Temporary package for semiconductor dice

- Micron Technology, Inc.
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Description

FIG. 1 is an enlarged top perspective view of a temporary package for semiconductor dice showing my new design;

FIG. 2 is a left side elevational view thereof;

FIG. 3 is a right side elevational view thereof;

FIG. 4 is a top plan view thereof;

FIG. 5 is a front side elevational view thereof;

FIG. 6 is a bottom plan view thereof; and,

FIG. 7 is a rear side elevation view thereof.

Referenced Cited
U.S. Patent Documents
D394844 June 2, 1998 Farnworth et al.
5173451 December 22, 1992 Kinsman et al.
5302891 April 12, 1994 Wood et al.
5408190 April 18, 1995 Wood et al.
5440240 August 8, 1995 Wood et al.
5451165 September 19, 1995 Cearley-Cabbiness et al.
5495179 February 27, 1996 Wood et al.
5517125 May 14, 1996 Posedel et al.
5519332 May 21, 1996 Wood et al.
5530376 June 25, 1996 Lim et al.
5541525 July 30, 1996 Wood et al.
5543725 August 6, 1996 Lim et al.
5581195 December 3, 1996 Lee et al.
5742169 April 21, 1998 Akram et al.
Other references
  • Van Zant, Peter, Microchip Fabrication--A Practical Guide To Semiconductor Processing, Second Edition, 1990, pg. 493.
Patent History
Patent number: D401567
Type: Grant
Filed: Apr 25, 1997
Date of Patent: Nov 24, 1998
Assignee: Micron Technology, Inc. (Boise, ID)
Inventors: Warren M. Farnworth (Nampa, ID), Alan G. Wood (Boise, ID), David R. Hembree (Boise, ID), Salman Akram (Boise, ID)
Primary Examiner: Brian N. Vinson
Attorney: Stephen A. Gratton
Application Number: 0/70,005
Classifications
Current U.S. Class: Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)
International Classification: 1303;