Heat insulator cover of semiconductor manufacturing apparatus

Description

FIG. 1 is a front, top and right side perspective view of a heat insulator cover of semiconductor manufacturing apparatus showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof; and

FIG. 8 is a cross sectional view taken along line 8-8 in FIG. 2 thereof; and,

FIG. 9 is a cross sectional view taken along line 9-9 in FIG. 2.

The dashed-dot dashed broken lines define the bounds of the claimed design and form no part thereof. The evenly spaced broken lines represent the portions of the heat insulator cover of semiconductor manufacturing apparatus that form no part of the claimed design. The dot-dashed broken line arrows in FIG. 2 are used to identify the cross sectional views and form no part of the claimed design.

Claims

The ornamental design for a heat insulator cover of semiconductor manufacturing apparatus, as shown and described.