Light-emitting diode package

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Description

FIG. 1 is a top perspective view of one embodiment of a light-emitting diode package;

FIG. 2 is a side view of the light-emitting diode package of FIG. 1;

FIG. 3 is an opposing side view of the light-emitting diode package of FIG. 1;

FIG. 4 is an end view of the light-emitting diode package of FIG. 1;

FIG. 5 is an opposing end view of the light-emitting diode package of FIG. 1;

FIG. 6 is a top view of the light-emitting diode package of FIG. 1;

FIG. 7 is a bottom view of the light-emitting diode package of FIG. 1;

FIG. 8 is a bottom perspective view of the light-emitting diode package of FIG. 1;

FIG. 9 is a top perspective view of another embodiment of a light-emitting diode package;

FIG. 10 is a side view of the light-emitting diode package of FIG. 9;

FIG. 11 is an opposing side view of the light-emitting diode package of FIG. 9;

FIG. 12 is an end view of the light-emitting diode package of FIG. 9;

FIG. 13 is an opposing end view of the light-emitting diode package of FIG. 9;

FIG. 14 is a top view of the light-emitting diode package of FIG. 9;

FIG. 15 is a bottom view of the light-emitting diode package of FIG. 9; and

FIG. 16 is a bottom perspective view of the light-emitting diode package of FIG. 9;

FIG. 17 is a top perspective view of another embodiment of a light-emitting diode package;

FIG. 18 is a side view of the light-emitting diode package of FIG. 17;

FIG. 19 is an opposing side view of the light-emitting diode package of FIG. 17;

FIG. 20 is an end view of the light-emitting diode package of FIG. 17;

FIG. 21 is an opposing end view of the light-emitting diode package of FIG. 17;

FIG. 22 is a top view of the light-emitting diode package of FIG. 17;

FIG. 23 is a bottom view of the light-emitting diode package of FIG. 17; and

FIG. 24 is a bottom perspective view of the light-emitting diode package of FIG. 17;

FIG. 25 is a top perspective view of another embodiment of a light-emitting diode package;

FIG. 26 is a side view of the light-emitting diode package of FIG. 25;

FIG. 27 is an opposing side view of the light-emitting diode package of FIG. 25;

FIG. 28 is an end view of the light-emitting diode package of FIG. 25;

FIG. 29 is an opposing end view of the light-emitting diode package of FIG. 25;

FIG. 30 is a top view of the light-emitting diode package of FIG. 25;

FIG. 31 is a bottom view of the light-emitting diode package of FIG. 25; and,

FIG. 32 is a bottom perspective view of the light-emitting diode package of FIG. 25.

The broken lines shown in the drawings depict portions of the light-emitting diode package that form no part of the claimed design.

The dot-dashed broken lines shown in the drawings depict portions of the light-emitting diode package that represent boundaries of the claimed design and are not part of the claimed design.

Claims

The ornamental design for a light-emitting diode package, as shown and described.

Referenced Cited
U.S. Patent Documents
D491897 June 22, 2004 Kamada
D555111 November 13, 2007 Yen
D568832 May 13, 2008 Kang
D572670 July 8, 2008 Ono
D573550 July 22, 2008 Lee
D576574 September 9, 2008 Kobayakawa
D578671 October 14, 2008 Kanayama
D581884 December 2, 2008 Yen
D584699 January 13, 2009 Bando
D591696 May 5, 2009 Okada
D591697 May 5, 2009 Andrews
D596592 July 21, 2009 Yong
D596593 July 21, 2009 Yong
D618636 June 29, 2010 Hsieh
D630171 January 4, 2011 Hsieh
D637565 May 10, 2011 Wu
D650341 December 13, 2011 Kuwaharada
D662902 July 3, 2012 Shieh
D670010 October 30, 2012 Lin
D674361 January 15, 2013 Lin
D681573 May 7, 2013 Andrews
D686364 July 16, 2013 Liu
D691973 October 22, 2013 Donofrio
D693317 November 12, 2013 Kobayashi
D703348 April 22, 2014 Reiherzer
D709464 July 22, 2014 Abare
D713804 September 23, 2014 Britt
10991861 April 27, 2021 Bergmann
20050242708 November 3, 2005 Keong
20080099775 May 1, 2008 Yu
20130033866 February 7, 2013 Lai
20240413281 December 12, 2024 Favale, Jr. et al.
20240413282 December 12, 2024 Favale, Jr. et al.
20250038153 January 30, 2025 Favale, Jr. et al.
Other references
  • Infrared LEDs, published date unavailable, retrieved Nov. 13, 2025, https://www.futureelectronics.com/resources/featured-products/ams-osram-ir6-next-generation-infrared-leds (Year: 2025).
  • Notice of Refusal for Japanese Patent Application No. 2025-003214, mailed Jun. 26, 2025, 4 pages.
  • U.S. Appl. No. 18/207,399, filed Jun. 8, 2023.
  • U.S. Appl. No. 18/508,373, filed Nov. 14, 2023.
  • U.S. Appl. No. 18/597,406, filed Mar. 6, 2024.
  • U.S. Appl. No. 18/604,866, filed Mar. 14, 2024.
  • U.S. Appl. No. 18/656,839, filed May 7, 2024.
  • Office Action for Mexican Patent Application No. MX/f/2025/000535, mailed Feb. 27, 2025, 8 pages.
  • Office Action for Mexican Patent Application No. MX/f/2025/000535, mailed Nov. 19, 2025, 10 pages.
  • Examination Report for Canadian Patent Application No. 246689, mailed Dec. 29, 2025, 2 pages.
  • Examination Report for Canadian Patent Application No. 237510, mailed Oct. 6, 2025, 2 pages.
  • First Office Action for Chinese Patent Application No. 202530073246.0, mailed Oct. 30, 2025, 2 pages.
  • Notice of Reasons for Refusal for Japanese Patent Application No. 2025-019078, mailed Feb. 12, 2026, 4 pages.
  • Examination Report for Canadian Patent Application No. 249285, mailed Jun. 2, 2026, 3 pages.
  • Notice of Reasons for Refusal for Japanese Patent Application No. 2025-003214, mailed May 21, 2026, 8 pages.
  • Notice of Reasons for Refusal for Japanese Patent Application No. 2026-008657, mailed May 28, 2026, 4 pages.
Patent History
Patent number: D1146848
Type: Grant
Filed: Aug 20, 2024
Date of Patent: Sep 8, 2026
Assignee: CreeLED, Inc. (Durham, NC)
Inventors: Joseph M. Favale, Jr. (Cary, NC), Robert David Schmidt (Wake Forest, NC), Christopher P. Hussell (Raleigh, NC), JuZuo Sheng (Huizhou), Chak Hau Charles Pang (Fanling)
Primary Examiner: Shawn T Gingrich
Assistant Examiner: Bria' L Simmons-Holloway
Application Number: 29/958,433
Classifications