Heat dissipation module
Description
The broken lines in the drawings illustrate pod ions of the heat dissipation module that form no part of the claimed design.
Claims
The ornamental design for a heat dissipation module, as shown and described.
Referenced Cited
U.S. Patent Documents
Foreign Patent Documents
Other references
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Patent History
Patent number: D1026838
Type: Grant
Filed: Apr 26, 2022
Date of Patent: May 14, 2024
Assignee: TAIWAN MICROLOOPS CORP. (New Taipei)
Inventor: Chun-Hung Lin (New Taipei)
Primary Examiner: April Rivas
Application Number: 29/836,398
Type: Grant
Filed: Apr 26, 2022
Date of Patent: May 14, 2024
Assignee: TAIWAN MICROLOOPS CORP. (New Taipei)
Inventor: Chun-Hung Lin (New Taipei)
Primary Examiner: April Rivas
Application Number: 29/836,398
Classifications
Current U.S. Class:
Heat Sink (D13/179)