Semiconductor power module for vehicles

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Description

1. Semiconductor power module for vehicles

1.1 : Perspective

1.2 : Top

1.3 : Bottom

1.4 : Front

1.5 : Back

1.6 : Right

1.7 : Left

The broken lines illustrate portions of the claimed semiconductor power module that form no part of the claimed design.

Claims

The ornamental design for semiconductor power module for vehicles as shown and described.

Referenced Cited
U.S. Patent Documents
D318847 August 6, 1991 Reed
D775091 December 27, 2016 Edenharter
D775593 January 3, 2017 Edenharter
D776071 January 10, 2017 Edenharter
D827591 September 4, 2018 Ikeda
D903612 December 1, 2020 Soyano
D942404 February 1, 2022 Soyano
D942405 February 1, 2022 Soyano
11251108 February 15, 2022 Arai
D976852 January 31, 2023 Wu
D983759 April 18, 2023 Yoshida
20040227231 November 18, 2004 Maly
20170006721 January 5, 2017 Soyano
Foreign Patent Documents
308617434 May 2024 CN
006603619-0001 July 2021 EM
7568132 October 2024 JP
301216396.0000 May 2023 KR
Other references
  • Eigbt. Link: https://www.eigbt.com/product/DTT-1-060024000.html. Visited Jul. 26, 2024. DTT-1-060024000 Powerex IGBTs Sic Modules. (Year: 2024).
  • Semiconductor today. Link: https://www.semiconductor-today.com/news_items/2023/apr/infineon-280423.shtml. Apr. 28, 2023. Infineon introduces HybridPACK Drive G2 automotive power module for EV traction inverters. (Year: 2023).
Patent History
Patent number: D1078668
Type: Grant
Filed: Oct 2, 2023
Date of Patent: Jun 10, 2025
Inventors: Matthias Hager (Langenzenn), Ingo Bogen (Nuremberg)
Primary Examiner: Lauren D McVey
Application Number: 35/518,968