Semiconductor module

- FUJI ELECTRIC CO., LTD.
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Description

FIG. 1 is a front view of a semiconductor module according to our new design;

FIG. 2 is a rear view of the semiconductor module of FIG. 1;

FIG. 3 is a top side view of the semiconductor module of FIG. 1;

FIG. 4 is a bottom side view of the semiconductor module of FIG. 1;

FIG. 5 is a left view of the semiconductor module of FIG. 1;

FIG. 6 is a right view of the semiconductor module of FIG. 1; and,

FIG. 7 is a perspective view illustrating the front, the top, and the left side of the semiconductor module of FIG. 1.

The thinner lines other than a thicker line in the front view, the rear view, the left side view the right side view, the top view, the bottom view, and the perspective view represents a shape of a three-dimensional shape.

Claims

The ornamental design for a semiconductor module, as shown and described.

Referenced Cited
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D875058 February 11, 2020 Sawada
D884662 May 19, 2020 Itoh
D903612 December 1, 2020 Soyano
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Foreign Patent Documents
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Other references
  • Semiconductior Modules. (Design—© Questel) orbit.com. [Online PDF compilation of references] 55pgs. Print Dates Range Aug. 13, 2020-Mar. 26, 2019 [Retrieved Jul. 20, 2021].
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Patent History
Patent number: D942405
Type: Grant
Filed: Jun 28, 2019
Date of Patent: Feb 1, 2022
Assignee: FUJI ELECTRIC CO., LTD. (Kawasaki)
Inventors: Shin Soyano (Shiojiri), Daisuke Inoue (Matsumoto)
Primary Examiner: Manpreet S Matharu
Assistant Examiner: Suzanne E Tisdell
Application Number: 29/696,618