Abstract: The present invention relates to the formation, on a substrate having a display area and a peripheral area, of a gate wire including a plurality of gate lines and gate electrodes in a display area and gate pads in the peripheral area, and of a common wire, including a common signal line and a plurality of common electrodes in the display area. A gate insulating layer, a semiconductor layer, an ohmic contact layer and a conductor layer are sequentially deposited, and the conductor layer and the ohmic contact layer are patterned to form a data wire including a plurality of data lines, a source electrode and a drain electrode of the display area, and data pads of the peripheral area, and an ohmic contact layer pattern thereunder. A passivation layer is deposited and a positive photoresist layer is coated thereon. The photoresist layer is exposed to light through one or more masks having different transmittances between the display area and the peripheral area.

Abstract: The present invention relates to the formation, on a substrate having a display area and a peripheral area, of a gate wire including a plurality of gate lines and gate electrodes in a display area and gate pads in the peripheral area, and of a common wire, including a common signal line and a plurality of common electrodes in the display area. A gate insulating layer, a semiconductor layer, an ohmic contact layer and a conductor layer are sequentially deposited, and the conductor layer and the ohmic contact layer are patterned to form a data wire including a plurality of data lines, a source electrode and a drain electrode of the display area, and data pads of the peripheral area, and an ohmic contact layer pattern thereunder. A passivation layer is deposited and a positive photoresist layer is coated thereon. The photoresist layer is exposed to light through one or more masks having different transmittances between the display area and the peripheral area.

Abstract: A thin film transistor substrate for a liquid crystal display includes an insulating substrate, and a gate line assembly formed on the substrate. The gate line assembly has a double-layered structure with a lower layer exhibiting good contact characteristics with respect to indium tin oxide, and an upper layer exhibiting low resistance characteristics. A gate insulating layer, a semiconductor layer, a contact layer, and first and second data line layers are sequentially deposited onto the substrate with the gate line assembly. The first and second data line layers are patterned to form a data line assembly, and the contact layer is etched through the pattern of the data line assembly such that the contact layer has the same pattern as the data line assembly. A passivation layer is deposited onto the data line assembly, and a photoresist pattern is formed on the passivation layer by using a mask of different light transmissties mainly at a display area and a peripheral area.

Abstract: A data line and an amorphous silicon pattern are formed on a substrate. The first electrode pattern is extended from the data line and overlaps an edge of the amorphous silicon pattern. The second electrode pattern is made of the same metal as the first electrode pattern and overlaps the edge of the amorphous silicon pattern at an opposite side of the first electrode pattern. Edges of the first and the second electrode patterns are sharply formed so that a tunneling effect easily occurs through the amorphous silicon pattern. An indium-tin-oxide pattern for a capacitor is formed at the end of the second electrode pattern. The capacitor is formed between the ITO pattern and a common electrode.

Abstract: A gate line extending in a horizontal direction is formed on an insulating substrate, and a data line is formed perpendicular to the gate line defining a pixel of a matrix array. Pixel electrodes receiving image signals through the data line are formed in a pixel, and a thin film transistor having a gate electrode connected to the gate line, a source electrode connected to the data line, and a drain electrode connected to the pixel electrode is formed on the portion where the gate lines and the data lines intersect. A storage wire including a storage electrode line in the horizontal direction, a storage electrode connected to the storage electrode line, and at least one of the storage electrode connection portions connecting storage electrodes of neighboring pixels is formed in the same direction as the gate line.

Abstract: A plurality of gate lines extending in a horizontal direction are formed on an insulating substrate, and a data line is formed perpendicular to the gate line thereby defining a pixel of a matrix array. Pixel electrodes receiving image signals through the data line are formed in a pixel, and a thin film transistor having a gate electrode connected to the gate line, a source electrode connected to the data line, and a drain electrode connected to the pixel electrode is formed on the portion where the gate lines and the data lines intersect. A storage wire including a storage electrode line is formed in the horizontal direction, and a storage electrode connected to the storage electrode line and forming a storage capacitance by overlapping the pixel electrode is formed in the pixel. A redundant repair line both ends of which overlap the storage wire of the neighboring pixel, and a storage wire connection line connecting the storage wires of a neighboring pixel are formed.

Abstract: A gate wire is formed on an insulating substrate by a photolithography process using the first mask, and a gate insulating layer and a semiconductor layer are sequentially deposited. Then, an ohmic contact layer made of silicide or microcrystallized and doped amorphous silicon is formed on the semiconductor layer. Then, a triple pattern including a gate insulating layer, a semiconductor layer and an ohmic contact layer are patterned at the same time by a photolithography process using the second mask. At this time, a contact hole exposing the gate pad is formed. An ITO layer and a metal layer are deposited and patterned to form a data wire, a pixel electrode, and a redundant gate pad by a photolithography process using the third mask. The ohmic contact layer, which is not covered with the ITO layer and the metal layer, is removed. A passivation layer is deposited and patterned by a photolithography process using the fourth mask.

