Top plate for semiconductor manufacturaing equipment

- NuFlare Technology, Inc.
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Description

FIG. 1 is a perspective view of a top plate for semiconductor manufacturaing equipment showing our new design;

FIG. 2 is a front elevational view thereof, the rear elevational view being a mirror image thereof;

FIG. 3 is a right-side elevational view thereof, the left-side elevational view being a mirror image thereof;

FIG. 4 is a top plan view thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is another perspective view thereof;

FIG. 7 is a cross-sectional view taken along a line 7-7 of FIG. 4; and,

FIG. 8 is an enlarged view of portion 8 enclosed by a dot-dot-dash line in FIG. 6.

The broken lines shown are included for the purpose of illustrating portions of the design which form no part of the claimed design. The dot-dash lines indicate the boundary between the claimed portion and forms no part of the claimed design.

Claims

The ornamental design for a top plate for semiconductor manufacturaing equipment, as shown and described.

Referenced Cited
U.S. Patent Documents
D404370 January 19, 1999 Kimura
5855680 January 5, 1999 Soininen
8999063 April 7, 2015 Ito
D827592 September 4, 2018 Ichino
20120263569 October 18, 2012 Priddy
20210082737 March 18, 2021 Kim
Foreign Patent Documents
2016207932 December 2016 JP
D208042 November 2020 TW
Other references
  • Taiwanese Office Action (TW OA) dated Feb. 25, 2022 issued in Taiwanese patent application No. 110302988 and its English translation.
Patent History
Patent number: D1016761
Type: Grant
Filed: Jun 10, 2021
Date of Patent: Mar 5, 2024
Assignee: NuFlare Technology, Inc. (Kanagawa)
Inventors: Takuto Umetsu (Kanagawa), Masayoshi Yajima (Kanagawa), Kunihiko Suzuki (Kanagawa)
Primary Examiner: Shawn T Gingrich
Assistant Examiner: Caleb M Baker
Application Number: 29/794,124