Abstract: An apparatus for monitoring a photolithography process includes a measurer and a data processor. The measurer measures an optical characteristic of a substrate. The data processor determines defectiveness of the substrate based on the optical the measurer.

Abstract: Provided are a heat sink package in which a semiconductor package and a heat sink are bound to each other and a method of fabricating the same. The heat sink package includes a heat sink having a cavity on an upper surface thereof; a metal layer formed on the bottom surface of the cavity; a solder paste layer formed on the metal layer; a substrate on the solder paste layer; and a lead and a semiconductor chip mounted on the substrate.

Abstract: The present invention relates to a droplet jetting apparatus using electrostatic force, a manufacturing method thereof and an ink providing method thereof. The droplet jetting apparatus using electrostatic force includes a lower electrode unit in which a nozzle and a lower electrode positioned in the nozzle equipped in the upper part of a first substrate, and an ink inflow channel equipped in the lower part of the first substrate are integrally formed; an upper electrode unit having an upper electrode formed on the top surface of a second substrate and an ink discharge hole formed by being penetrated to the upper electrode from the bottom surface of the second substrate; and a bonding layer for bonding the lower electrode unit and the upper electrode unit with each other so that the nozzle is vertically aligned with the ink discharge hole.

Abstract: Provided are wafer level chip scale packages, each having a redistribution substrate in which a pad pitch is improved, and methods of fabricating the same. An exemplary wafer level chip scale package includes a semiconductor chip and a redistribution substrate. The semiconductor chip includes a plurality of pads arranged with a first pitch on a first surface thereof. The redistribution substrate includes a plurality of connection wires arranged with a second pitch, which is greater than the first pitch, on a first surface thereof. The redistribution substrate expands a pad pitch from the first pitch to the second pitch by electrically connecting the pads to the connection wires.

Abstract: A semiconductor package is disclosed. Particularly, a multi-chip package is disclosed, which can stably maintain insulation between a plurality of semiconductor chips and effectively release heat to the outside. The semiconductor package includes an insulation layer including a diamond layer formed by a chemical vapor deposition method between a lead frame or a heat sink and the semiconductor chips disposed thereon.

Abstract: A projection display apparatus using a microlens array and a micromirror array comprises a substrate, multiple micromirror arrays and multiple microlens arrays. The substrate is disposed apart with a predetermined distance from a light source. The multiple micromirror arrays are disposed over the substrate to be assembled together to have a predetermined incidence angle with respect to the incident rays. The multiple microlens arrays are configured to correspond to the micromirror arrays. More specifically, a first microlens array is disposed in a predetermined region between the light source and the substrate and comprises multiple microlenses. A second microlens array is disposed in a light path of reflection rays reflected from the micromirrors.

Abstract: There is an apparatus for evaluating the audio quality of a multi-channel audio codec, including: a preprocessing unit for synthesizing binaural signals based on multi-channel audio signals transmitted through a multi-channel of a multi-channel audio reproduction system; an output variable calculator for calculating an interaural cross-correlation coefficient distortion (IACCDist) and other output variables of the binaural signals; and an artificial neural network circuit for outputting a grade of the perceived quality based on the interaural cross-correlation coefficient distortion (IACCDist) and other output variables calculated in the output variable calculator.

Abstract: A method of controlling On-Die Termination (ODT) resistors of memory devices sharing signal lines is provided. The ODT controlling method comprises setting an ODT control enable signal of each of the memory devices and address/command or data termination information to a mode register of the corresponding memory device, and controlling resistances of ODT resistors of the signal lines in the memory devices in response to the address/command or data termination information and termination addresses. When only one of the memory devices is activated, ODT resistors of the activated memory device are set to a first resistance. When all the memory devices are activated, ODT resistors of the memory devices are set to a second resistance.

Abstract: The present invention relates to a delivery clamp module and a control method thereof. According to the present invention, there is provided a delivery clamp module. The delivery clamp module comprises a clamp guide with a movement guide rail included therein; a delivery tray movable along the rail of the clamp guide by means of a driving force of a tray delivery motor; a clamp base rotatably connected to a front end of the delivery tray through a connecting arm, rotated within a predetermined angular range by a base rotating motor, and supporting a surface of the stacked media; and a clamp arm installed on the clamp base, including push fingers for pushing the media onto the clamp base by an elastic force, and rotated with respect to the clamp base within a predetermined angular range by an arm rotating motor.

Abstract: A height adjusting apparatus for vehicle seats may include seat side frames provided on both side ends of a seat part of a seat, each of the seat side frames connected to the seat bracket via a front link and a rear link, the support rod coupling the seat side frames to each other, the pinion gear provided on a seat side frame, the rack gear link having on one end thereof a rack gear which engages with an upper end of the pinion gear, and coupled at the other end thereof to a hinge of the front link placed on the seat bracket, so that, when the pinion gear is driven, the rack gear link pulls the seat side frame forwards to lift it up, and the support pin provided on the seat side frame in such a way as to be placed above the rack gear.

