Power semiconductor module
Description
Claims
The ornamental design for a power semiconductor module as shown and described.
Referenced Cited
U.S. Patent Documents
Foreign Patent Documents
Other references
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- Silicon Carbide Overmold Power Module on Cooler, date posted unavailable, data retrieved from the internet at https://www.vitesco-technologies.com/en-us/products/silicon-carbide-overmold-power-module-on-cooler (Year: 2025).
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Patent History
Patent number: D1099055
Type: Grant
Filed: Aug 31, 2023
Date of Patent: Oct 21, 2025
Assignee: XPT EDS (Hefei) Co., Ltd. (Hefei)
Inventors: Zihao Zhao (Shanghai), Xiaogang Wang (Shanghai), Fang Qi (Shanghai), Daohui Li (Shanghai)
Primary Examiner: Barbara Fox
Assistant Examiner: Lorna M Georges
Application Number: 29/901,352
Type: Grant
Filed: Aug 31, 2023
Date of Patent: Oct 21, 2025
Assignee: XPT EDS (Hefei) Co., Ltd. (Hefei)
Inventors: Zihao Zhao (Shanghai), Xiaogang Wang (Shanghai), Fang Qi (Shanghai), Daohui Li (Shanghai)
Primary Examiner: Barbara Fox
Assistant Examiner: Lorna M Georges
Application Number: 29/901,352
Classifications
Current U.S. Class:
Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)