fiber connector assembly having the optical fiber connector adapter is also provided.