Cover ring for a plasma processing apparatus
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This application contains subject matter related to the following co-pending U.S. design patent applications:
Application Ser. No. 29/610,995, filed herewith and entitled “Electrode Cover for a Plasma Processing Apparatus”;
Application Ser. No. 29/610,996, filed herewith and entitled “Electrode Cover for a Plasma Processing Apparatus”;
Application Ser. No. 29/610,998, filed herewith and entitled “Ring for a Plasma Processing Apparatus”; and
Application Ser. No. 29/611,001, filed herewith and entitled “Discharge Chamber for a Plasma Processing Apparatus”.
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Claims
The ornamental design for a cover ring for a plasma processing apparatus, as shown and described.
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Type: Grant
Filed: Jul 18, 2017
Date of Patent: Feb 12, 2019
Assignee: Hitachi High-Technologies Corporation (Tokyo)
Inventors: Takamasa Ichino (Tokyo), Kohei Sato (Tokyo), Kazunori Nakamoto (Tokyo)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/610,999