Temporary package for semiconductor dice

- Micron Technology, Inc.
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Description

FIG. 1 is an enlarged top perspective view of a temporary package for semiconductor dice showing our new design;

FIG. 2 is a left side elevational view thereof;

FIG. 3 is a right side elevational view thereof;

FIG. 4 is a top plan view thereof;

FIG. 5 is a front side elevational view thereof;

FIG. 6 is a bottom plan view thereof; and,

FIG. 7 is a rear side elevation view thereof.

Referenced Cited
U.S. Patent Documents
D317592 June 18, 1991 Yoshizawa
D359028 June 6, 1995 Siegel et al.
5053853 October 1, 1991 Haj-Ali-Ahmadi et al.
5155067 October 13, 1992 Wood et al.
5173451 December 22, 1992 Kinsman et al.
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5451165 September 19, 1995 Cearley-Cabbiness et al.
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5495179 February 27, 1996 Wood et al.
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Other references
  • 1994 DRAM Data Book, Micron Semiconductor, Inc., pp. 7-7 - 7-13, Apr., 1994 .
Patent History
Patent number: D402638
Type: Grant
Filed: Apr 25, 1997
Date of Patent: Dec 15, 1998
Assignee: Micron Technology, Inc. (Boise, ID)
Inventors: Warren M. Farnworth (Nampa, ID), Alan G. Wood (Boise, ID), David R. Hembree (Boise, ID), Salman Akram (Boise, ID)
Primary Examiner: M. H. Tung
Attorney: Stephen A. Gratton
Application Number: 0/70,029
Classifications
Current U.S. Class: Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)
International Classification: 1303;