Processor package

- Intel
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Description

FIG. 1 is a perspective view of a processor package including an indented area on a surface.

FIG. 2 is a front view of the processor package.

FIG. 3 is a top view of the processor package.

FIG. 4 is a back view of the processor package.

FIG. 5 is a right side view of the processor package.

FIG. 6 is a left side view of the processor package.

FIG. 7 is a bottom view of the processor package; and,

FIG. 8 is a cross-sectional view of the processor package taken along line 8—8 in FIG. 2.

Claims

The ornamental design for a processor package, as shown and described.

Referenced Cited
U.S. Patent Documents
D343833 February 1, 1994 Barr
D344504 February 22, 1994 Barr
D344725 March 1, 1994 Barr
D398592 September 22, 1998 Klinker
D405437 February 9, 1999 Klinker
D405772 February 16, 1999 Klinker
D413109 August 24, 1999 Klinker
D413315 August 31, 1999 Klinker
D413316 August 31, 1999 Klinker
5973924 October 26, 1999 Gillespie, Jr.
Patent History
Patent number: D436357
Type: Grant
Filed: Aug 19, 1998
Date of Patent: Jan 16, 2001
Assignee: Intel Corporation (Santa Clara, CA)
Inventor: Thomas S. Klinker (San Francisco, CA)
Primary Examiner: M. H. Tung
Attorney, Agent or Law Firm: Blakely, Sokoloff, Taylor & Zafman LLP
Application Number: 29/092,486
Classifications
Current U.S. Class: Element Or Attachment (D14/432)
International Classification: 1402;