Double mold memory card and its manufacturing method
A memory card comprising a substrate having opposed top and bottom surfaces and a plurality of terminals disposed on the bottom surface thereof. Mounted to the top surface of the substrate is at least one component which is itself electrically connected to the terminals of the substrate. Formed on the bottom surface of the substrate is a first encapsulation part. Formed on the top surface of the substrate is a second encapsulation part which encapsulates the component mounted thereto.
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Not Applicable
STATEMENT RE: FEDERALLY SPONSORED RESEARCH/DEVELOPMENTNot Applicable
BACKGROUND OF THE INVENTION1. Field of the Invention
The present invention relates generally to memory cards, and more particularly to a memory card (e.g., a multi-media card (MMC)) which is fabricated through the implementation of a two-stage molding process.
2. Description of the Related Art
As is well known in the electronics industry, memory cards are being used in increasing numbers to provide memory storage and other electronic functions for devices such as digital cameras, MP3 players, cellular phones, and personal digital assistants. In this regard, memory cards are provided in various formats, including multi-media cards and secure digital cards.
Typically, memory cards include multiple electronic components such as integrated circuit devices, semiconductor dies, passive components, and the like. The components are often interconnected using a circuit board substrate. Memory cards also include electrical contacts or terminals for providing an external interface to an insertion point or socket. These electrical contacts are typically disposed on one side or face of the circuit board substrate, with the electrical connection to the components mounted to the substrate being provided by conductive vias and traces which extend through and along the substrate.
In certain memory cards, a leadframe assembly is used as an alternative to the circuit board substrate, as is described in Applicant's co-pending U.S. application Ser. No. 09/956,190 entitled LEAD-FRAME METHOD AND ASSEMBLY FOR INTERCONNECTING CIRCUITS WITHIN A CIRCUIT MODULE filed Sep. 19, 2001.
In those memory card configurations which in employ the use of the above-described substrate having one or more electrical devices or components mounted thereto, such components are typically covered or protected by a cap or lid (sometimes referred to as a “skin”) which is separately fabricated and attached to the substrate. The cap is typically fabricated through the implementation of an injection molding process, and is subsequently adhesively secured to the substrate in a manner covering or shielding the components mounted thereto. The cap is typically fabricated such that when mounted to the substrate, the resultant memory card meets or achieves a desired a desired “form factor.” As will be recognized, the requirement of separately fabricating the cap significantly increases the manufacturing cost for the prior art memory card, in addition to decreasing yield rate due to the need to carry out a separate process or step to mechanically couple the cap to the substrate. This separate coupling process also increases the susceptibility of the internal components mounted to the substrate of being contaminated with various particles. The present invention addresses and overcomes these deficiencies of currently known memory cards by providing a memory card wherein the cap or lid is eliminated in favor of a two-stage molding process, These and other attributes of the present invention will be described in more detail below.
BRIEF SUMMARY OF THE INVENTIONIn accordance with the present invention, there is provided a double mold memory card wherein first and second encapsulation parts are separately formed on a substrate, and used as an alternative to a conventional cap or lid. The first and second encapsulation parts are formed via the implementation of a two stage molding process wherein the first encapsulation part is initially formed on a surface of the substrate of the memory card including the conductive contacts or terminals thereof, which is followed by the formation of a second encapsulation part on an opposed surface of the substrate having one or more electrical components mounted thereto and electrically connected to the terminals of the substrate. As such, the second encapsulation part effectively covers or encapsulates the component(s) of the memory card. The elimination of the separate cap or lid lowers manufacturing costs while increasing yield rate.
The present invention is best understood by reference to the following detailed description when read in conjunction with the accompanying drawings.
These, as well as other features of the present invention, will become more apparent upon reference to the drawings wherein:
Common reference numerals are used throughout the drawings and detailed description to indicate like elements.
