Power semiconductor module

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Description

FIG. 1 is a right, front, top perspective view of a power semiconductor module showing our new design;

FIG. 2 is a front elevation view thereof;

FIG. 3 is a left side elevation view thereof;

FIG. 4 is a top plan view thereof; and,

FIG. 5 is a bottom plan view thereof.

The broken lines are shown for environmental purposes only and form no part of the claimed design.

All surfaces not shown form no part of the claimed design.

Claims

The ornamental design for a power semiconductor module, as shown and as described.

Referenced Cited
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Other references
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Patent History
Patent number: D1042375
Type: Grant
Filed: May 12, 2022
Date of Patent: Sep 17, 2024
Assignee: ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP (Toronto)
Inventors: Zhiqiang Niu (Santa Clara, CA), Bum-Seok Suh (Seongnam), Jong-Mu Lee (Yongin-si), Jia-long Yuan (Shanghai), Junho Lee (Suwon-si), Xiaorong Ge (Pleasanton, CA)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/838,478