Abstract: A seatback frame for vehicles has a lower cross member that prevents a back pad and a recliner hinge shaft from interfering with each other. The seatback frame includes a back frame and a lower cross member. The lower cross member includes a reinforcing part and a hinge-shaft cover. The back frame is hinged to a seat frame via a recliner hinge shaft. The lower cross member couples both sides of the lower end of the back frame to each other. The reinforcing part has the shape of an embossment which extends in a longitudinal direction of the lower cross member. The hinge-shaft cover is provided on the lower portion of the lower cross member, and is bent to surround the recliner hinge shaft.

Abstract: Molded leadless packages having improved stacked structures are disclosed. An exemplary molded leadless package includes a die attaching pad, a plurality of leads spaced apart from the die attaching pad at a periphery region of the die attaching pad, a semiconductor chip on the die attaching pad, a plurality of bonding wires electrically connecting the leads to the semiconductor chip, and a sealing member fixedly enclosing the semiconductor chip and the bonding wires while partly exposing an outer surface of each of the leads. The sealing member fills gaps between the die attaching pad and the leads and includes at least one protrusion protruding downward from the die attaching pad and the leads.

Abstract: A mobile terminal is provided that includes a wireless communication unit configured to receive channel information and scan at least one channel, a controller configured to generate a channel database using the received channel information and generate a channel list according to a result of real time channel scanning using the channel database, and an output unit configured to display the channel list according to the result of the real time channel scanning under control of the controller.

Abstract: Disclosed is an on-line quality prediction system for stainless steel slab and the predicting method using it, which can allow produced slab quality to predict in high precision on the on-line using a network based system by collecting all operation data available from a steel making process to a continuous casting process and then using them as a metallurgical calculation evaluating model through thermodynamics and statistics programs, the system comprises: a main computer collecting and storing information from a production line for the stainless steel slab; a thermodynamics calculation only computer mutually communicating with the main computer; and a server computer mutually communicating with the main computer, whereby it can overcome a limitation of a predicting method due to existing operation data and allow produced slab quality to predict in high precision on the on-line using a network based system by collecting all operation data available from a steel making process to a continuous casting process

Abstract: A method for measuring non-linear characteristics of a power amplifier is described. A calibration waveform is calculated during a testing procedure period. Amplitude characteristics of the calibration waveform at the output of the power amplifier are measured during the testing procedure period. Phase characteristics of the calibration waveform at the output of the power amplifier are measured during the testing procedure period. Pre-distortion techniques are configured based on the amplitude characteristics and the phase characteristics to be used during a normal operation period of a transmitter.

Abstract: A nonvolatile memory using a resistance material includes first and second memory-cell blocks having different block address information and each including a plurality of nonvolatile memory cells; a global bitline common to the first and second memory-cell blocks; first and second local bitlines corresponding to the first and second memory-cell blocks, respectively, and coupled to each other; and a common bitline selection circuit interposed between the first and second memory-cell blocks and coupled between the first and second local bitlines and the global bitline.

Abstract: A backlight assembly includes a receiving container including a bottom plate having a lower face and an upper face opposite the lower face, a sidewall part protruding from edge portions of the bottom plate, and a plurality of light property controlling parts disposed on the upper face and having a substantially wedge shaped cross-section. The backlight further includes a light source disposed between adjacent light property controlling parts, and the light source is received by the receiving container, wherein a distance between a center of the light source and the upper face is substantially equal to a height of at least one of the plurality of light property controlling parts. The backlight assembly may increase the brightness and brightness-uniformity of light.

Abstract: In a method of registering with an access point in a terminal of a wireless communication system, a frame includes a downlink sub-frame including a broadcast interval and a first management connection interval, and an uplink sub-frame including an access interval and a second management connection interval, the broadcast interval being used for transmitting a map message, the method includes: sending a first ranging request message to the access point using the access interval; receiving allocation information of a ranging slot from the access point using the map message; performing ranging through the ranging slot; sending a registration request message to the access point using the second management connection interval; and receiving information on whether to permit the registering from the access point using the first management connection interval.

Abstract: A distributed translator and an operation method of the distributed translator are proposed. The distributed translator includes: a demodulator demodulating a received signal to extract a transport stream and synchronization information from the received signal; a modulator generating an output frame based on the synchronization information to modulate the output frame; and a transmitter transmitting the modulated output frame according to a transmission timing.

Abstract: A packaged semiconductor device (a wafer-level chip scale package) containing a conductive adhesive material as an electrical interconnect route between the semiconductor die and a patterned conductive substrate is described. The patterned conductive substrate acts not only as a substrate, but also as a redistribution layer that converts the dense pad layout of the die to a larger array configuration of the solder balls in the circuit board. Using the invention allows the formation of a lower priced chip scale package that also overcomes the restriction of the die size used in die-sized chip packages and the input-output pattern that can be required by the printed circuit board. Thus, the invention can provide a familiar pitch (i.e., interface) to the printed circuit board for any small die.