Patents by Inventor Yuan Chen

Yuan Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250006807
    Abstract: A semiconductor structure includes an epitaxial region having a front side and a backside. The semiconductor structure includes an amorphous layer formed over the backside of the epitaxial region, wherein the amorphous layer includes silicon. The semiconductor structure includes a first silicide layer formed over the amorphous layer. The semiconductor structure includes a first metal contact formed over the first silicide layer.
    Type: Application
    Filed: September 16, 2024
    Publication date: January 2, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shih-Chuan Chiu, Huan-Chieh Su, Pei-Yu Wang, Cheng-Chi Chuang, Chun-Yuan Chen, Li-Zhen Yu, Chia-Hao Chang, Yu-Ming Lin, Chih-Hao Wang
  • Publication number: 20250008083
    Abstract: A method of encoding video data is provided. The method determines a block unit of an image frame of the video data. The method determines, for the block unit, a first merge candidate list including multiple merge candidates, and identifies multiple merge subgroups from the first merge candidate list. The method determines multiple first cost values each corresponding to one of the merge candidates, and determines an arrangement of the merge candidates in each of the merge subgroups based on the first cost values. The method determines a second merge candidate list by selecting, from each of the merge subgroups, a first K merge candidates of the merge candidates ordered based on the arrangements. Then, the method selects one of the merge candidates in the second merge candidate list to predict the block unit and encodes one or more merge indices into a bitstream based on the selected merge candidate.
    Type: Application
    Filed: September 27, 2022
    Publication date: January 2, 2025
    Inventors: CHIH-YUAN CHEN, CHIH-YU TENG, YU-CHIAO YANG
  • Patent number: 12179737
    Abstract: An unmanned ground vehicle (UGV) includes one or more motors configured to drive one or more wheels of the UGV, an obstacle sensor, a memory storing instructions, and a processor coupled to the one or more motors, the obstacle sensor, and the memory. The processor is configured to execute the instructions to cause the UGV to obtain location information of multiple navigation points; calculate a navigation path based on the obtained location information; drive the one or more motors to navigate the UGV along the navigation path; detect, by the obstacle sensor, whether one or more obstacles exist while navigating the UGV, and if detected, determine location information of the one or more obstacles; and if the one or more obstacles are detected by the obstacle sensor, update the navigation path based on determined location information of the one or more obstacles.
    Type: Grant
    Filed: October 17, 2019
    Date of Patent: December 31, 2024
    Assignee: GEOSAT AEROSPACE & TECHNOLOGY
    Inventors: Hsin-Yuan Chen, Chien-Hung Liu, Wei-Hao Wang, Yi-Bin Lin, Yi-Chiang Yang
  • Patent number: 12183683
    Abstract: An electronic package structure includes an electronic structure, a wiring structure, an electrical contact and a support layer. The wiring structure is located over the electronic structure. The electrical contact connects the wiring structure and the electronic structure. The support layer is disposed around the electrical contact and has a surface facing the electrical contact. The surface includes at least one inflection point in a cross-sectional view.
    Type: Grant
    Filed: October 14, 2021
    Date of Patent: December 31, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Wei-Jen Wang, Po-Jen Cheng, Fu-Yuan Chen
  • Publication number: 20240429264
    Abstract: An electronic device includes a substrate, a first electronic unit, a second electronic unit, a first buffer layer, and a second buffer layer. The first electronic unit is disposed on the substrate. The second electronic unit is disposed on the substrate and adjacent to the first electronic unit. The first buffer layer is disposed on the first electronic unit and has a first curved bottom surface. The second buffer layer is disposed on the second electronic unit and has a second curved bottom surface. The width of the first curved bottom surface is different from the width of the second curved bottom surface.
    Type: Application
    Filed: September 3, 2024
    Publication date: December 26, 2024
    Inventors: Jia-Yuan CHEN, Tsung-Han TSAI, Kuan-Feng LEE, Yuan-Lin WU
  • Publication number: 20240429113
    Abstract: A semiconductor package includes a substrate having a top surface and a bottom surface; a semiconductor die mounted on the top surface of the substrate; and a two-part lid mounted on a perimeter of the top surface of the substrate and housing the semiconductor die. The lid comprises an annular lid base and a cover plate removably installed on the annular lid base. The semiconductor package can be uncovered by removing the cover plate and a forced cooling module can be installed in place of the cover plate.
    Type: Application
    Filed: September 1, 2024
    Publication date: December 26, 2024
    Applicant: MEDIATEK INC.
    Inventors: Shih-Chao Chiu, Chi-Yuan Chen, Wen-Sung Hsu, Ya-Jui Hsieh, Yao-Pang Hsu, Wen-Chun Huang
  • Publication number: 20240429292
    Abstract: The present disclosure describes a semiconductor device having a contact structure isolated from a source/drain structure. The semiconductor structure includes a gate structure on a substrate, first and second source/drain (S/D) structures on opposite sides of the gate structure, an isolation layer on the second S/D structure, a third S/D structure adjacent to and separate from the second S/D structure, and a S/D contact structure on the isolation layer and the third S/D structure. The isolation layer separates the S/D contact structure from the second S/D structure.
