Heatsink
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Description
The even broken lines illustrate environment that forms no part of the claimed design. The dot-dash broken lines represent boundary lines and form no part of the claimed design.
Claims
The ornamental design for a heatsink, as shown and described.
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Foreign Patent Documents
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- U.S. Appl. No. 29/727,573 titled “Heat Sink” filed Mar. 11, 2020.
- U.S. Appl. No. 29/727,570 titled “Heat Sink” filed Mar. 11, 2020.
- U.S. Appl. No. 29/696,679 titled “Heatsink” filed Jun. 28, 2019.
- Eteknix, “Cooler Master TPC 800 Vapour Chamber CPU Cooler Review”, Published “9 Years ago”, at latest Nov. 8, 2012 as indicated by comment replies, (https ://www .eteknix.com/cooler-master-tpc-800-vapour-chamber-cpu-cooler-review/all/1 /) (Year: 2012).
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Patent History
Patent number: D954005
Type: Grant
Filed: Mar 11, 2020
Date of Patent: Jun 7, 2022
Assignee: Furukawa Electric Co., Ltd. (Tokyo)
Inventors: Yoshikatsu Inagaki (Tokyo), Shuta Hikichi (Tokyo)
Primary Examiner: Rosemary K Tarcza
Assistant Examiner: Seth David Kumpf
Application Number: 29/727,572
Type: Grant
Filed: Mar 11, 2020
Date of Patent: Jun 7, 2022
Assignee: Furukawa Electric Co., Ltd. (Tokyo)
Inventors: Yoshikatsu Inagaki (Tokyo), Shuta Hikichi (Tokyo)
Primary Examiner: Rosemary K Tarcza
Assistant Examiner: Seth David Kumpf
Application Number: 29/727,572
Classifications
Current U.S. Class:
Heat Sink (D13/179)