DETAILED DESCRIPTION OF THE INVENTIONReferring now to the drawings wherein the showings are for purposes of illustrating a preferred embodiment of the present invention only, and not for purposes of limiting the same,
Mounted to the top surface 111 of the substrate 110 is a plurality of semiconductor parts or electronic components 120. As shown in
Those of ordinary skill in the art will recognize that the type, number and arrangement of components 120 shown in
In addition to the substrate and components 120, the memory card 100 comprises a first encapsulation part 130 which is formed on the bottom surface 112 of the substrate 110. As seen in
In addition to the first encapsulation part 130, the memory card 100 includes a second encapsulation part 140 which is formed on the top surface 111 of the substrate 110. Like the first encapsulation part 130, the second encapsulation part 140 is preferably formed to be of uniform thickness, and is adapted to protect the components 120 from the external environment. Since the second encapsulation part 140 effectively covers or encapsulates the components 120, the second encapsulation part 140 is significantly thicker than the first encapsulation part 130. The second encapsulation part 140 is also preferably formed from an epoxy mold compound, and is fabricated by filling or injecting such epoxy mold compound into a mold after placing the substrate 110 into a suitably shaped mold cavity thereof.
As seen in
Referring now to
Subsequent to the formation of the first encapsulation parts 130, the component(s) 120 are mounted and electrically connected to each of the substrates 110 in the above-described manner (
This disclosure provides exemplary embodiments of the present invention. The scope of the present invention is not limited by these exemplary embodiments. Numerous variations, whether explicitly provided for by the specification or implied by the specification, such as variations in structure, dimension, type of material and manufacturing process, may be implemented by one of skill in the art in view of this disclosure.
Claims
1. A memory card, comprising:
- a substrate having opposed top and bottom surfaces and a plurality of terminals disposed on the bottom surface thereof;
- at least one component mounted to the top surface of the substrate and electrically connected to the terminals thereof;
- a first encapsulation part formed on the bottom surface of the substrate; and
- a second encapsulation part formed on the top surface of the substrate and encapsulating the component mounted thereto, the second encapsulation part being completely separated from the first encapsulation part by the substrate;
- the first and second encapsulation parts each being exposed in the memory card.
2. The memory card of claim 1 wherein the first encapsulation part is formed to include an opening therein, the terminals of the substrate being exposed in the opening.
3. The memory card of claim 1 wherein:
- the second encapsulation part defines an opposed pair of sides; and
- a pair of coupling notches are formed in respective ones of the sides of the second encapsulation part in opposed relation to each other.
4. The memory of claim 1 wherein:
- the terminals of the substrate extend in spaced, generally parallel relation to each other;
- the second encapsulation part defines an opposed pair of peripheral edge segments which extend in spaced, generally parallel relation to the terminals; and
- a pair of guide slots are formed in respective ones of the peripheral edge segments in opposed relation to each other.
5. The memory card of claim 1 wherein the second encapsulation part includes a recess formed therein adjacent a peripheral edge segment of the second encapsulation part disposed furthest from the terminals.
6. The memory card of claim 1 wherein the first encapsulation part and the second encapsulation part are each fabricated from an epoxy mold compound.
7. The memory card of claim 1 wherein:
- the first encapsulation part is of a first thickness; and
- the second encapsulation part is of a second thickness which exceeds the first thickness.
8. The memory card of claim 1 comprising multiple components mounted to the top surface of the substrate and electrically connected to the terminals thereof.
9. The memory card of claim 1 wherein the first and second encapsulation parts are configured to impart a prescribed form factor to the memory card.
10. The memory card of claim 1 wherein the first encapsulation part is sized and configured to cover the entirety of the top surface of the substrate.
11. The memory card of claim 8 wherein the components are selected from the group consisting of:
- a semiconductor package;
- a semiconductor die;
- a passive component; and
- combinations thereof.
12. The memory card of claim 11 wherein:
- the semiconductor package and the passive component are surface mounted to the top surface of the substrate; and
- the semiconductor die is wire bonded to the substrate through the use of a conductive wire.
13. A method for fabricating a memory card, the method comprising the steps of:
- a) providing a substrate having opposed top and bottom surfaces and a plurality of terminals disposed on the bottom surface thereof;
- b) forming a first encapsulation part on the bottom surface of the substrate;
- c) mounting at least one component to the top surface of the substrate in a manner wherein the component is electrically connected to the terminals; and
- d) forming a second encapsulation part on the top surface of the substrate in a manner encapsulating the component mounted thereto;
- the first and second encapsulation parts formed in steps (b) and (d) each being exposed in the memory card and completely separated from each other by the substrate.
