Abstract: A semiconductor device and the method of manufacturing the same are provided. The semiconductor device comprises a substrate, a source region, a drain region, a filed plate and a gate electrode. The source region is of a first conductivity type located at a first side within the substrate. The drain region is of the first conductive type located at a second side within the substrate opposite to the first side. The field plate is located over the substrate and between the source region and the drain region. A portion of the gate electrode is located over the field plate.

Abstract: The present invention discloses a system and method for service matching of IM software, which is adapted for operating between a plurality of user devices and a plurality of IM software supplier servers. The IM software supplier server provides at least one IM software associated service. The user device merely installs one of the plurality of IM software, and the user device can access services provided by different IM software supplier servers. The service matching method comprises: relaying a service request to the corresponding IM software supplier server according to a correspondence table defining the IM software and names of the IM software associated service when the user device makes the service request; and returning a feedback of the corresponding IM software supplier server to the user device made the service request.

Abstract: A method includes causing a carrier of an overhead hoist transfer system (OHT) to latch onto a top latch of a first semiconductor wafer transportation pod, the first semiconductor wafer transportation pod comprising a top latching mechanism configured to selectively connect to another pod or a carrier mechanism of an overhead hoist transfer (OHT) system, and a bottom latching mechanism configured to selectively connect to another pod. The method further includes rotating the first semiconductor wafer transportation pod such that the top latching mechanism of the first semiconductor wafer transportation pod latches on to a second semiconductor wafer transportation pod.

Abstract: A semiconductor device and the method of manufacturing the same are provided. The semiconductor device includes a substrate, a source region, a drain region, a filed plate and a gate electrode. The source region is of a first conductivity type located at a first side within the substrate. The drain region is of the first conductive type located at a second side within the substrate opposite to the first side. The field plate is located over the substrate and between the source region and the drain region. A portion of the gate electrode is located over the field plate.

Abstract: A wafer transportation pod includes a body, a main compartment enclosed by the body, the main compartment to provide a controlled environment, a holding device within the main compartment, the holding device to hold a plurality of semiconductor wafers, a top latching mechanism configured to connect to another pod or a carrier mechanism of an overhead hoist transfer (OHT) system, a bottom latching mechanism configured to connect to another pod, the bottom latching mechanism being similar to the latching mechanism on the carrier.

Abstract: A method for effectively transmitting data, in which a switch is connected between a plurality host and storage, comprises steps of the following. First, the hosts recognize the storages via the switch, and revise a data transmission path within an original command, meanwhile transforming it into a specific command. Later, the switch receives the specific command, alternatively revises the data transmission path or not, and transforms the specific command into a standard command. The standard command is then transmitted to the storage. After receiving it, the storage is able to search for a corresponding host based on the data transmission path such that data is simply transmitted between the storage and its corresponding host. By employing the proposed method, the present invention is beneficial to reducing system complexity and raising data transmission efficiency.

Abstract: A method of fabricating a semiconductor structure includes forming an isolation feature in a substrate, removing a portion of the isolation feature and a portion of the substrate underneath the removed portion of the isolation feature to form a trench in the substrate, and forming a trapping feature around a bottom portion of the trench. A first sidewall and a second sidewall of the trench are in direct contact with the isolation feature, and a bottom surface of the trench is below a bottom surface of the isolation feature.

Abstract: A polymer of fluorine-containing sulfonated poly(arylene ether)s and a manufacturing method thereof are provided. The polymer is formed by processing a nucleophilic polycondensation between a fluorine-containing monomer having an electron-withdrawing group and a multi-phenyl monomer. A main structure of the polymer of fluorine-containing sulfonated poly(arylene ether)s has a first portion with fluoro or trifluoromethyl substituted phenyl groups, and a second portion with sulfonated phenyl groups.

Abstract: A polymer of fluorine-containing sulfonated poly(arylene ether)s and a manufacturing method thereof are provided. The polymer is formed by processing a nucleophilic polycondensation between a fluorine-containing monomer having an eletron-withdrawing group and a multi-phenyl monomer. A main structure of the polymer of fluorine-containing sulfonated poly(arylene ether)s has a first portion with fluoro or trifluoromethyl substituted phenyl groups, and a second portion with sulfonated phenyl groups.

Abstract: Low-level nodes (LLNs) that are communicatively connected to one another each have sensing capability and processing capability. High-level nodes (HLNs) that are communicatively connected to one another and to the LLNs each have processing capability more powerful than the processing capability of each LLN. The LLNs and the HLNs perform processing based on sensing events captured by the LLNs. The processing is performed by the LLNs and the HLNs to minimize data communication among the LLNs and the HLNs, and to provide for software-defined sensing.