    Type: Application
    Filed: October 18, 2023
    Publication date: December 26, 2024
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chun-Yuan CHEN, Huan-Chieh SU, Kuo-Cheng CHIANG, Chih-Hao WANG
  • Publication number: 20240424528
    Abstract: A polymer plastic front plate comprises: a plastic substrate and a hard coating layer formed on an adhesion surface of the plastic substrate. The hard coating layer comprises: organic-inorganic hybrid UV oligomer, high Tg UV resin additive, a plurality of dispersed flaky nano inorganic material, and photo initiator, so as to form a gas barrier hard coating layer with high surface dyne value (>44 dyne) on the adhesion surface of the plastic substrate. It not only has good ink printability and OCA adhesiveness, but also inhibits the diffusion of fugitive gas from polymer plastic front plates during high-temperature, high-temperature and high-humidity, high-low temperature thermal shocks and other harsh automotive industry environmental tests. The gas can be avoided from entering the OCA layer, thereby solving the problems of bubbles and delamination after the environmental tests are performed.
    Type: Application
    Filed: September 9, 2024
    Publication date: December 26, 2024
    Applicant: ENFLEX CORPORATION
    Inventors: Hsin Yuan CHEN, Chun Kai WANG, Yu Ling CHIEN
  • Patent number: 12175031
    Abstract: An electronic device includes a light emitting structure, a light conversion structure and an electrode. The light conversion structure is disposed on the light emitting structure. The electrode forms a mesh structure, and the mesh structure surrounds the light conversion structure in a top view of the electronic device.
    Type: Grant
    Filed: January 3, 2023
    Date of Patent: December 24, 2024
    Assignee: InnoLux Corporation
    Inventors: Hsiao-Lang Lin, Kuan-Feng Lee, Jia-Yuan Chen
  • Patent number: 12173135
    Abstract: A plasticizer, which is biodegradable, has a molecule including a central structure, at least two connecting structures and at least one side-chain structure. The central structure includes at least one of a benzene derivative and at least one amino acid. The connecting structures are respectively connected to the central structure, wherein the connecting structures include a first connecting structure and a second connecting structure. The first connecting structure is an amine group, and the second connecting structure is a carboxyl group. The side-chain structure is a chain of multiple carbon atoms, and the side-chain structure is connected to at least one of the first connecting structure and the second connecting structure. An amide bond is formed as the side-chain structure connected to the amine group, and an ester bond is formed as the side-chain structure connected to the carboxyl group.
    Type: Grant
    Filed: November 24, 2020
    Date of Patent: December 24, 2024
    Assignee: LARGAN MEDICAL CO., LTD.
    Inventors: Wei-Yuan Chen, Tzu-Rong Lu, Yi-Ling Chen, Chun-Hung Teng
  • Publication number: 20240421110
    Abstract: An electronic device includes a substrate, a plurality of connecting pads, a plurality of conductive portions overlapped with the plurality of connecting pads, a plurality of conductive lines, a semiconductor component, and a bonding material. The semiconductor component is disposed on at least one of the plurality of connecting pads and includes an electrode. In a cross-sectional view, a first portion of the bonding material is disposed between the electrode and the at least one of the plurality of connecting pads, a second portion of the bonding material contacts a lateral surface of the electrode, and a boundary between the bonding material and the at least one of the plurality of connecting pads is irregular.
    Type: Application
    Filed: August 22, 2024
    Publication date: December 19, 2024
    Applicant: InnoLux Corporation
    Inventors: Jia-Yuan Chen, Tsung-Han Tsai
  • Publication number: 20240412774
    Abstract: The present disclosure provides a memory device, including a memory array, a tracking circuit, a memory controller, and a word line driver. A plurality of word lines are in communication with a plurality of memory cells of the memory array. The memory controller decodes a memory address of a memory access command to generate a decoded row address signal. The word line driver is configured to assert one of the plurality of word lines in response to the decoded row address signal. In response to detecting a switching event of a clock control signal derived from an input clock signal of the memory device, the memory controller asserts an tracking acceleration signal obtained from a tracking word line of the memory device to activate one or more first tracking arrays of the plurality of tracking arrays to pull down a voltage level of a tracking bit line.
    Type: Application
    Filed: June 6, 2023
    Publication date: December 12, 2024
    Inventors: CHIEN-YUAN CHEN, HAU-TAI SHIEH, CHENG HUNG LEE
  • Patent number: 12166009
    Abstract: A semiconductor device package includes a first conductive layer, a second conductive layer and a third conductive layer. The first conductive layer has a first pitch. The second conductive layer has a second pitch and is arranged at two different sides of the first conductive layer. The third conductive layer has a third pitch and is disposed above the first conductive layer and the second conductive layer. The third conductive layer is electrically connected to the first conductive layer. The first pitch is smaller than the third pitch, and the third pitch is smaller than the second pitch.