Abstract: A thin film transistor array substrate includes an insulating substrate, and gate lines formed on the substrate, storage electrode lines and storage electrodes are also formed on the substrate. Data lines cross over the gate lines and the storage electrode lines. The data lines are electrically insulated from the gate lines and the storage electrode lines. Thin film transistors are connected to the data lines and the gate lines, and pixel electrodes are connected to the thin film transistors. Bridges are formed at the same plane as the pixel electrodes while interconnecting the storage electrode lines and the storage electrodes placed at both sides of the gate lines. The storage electrode lines and the storage electrodes have protrusions or grooves placed close to the bridges to indicate the locations of laser illumination.

Abstract: A gate wire is formed on an insulating substrate by a photolithography process using the first mask, and a gate insulating layer and a semiconductor layer are sequentially deposited. Then, an ohmic contact layer made of silicide or microcrystallized and doped amorphous silicon is formed on the semiconductor layer. Then, a triple pattern including a gate insulating layer, a semiconductor layer and an ohmic contact layer are patterned at the same time by a photolithography process using the second mask. At this time, a contact hole exposing the gate pad is formed. An ITO layer and a metal layer are deposited and patterned to form a data wire, a pixel electrode, and a redundant gate pad by a photolithography process using the third mask. The ohmic contact layer, which is not covered with the ITO layer and the metal layer, is removed. A passivation layer is deposited and patterned by a photolithography process using the fourth mask.

Abstract: A thin film transistor array substrate includes an insulating substrate, and gate lines formed on the substrate, storage electrode lines and storage electrodes are also formed on the substrate. Data lines cross over the gate lines and the storage electrode lines. The data lines are electrically insulated from the gate lines and the storage electrode lines. Thin film transistors are connected to the data lines and the gate lines, and pixel electrodes are connected to the thin film transistors. Bridges are formed at the same plane as the pixel electrodes while interconnecting the storage electrode lines and the storage electrodes placed at both sides of the gate lines. The storage electrode lines and the storage electrodes have protrusions or grooves placed close to the bridges to indicate the locations of laser illumination.

Abstract: A matrix-type display device having a repair layout, particularly, a matrix-type display device which can be repaired in a pixel unit, is provided. Two or more of signal lines such as scanning signal lines, displaying signal lines and auxiliary signal lines and a pixel electrode are overlapped via an insulating layer, so that a defect such as the disconnection of the displaying signal lines and scanning signal lines, the short of the pixel electrode and signal line, and the loss of electrode of a switching element, can be repaired. Here, the layout of the auxiliary gate line and dual gate line can be modified.

Abstract: A method of fabricating a thin film transistor array substrate for a liquid crystal display includes the step of forming a gate line assembly with gate lines, gate electrodes and gate pads. After laying a plurality of layers on the substrate, a photoresist film is deposited onto the layers. The photoresist film is first exposed to light at a first light exposing unit, and secondly exposed to light at a second light exposing unit such that the photoresist film has three portions of different thickness. The photoresist pattern, and some of the underlying layers are etched to form a data line assembly, a semiconductor pattern, and an ohmic contact pattern. The data line assembly includes data lines, source and drain electrodes, and data pads. The remaining photoresist film is removed, and a protective layer is formed on the substrate.

Abstract: A gate line is formed on a substrate in a horizontal direction and a data repair line is formed on the same layer as the gate line in a vertical direction. The repair line is divided into two portions with respect to the gate line. A gate insulating film is formed on the gate line and the data repair line, and a data line is formed on the gate insulating film along the repair line having a smaller width than the repair line, a passivation film being deposited thereon. Contact holes are formed in the passivation film, and contact holes to expose both ends of the divided repair line are formed in the passivation film and gate insulating film. A transparent connecting pattern formed on the passivation film contacts the data line and the repair line through the contact holes. Both ends of the repair line are extended from the data line. A pixel electrode is formed on the passivation film, and the pixel electrode overlaps the edges of the repair line at a predetermined width.

Abstract: Simplified method of manufacturing liquid crystal displays. A gate wire including a gate line, a gate pad and a gate electrode is formed on the substrate by using the first mask. A gate insulating layer, a semiconductor layer, a ohmic contact layer and a metal layer are sequentially deposited to make a quadruple layers, and patterned by a dry etch of using the second mask. At this time, the quadruple layers is patterned to have a matrix of net shape layout and covering the gate wire. An opening exposing the substrate is formed in the display area and a contact hole exposing the gate pad is formed in the peripheral area. Next, ITO is deposited and a photoresist layer coated on the ITO. Then, the ITO layer is patterned by using the third mask and a dry etch, and the data conductor layer and the ohmic contact layer not covered by the ITO layer is dry etched.

