Semiconductor module
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The thinner lines other than a thicker line in the front view, the rear view, the left side view the right side view, the top view, the bottom view, and the perspective view represents a shape of a three-dimensional shape.
Claims
The ornamental design for a semiconductor module, as shown and described.
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Type: Grant
Filed: Jun 28, 2019
Date of Patent: Feb 1, 2022
Assignee: FUJI ELECTRIC CO., LTD. (Kawasaki)
Inventors: Shin Soyano (Shiojiri), Daisuke Inoue (Matsumoto)
Primary Examiner: Manpreet S Matharu
Assistant Examiner: Suzanne E Tisdell
Application Number: 29/696,616