    Type: Grant
    Filed: August 29, 2023
    Date of Patent: December 10, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Tang-Yuan Chen, Meng-Kai Shih, Teck-Chong Lee, Shin-Luh Tarng, Chih-Pin Hung
  • Publication number: 20240404019
    Abstract: An image processing method is provided. The method includes the step of comparing each of the input pixels in an input image to a corresponding buffered pixel in a buffered image, and computing the difference value between the input pixel value of the input pixel and the buffered pixel value of the buffered pixel. The method further includes the step of generating a blended image based on the input pixel values and the corresponding difference values. The method further includes the step of determining whether a criterion associated with the difference value is met, for each of the difference values. The method further includes the step of updating, for each of the buffered pixels in the buffered image, the buffered pixel value based on the corresponding input pixel value if the criterion is met, and keeping the buffered pixel value unchanged if the criterion is not met.
    Type: Application
    Filed: May 29, 2023
    Publication date: December 5, 2024
    Inventors: Cheng-Yu SHIH, Hao-Tien CHIANG, Yuan-Chen CHENG, Ying-Wei WU, Tai-Hsiang HUANG, Ying-Jui CHEN, Chi-Cheng JU
  • Patent number: 12160727
    Abstract: A sound management system for a multimedia display apparatus includes: a first audio device built in a display apparatus to provide first audio, a second audio device separated from the display apparatus to provide second audio, a portable device separated from both the display and the second audio device, optionally being moved to the first or second position to receive and analyze either a first sound field at a first position or a second sound field at a second positions respectively formed by the first audio and the second audio, and a controller used to notify the first and/or second audio devices to adjust the first and/or second audio according to the analysis to synthesize either a first adjusted sound field at the first position or a second adjusted sound field at the second position with sound characteristics similar to that of a target sound audio.
    Type: Grant
    Filed: July 26, 2022
    Date of Patent: December 3, 2024
    Assignee: BenQ Corporation
    Inventors: Yuan-Chen Liao, Chen-Cheng Huang
  • Patent number: 12159479
    Abstract: An electronic device includes a light source and an optical sensor. The light source emits a light having a maximum light intensity at a first wavelength A. The optical sensor has a maximum response value at a second wavelength B, and receives a reflected portion of the light that is reflected by an object. The integral value of the light intensity of the light from the wavelength 380 nm to the first wavelength A is I1. The integral value of the light intensity of the light from the first wavelength A to the wavelength 780 nm is I2. The first wavelength A, the second wavelength B, the integral value I1, and the integral value I2 satisfy the following equation: (B?A)*(I2?I1)>0.
    Type: Grant
    Filed: October 18, 2023
    Date of Patent: December 3, 2024
    Assignee: INNOLUX CORPORATION
    Inventors: Jia-Yuan Chen, Tsung-Han Tsai
  • Patent number: 12159104
    Abstract: A method performed by an electronic device includes retrieving, from a first computing environment, a first set of structured documents that contains metadata for a first version of a workflow to be performed by a workflow engine, the first version of the workflow including a first set of workflow elements. The method further including retrieving, from a second computing environment, a second set of structured documents. The method determines whether a rule is to be applied, based on one but not both of the first and second sets of structured documents including at least one section for a workflow element having a type to which the rule applies, and generating a description of a change in the second version of the workflow relative to the first version of the workflow.
    Type: Grant
    Filed: August 26, 2022
    Date of Patent: December 3, 2024
    Assignee: Salesforce, Inc.
    Inventors: Nicholas Chun Yuan Chen, George John Murnock, Jr., Michael Christopher Olson, Karen Fidelak
  • Publication number: 20240389516
    Abstract: A garden shear may include a main body and two holding members. The main body has a pair of shear blades, and each of the shear blades has a first handle at one end and a through hole on the middle section thereof. Each of the first handles has one holding member disposed on the lower end thereof, and each of the holding members comprises a sleeve. A connecting opening is formed on the top of the sleeve, and the diameter of the connecting opening is gradually smaller from top to bottom. Each of the sleeves comprises a first coated member and a second coated member respectively coated on two side surfaces of the sleeve, and the second coated member is covered with an imitation carbon fiber texture.
    Type: Application
    Filed: May 23, 2023
    Publication date: November 28, 2024
    Inventor: Chin-Yuan Chen
  • Patent number: D1055661
    Type: Grant
    Filed: June 13, 2023
    Date of Patent: December 31, 2024
    Inventor: Chin-Yuan Chen
  • Patent number: D1055662
    Type: Grant
    Filed: June 23, 2023
    Date of Patent: December 31, 2024
    Inventor: Chin-Yuan Chen