14. The method of claim 13 wherein step (b) comprises forming the first encapsulation part to include an opening therein, the terminals of the substrate being exposed in the opening.
15. The method of claim 13 wherein step (d) comprises forming a pair of coupling notches into respective ones of an opposed pair of sides of the second encapsulation part in opposed relation to each other.
16. The method of claim 13 wherein:
- step (d) comprises forming a pair of guide slots into respective ones of an opposed pair of peripheral edge segments of the encapsulation part which extend in spaced, generally parallel relation to the terminals.
17. The method of claim 13 wherein step (d) comprises forming a recess in the second encapsulation part along a peripheral edge segment thereof which is disposed furthest from the terminals.
18. The method of claim 13 wherein steps (b) and (d) comprise forming the first and second encapsulation parts from an epoxy mold compound.
19. The method of claim 13 wherein:
- step (b) comprises forming the first encapsulation part to be of a first thickness; and
- step (d) comprises forming the second encapsulation part to be of a second thickness which exceeds the first thickness.
20. The method of claim 13 wherein step (c) comprises mounting and electrically connecting a plurality of components to the substrate.
21. The method of claim 20 wherein step (c) comprises:
- 1) surface mounting at least one of the components to the substrate; and
- 2) wire bonding at least one of the components to the substrate.
22. A method for fabricating a memory card, the method comprising the steps of:
- a) providing a substrate having opposed top and bottom surfaces and a plurality of terminals disposed on the bottom surface thereof;
- b) applying a mold compound to the bottom surface of the substrate;
- c) mounting at least one component to the top surface of the substrate in a manner wherein the component is electrically connected to the terminals; and
- d) applying a mold compound to the top surface of the substrate in a manner encapsulating the component mounted thereto;
- the mold compound applied to the substrate in steps (b) and (d) being exposed in the memory card, with the mold compound applied to the bottom surface being completely separated from the mold compound applied to the top surface by the substrate.
23. A memory card, comprising:
- a substrate having opposed top and bottom surfaces and a plurality of terminals disposed on the bottom surface thereof,
- at least one component mounted to the top surface of the substrate and electrically connected to the terminals thereof;
- a first encapsulation part of a first thickness formed on the bottom surface of the substrate; and
- a second encapsulation part of a second thickness exceeding the first thickness formed on the top surface of the substrate and encapsulating the component mounted thereto, the second encapsulation part being completely separated from the first encapsulation part by the substrate;
- the first and second encapsulation parts each being exposed in the memory card.
24. A method for fabricating a memory card, the method comprising the steps of:
- a) providing a substrate having opposed top and bottom surfaces and a plurality of terminals disposed on the bottom surface thereof;
- b) applying a mold compound to the bottom surface of the substrate at a first thickness;
- c) mounting at least one component to the top surface of the substrate in a manner wherein the component is electrically connected to the terminals; and
- d) applying a mold compound to the top surface of the substrate at a second thickness which exceeds the first thickness and in a manner encapsulating the component mounted thereto;
- the mold compound applied to the substrate in steps (b) and (d) being exposed in the memory card, with the mold compound applied to the bottom surface being completely separated from the mold compound applied to the top surface by the substrate.
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Type: Grant
Filed: Jan 28, 2004
Date of Patent: Dec 15, 2009
Assignee: Amkor Technology, Inc. (Chandler, AZ)
Inventors: Chul Woo Park (Kangdong-gu), Suk Gu Ko (Kangdong-gu), Sang Jae Jang (Kwanggin-gu), Sung Su Park (Kwanggin-gu), Choon Heung Lee (Kwangju-shi)
Primary Examiner: Tuan T Dinh
Attorney: Stetina Brunda Garred & Brucker
Application Number: 10/766,101
International Classification: H05K 7/02 (20060101); H05K 7/06 (20060101); H05K 7/08 (20060101); H05K 7/10 (20060101);