Abstract: A gate line extending in a horizontal direction is formed on an insulating substrate, and a data line is formed perpendicular to the gate line defining a pixel of a matrix array. Pixel electrodes receiving image signals through the data line are formed in a pixel, and a thin film transistor having a gate electrode connected to the gate line, a source electrode connected to the data line, and a drain electrode connected to the pixel electrode is formed on the portion where the gate lines and the data lines intersect. A storage wire including a storage electrode line in the horizontal direction, a storage electrode connected to the storage electrode line, and at least one of the storage electrode connection portions connecting storage electrodes of neighboring pixels is formed in the same direction as the gate line.

Abstract: A gate wire including a gate line, a gate electrode and a gate pad, and a common signal wire including a plurality of common electrodes and a common signal line connecting the common electrodes are formed on a substrate. A first data pattern including a first data line defining a pixel region along with the gate line, a source and drain electrode, a first data pad and a pixel wire parallel to the common electrodes is formed on a gate insulating layer covering the gate wire and the common signal wire. A second data pattern including a second data line, a second data pad and a supplementary gate pad, which are connected to the first data line, the first data pad and the gate pad respectively through contact holes formed in a passivation layer, is on the passivation layer. Here, the first or the second data line and the common electrodes adjacent thereto overlap each other to prevent the light leakage near the edges of the pixel region and to increase the aperture ratio of the LCD.

Abstract: An LCD has a storage electrode wire between long sides of partitions of a pixel electrode and gate lines or data lines. A gate wire and a storage electrode wire are formed on a substrate and covered with a gate insulating layer. A data wire is formed on the gate insulating layer and covered with a passivation layer. A thin film transistor including gate, source and drain electrodes are provided on the substrate. A pixel electrode is formed on the passivation layer and connected to the drain electrode. The pixel electrode is divided into three partitions, a first one having long and short sides parallel to data lines and gate lines, respectively, and second and third ones vice versa. A storage electrode line and some storage electrodes are disposed between the long sides of the partitions and the gate or the data lines, and between the long sides of the partitions. Other storage electrodes disposed between the short sides of the partitions and the gate or the data lines are covered by the pixel electrode.

Abstract: A liquid crystal display includes: a first substrate; a first signal line formed on the first substrate and extending in a direction; a second signal line intersecting the first signal line while being insulated; a pixel electrode formed in a pixel area defined by intersections of the first signal line and the second signal line, the pixel electrode having a plurality of partitions; a switching element connected to the first signal line, the second signal line, and the pixel electrode; a second substrate opposite the first substrate; a black matrix formed on the second substrate; and a common electrode formed over the second substrate having a plurality of domain defining members, wherein each domain is enclosed by the partitions of the pixel electrode and the domain defining members and has at least one long side parallel or perpendicular to the first signal line and at least one short side curved at an angle of about 30 to about 60 degrees with the first signal line.

Abstract: A gate wire is formed on an insulating substrate by a photolithography process using the first mask, and a gate insulating layer and a semiconductor layer are sequentially deposited. Then, an ohmic contact layer made of silicide or microcrystallized and doped amorphous silicon is formed on the semiconductor layer. Then, a triple pattern including a gate insulating layer, a semiconductor layer and an ohmic contact layer are patterned at the same time by a photolithography process using the second mask. At this time, a contact hole exposing the gate pad is formed. An ITO layer and a metal layer are deposited and patterned to form a data wire, a pixel electrode, and a redundant gate pad by a photolithography process using the third mask. The ohmic contact layer, which is not covered with the ITO layer and the metal layer, is removed. A passivation layer is deposited and patterned by a photolithography process using the fourth mask.

Abstract: A method of fabricating a thin film transistor array substrate for a liquid crystal display includes the step of forming a gate line assembly with gate lines, gate electrodes and gate pads. After laying a plurality of layers on the substrate, a photoresist film is deposited onto the layers. The photoresist film is first exposed to light at a first light exposing unit, and secondly exposed to light at a second light exposing unit such that the photoresist film has three portions of different thickness. The photoresist pattern, and some of the underlying layers are etched to form a data line assembly, a semiconductor pattern, and an ohmic contact pattern. The data line assembly includes data lines, source and drain electrodes, and data pads. The remaining photoresist film is removed, and a protective layer is formed on the substrate.