Heat dissipation module

- TAIWAN MICROLOOPS CORP.
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Description

FIG. 1 is a perspective view of a heat dissipation module showing my new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a top view thereof;

FIG. 7 is a bottom view thereof; and,

FIG. 8 is a reference view showing the heat dissipation module.

The broken lines in the drawings illustrate pod ions of the heat dissipation module that form no part of the claimed design.

Claims

The ornamental design for a heat dissipation module, as shown and described.

Referenced Cited
U.S. Patent Documents
D567771 April 29, 2008 Wu
D715750 October 21, 2014 Mira
D722574 February 17, 2015 Mira
D954005 June 7, 2022 Inagaki
D971862 December 6, 2022 Inagaki
20160219756 July 28, 2016 Sun
20170307299 October 26, 2017 Huang
20190128617 May 2, 2019 Mira
20190170446 June 6, 2019 He
20200393201 December 17, 2020 Watanabe
20210018272 January 21, 2021 Inagaki
20230213288 July 6, 2023 Wang
20230337398 October 19, 2023 Lin
20230349644 November 2, 2023 Lin
20230354552 November 2, 2023 Lin
20230358482 November 9, 2023 Liu
Foreign Patent Documents
218244170 January 2023 CN
116952033 October 2023 CN
116997131 November 2023 CN
Other references
  • Intechopen, “Heat Pipe and Phase Change Heat Transfer Technologies for Electronics Cooling”, Fig. 16, Published Jun. 15, 2016. (https://www.intechopen.com/chapters/50699) (Year: 2016).
Patent History
Patent number: D1026838
Type: Grant
Filed: Apr 26, 2022
Date of Patent: May 14, 2024
Assignee: TAIWAN MICROLOOPS CORP. (New Taipei)
Inventor: Chun-Hung Lin (New Taipei)
Primary Examiner: April Rivas
Application Number: 29/836,398
Classifications
Current U.S. Class: Heat Sink (D13/179)