Top plate for semiconductor manufacturaing equipment
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The broken lines shown are included for the purpose of illustrating portions of the design which form no part of the claimed design. The dot-dash lines indicate the boundary between the claimed portion and forms no part of the claimed design.
Claims
The ornamental design for a top plate for semiconductor manufacturaing equipment, as shown and described.
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8999063 | April 7, 2015 | Ito |
D827592 | September 4, 2018 | Ichino |
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20210082737 | March 18, 2021 | Kim |
2016207932 | December 2016 | JP |
D208042 | November 2020 | TW |
- Taiwanese Office Action (TW OA) dated Feb. 25, 2022 issued in Taiwanese patent application No. 110302988 and its English translation.
Type: Grant
Filed: Jun 10, 2021
Date of Patent: Mar 5, 2024
Assignee: NuFlare Technology, Inc. (Kanagawa)
Inventors: Takuto Umetsu (Kanagawa), Masayoshi Yajima (Kanagawa), Kunihiko Suzuki (Kanagawa)
Primary Examiner: Shawn T Gingrich
Assistant Examiner: Caleb M Baker
Application Number: 29/794,124