Heat reflector for semiconductor manufacturing equipment

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Description

FIG. 1 is a front, top and right side perspective view of a heat reflector for semiconductor manufacturing equipment, showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof;

FIG. 8 is a cross-sectional view taken along line 8-8 in FIG. 2; and,

FIG. 9 is an enlarged portion view taken from the encircled portion, labeled “FIG. 9,” in FIG. 8.

The dot-dashed lines show the boundary of the enlarged portion view of FIG. 9 in FIGS. 8 and 9, and form no part of the claimed design.

The surface members shown in FIGS. 1 and 2 are made of a transparent material with a mirror finish inside the frame of the transparent material.

Claims

The ornamental design for a heat reflector for semiconductor manufacturing equipment as shown and described.

Referenced Cited
U.S. Patent Documents
5088006 February 11, 1992 del Puerto
6035100 March 7, 2000 Bierman
6108491 August 22, 2000 Anderson
6815645 November 9, 2004 Abe
7772527 August 10, 2010 Choi
D654883 February 28, 2012 Honma
D654884 February 28, 2012 Honma
D804437 December 5, 2017 Kantor
D818961 May 29, 2018 Yamaguchi
D849422 May 28, 2019 Tai
10283637 May 7, 2019 Hung
10453713 October 22, 2019 Cho
D924823 July 13, 2021 Saiki et al.
D981972 March 28, 2023 Morita
D1003834 November 7, 2023 Okajima
Foreign Patent Documents
307244983 September 2021 CN
1624353 February 2019 JP
Other references
  • 113 Applied Materials Reflector Plate, Inject, 300MM Radiance Plus 0041-12156,https://www.ebay.com/itm/114949674079, 2024. (Year: 2024).
Patent History
Patent number: D1053157
Type: Grant
Filed: Jan 24, 2023
Date of Patent: Dec 3, 2024
Assignee: KOKUSAI ELECTRIC CORPORATION (Tokyo)
Inventor: Akihiro Sato (Toyama)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/883,098