Semiconductor element

- Sony Corporation
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Description

FIG. 1 is a perspective view of a first embodiment of a semiconductor element showing our new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a left side elevational view thereof;

FIG. 4 is a front elevational view thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is a right side elevational view thereof; and,

FIG. 7 is a rear elevational view thereof.

FIG. 8 is a perspective view of a second embodiment of a semiconductor element showing our new design;

FIG. 9 is a top plan view thereof;

FIG. 10 is a left side elevational view thereof;

FIG. 11 is a front elevational view thereof;

FIG. 12 is a bottom plan view thereof;

FIG. 13 is a right side elevational view thereof; and,

FIG. 14 is a rear elevational view thereof.

Referenced Cited
U.S. Patent Documents
D317592 June 18, 1991 Yoshizawa
D358806 May 30, 1995 Siegel et al.
D375941 November 26, 1996 Kerklaan
D376133 December 3, 1996 Kerklaan
D379350 May 20, 1997 Kerklaan
D386475 November 18, 1997 Hiramatsu
D401912 December 1, 1998 Majumdar et al.
Patent History
Patent number: D421597
Type: Grant
Filed: Apr 24, 1998
Date of Patent: Mar 14, 2000
Assignee: Sony Corporation (Tokyo)
Inventors: Haruo Oba (Tokyo), Takuro Hibino (Tokyo), Yoshio Kondo (Tokyo)
Primary Examiner: Brian N. Vinson
Law Firm: Foley & Lardner
Application Number: 0/86,990
Classifications
Current U.S. Class: Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)
International Classification: 1303;