Abstract: Determining proximity of data terms based on Walsh-Hadamard transforms is disclosed. One example is a system including a modifier, a Walsh-Hadamard transformer, an indexer, and an evaluator. A dataset, including a plurality of numerical data terms, is received via a processing system. The modifier extends a given data term of the plurality of data terms, the extension based on multiple concatenations of the given data term with itself. The Walsh-Hadamard transformer provides coefficients of the Walsh-Hadamard transform of the modified given data term. The indexer provides a set of keys based on the coefficients, and associates the set of keys with the given data term. The evaluator determines a similarity measure for a pair of data terms of the plurality of data terms, the similarity measure based on a number of overlaps between respective sets of keys, and indicative of proximity of the pair of data terms.

Abstract: A semiconductor structure includes a substrate, a first power device and a second power device in the substrate, at least one isolation feature between the first and second power device, and a trapping feature adjoining the at least one isolation feature in the substrate.

Abstract: A semiconductor device and the method of manufacturing the same are provided. The semiconductor device includes a substrate, a source region, a drain region, a filed plate and a gate electrode. The source region is of a first conductivity type located at a first side within the substrate. The drain region is of the first conductive type located at a second side within the substrate opposite to the first side. The field plate is located over the substrate and between the source region and the drain region. A portion of the gate electrode is located over the field plate.

Abstract: A polymer of poly(arylene ether)s, a manufacturing method thereof, and a polymer light emitting diode with an organic light emitting layer made from the polymer are provided. The polymer is formed by processing a nucleophilic polycondensation between a fluoro-containing monomer having an electron-withdrawing group and a multi-phenyl monomer. The polymer has a host portion with fluoro- or trifluoromethyl substituents, and a customer portion with multi-phenyl groups.

Abstract: Interactive sequential pattern mining is disclosed. One example is a system including a sequence miner, and an interaction processor. A sequence database is received, the sequence database including a plurality of input sequences, where each sequence of the plurality of input sequences is an ordered list of events, and each event in the list of events includes at least one item. The sequence miner mines the sequence database for a plurality of candidate sequence patterns, the mining based on an interaction with a user. The interaction processor processes the interaction with the user, the interaction based on domain relevance of the plurality of candidate sequence patterns to the user.

Abstract: A polymer of fluorine-containing sulfonated poly(arylene ether)s and a manufacturing method thereof are provided. The polymer is formed by processing a nucleophilic polycondensation between a fluorine-containing monomer having an electron-withdrawing group and a multi-phenyl monomer. A main structure of the polymer of fluorine-containing sulfonated poly(arylene ether)s has a first portion with fluoro or trifluoromethyl substituted phenyl groups, and a second portion with sulfonated phenyl groups.

Abstract: A polymer of fluorine-containing sulfonated poly(arylene ether)s and a manufacturing method thereof are provided. The polymer is formed by processing a nucleophilic polycondensation between a fluorine-containing monomer having an electron-withdrawing group and a multi-phenyl monomer. A main structure of the polymer of fluorine-containing sulfonated poly(arylene ether)s has a first portion with fluoro or trifluoromethyl substituted phenyl groups, and a second portion with sulfonated phenyl groups.

Abstract: A drive shaft assembly comprising a first shaft and a second shaft is disclosed. The second shaft is axially translatable from an engaged configuration with the first shaft at one limit of its travel to a disengaged configuration from the first shaft at the opposite limit of its travel. Engagement of the first and second shafts is via cooperating helical splines provided thereon. The helical splines give rise to a disengaging axial force on the second shaft in a fault condition in which a driving torque is applied from one of the first and second shafts to the helical splines in a rotational direction tending to unscrew the helical splines. Consequently when the second shaft is in the engaged configuration the disengaging axial force translates the second shaft to the disengaged configuration.

Abstract: A method includes recording a wafer ID and a location ID of a device die in a database, and bonding the device die over a package substrate, wherein the device die and the package substrate are disposed in a package. A package ID is on the package. A mapping is established to link the wafer ID and the location ID of the device die to the package ID.

Abstract: A search engine receives a search trigger for a task. In response to identifying data that is responsive to the search trigger, a notification of the identified data is sent to the task, to cause the task to process the identified data. The search engine receives a notification of result data produced by the task based on the processing of the identified data.