Top plate for semiconductor manufacturaing equipment
The broken lines shown are included for the purpose of illustrating portions of the design which form no part of the claimed design. The dot-dash lines indicate the boundary between the claimed portion and forms no part of the claimed design.
Claims
The ornamental design for a top plate for semiconductor manufacturaing equipment, as shown and described.
| D404370 | January 19, 1999 | Kimura |
| 5855680 | January 5, 1999 | Soininen |
| 8999063 | April 7, 2015 | Ito |
| D827592 | September 4, 2018 | Ichino |
| 20120263569 | October 18, 2012 | Priddy |
| 20210082737 | March 18, 2021 | Kim |
| 2016207932 | December 2016 | JP |
| D208042 | November 2020 | TW |
- Taiwanese Office Action (TW OA) dated Feb. 25, 2022 issued in Taiwanese patent application No. 110302988 and its English translation.
Type: Grant
Filed: Jun 10, 2021
Date of Patent: Mar 5, 2024
Assignee: NuFlare Technology, Inc. (Kanagawa)
Inventors: Takuto Umetsu (Kanagawa), Masayoshi Yajima (Kanagawa), Kunihiko Suzuki (Kanagawa)
Primary Examiner: Shawn T Gingrich
Assistant Examiner: Caleb M Baker
Application Number: 29/794,124