Heat dissipation module
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Description
The broken lines in the drawings illustrate pod ions of the heat dissipation module that form no part of the claimed design.
Claims
The ornamental design for a heat dissipation module, as shown and described.
Referenced Cited
U.S. Patent Documents
Foreign Patent Documents
Other references
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Patent History
Patent number: D1026838
Type: Grant
Filed: Apr 26, 2022
Date of Patent: May 14, 2024
Assignee: TAIWAN MICROLOOPS CORP. (New Taipei)
Inventor: Chun-Hung Lin (New Taipei)
Primary Examiner: April Rivas
Application Number: 29/836,398
Type: Grant
Filed: Apr 26, 2022
Date of Patent: May 14, 2024
Assignee: TAIWAN MICROLOOPS CORP. (New Taipei)
Inventor: Chun-Hung Lin (New Taipei)
Primary Examiner: April Rivas
Application Number: 29/836,398
Classifications
Current U.S. Class:
Heat Sink (D13/179)