Heatsink
Latest Furukawa Electric Co., Ltd. Patents:
- Compound superconducting twisted wire and rewinding method for compound superconducting twisted wire
- HEAT SINK
- Multi-core optical amplifying fiber, multi-core optical fiber amplifier, and optical communication system
- Power converter, method of controlling power converter, and computer readable recording medium
- FLAT CABLE ASSEMBLY AND ROTARY CONNECTOR DEVICE
Description
The even broken lines illustrate environment and form no part of the claimed design. The dot-dash broken lines represent boundary lines and form no part of the claimed design.
Claims
We claim the ornamental design for a heatsink, as shown and described.
Referenced Cited
U.S. Patent Documents
Foreign Patent Documents
Other references
6634800 | October 21, 2003 | Suematsu et al. |
D541232 | April 24, 2007 | Lee et al. |
D561710 | February 12, 2008 | Lin |
D561711 | February 12, 2008 | Lin |
D582359 | December 9, 2008 | Chang |
D587217 | February 24, 2009 | Yun |
D660256 | May 22, 2012 | Yoon |
D715750 | October 21, 2014 | Mira |
D722573 | February 17, 2015 | Mira |
D742337 | November 3, 2015 | Watanabe |
D795821 | August 29, 2017 | Mira et al. |
D803169 | November 21, 2017 | Mira et al. |
D805042 | December 12, 2017 | Huang |
D829673 | October 2, 2018 | Mira et al. |
D833988 | November 20, 2018 | Huang |
D905647 | December 22, 2020 | Mira |
11150028 | October 19, 2021 | Ito |
20100002380 | January 7, 2010 | Yao et al. |
20100206521 | August 19, 2010 | Kwan |
20100270007 | October 28, 2010 | Lin |
20110192026 | August 11, 2011 | Chen |
20120145356 | June 14, 2012 | Paschkewitz |
20130044433 | February 21, 2013 | Lee |
20150043869 | February 12, 2015 | Kuo |
20160298909 | October 13, 2016 | Yeh |
20160313067 | October 27, 2016 | Shieh |
20170307299 | October 26, 2017 | Huang |
20180128552 | May 10, 2018 | Ito |
20180284356 | October 4, 2018 | Haase et al. |
20190170446 | June 6, 2019 | He |
20190269035 | August 29, 2019 | Saturley |
20200191494 | June 18, 2020 | Ito |
20200326131 | October 15, 2020 | Hikichi |
20200355443 | November 12, 2020 | Tochigi |
20210018272 | January 21, 2021 | Inagaki |
20210208385 | July 8, 2021 | Pascale |
20210318072 | October 14, 2021 | Ito |
1537917 | November 2015 | JP |
D1537917 | November 2015 | JP |
- ETeknix, “Cooler Master TPC 800 Vapour Chamber CPU Cooler Review”, Published “9 Years ago”, at latest Nov. 8, 2012 as indicated by comment replies. (https://www.eteknix.com/cooler-master-tpc-800-vapour-chamber-cpu-cooler-review/all/1/) (Year: 2012).
- ETeknix, “Noctua NH-D9L Dual-Tower CPU Cooler Review”, Published “6 Years ago”, at latest Jan. 20, 2016 as indicated by comment replies. (https://www.eteknix.com/noctua-nh-d9l-dual-tower-cpu-cooler-review/2/) (Year: 2016).
- Noctua, “Industrial Applications”, Cached from web.archive.og on Nov. 19, 2017. (https://noctua.at/en/industrial-applications)(https://web.archive.org/web/20171119165910/https://noctua.at/en/industrial-applications) (Year: 2017).
- U.S. Appl. No. 29/727,572 titled “Heat Sink” filed Mar. 11, 2020.
- U.S. Appl. No. 29/727,573 titled “Heat Sink” filed Mar. 11, 2020.
- U.S. Appl. No. 29/727,570 titled “Heat Sink” filed Mar. 11, 2020.
Patent History
Patent number: D971862
Type: Grant
Filed: Jun 28, 2019
Date of Patent: Dec 6, 2022
Assignee: Furukawa Electric Co., Ltd. (Tokyo)
Inventors: Yoshikatsu Inagaki (Tokyo), Shuta Hikichi (Tokyo), Hiroshi Sakai (Tokyo)
Primary Examiner: April Rivas
Application Number: 29/696,679
Type: Grant
Filed: Jun 28, 2019
Date of Patent: Dec 6, 2022
Assignee: Furukawa Electric Co., Ltd. (Tokyo)
Inventors: Yoshikatsu Inagaki (Tokyo), Shuta Hikichi (Tokyo), Hiroshi Sakai (Tokyo)
Primary Examiner: April Rivas
Application Number: 29/696,679
Classifications
Current U.S. Class:
Heat Sink (D13/179)