Processor package
- Intel
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Description
FIG. 1 is a perspective view of a processor package including an indented area on a surface.
FIG. 2 is a front view of the processor package.
FIG. 3 is a top view of the processor package.
FIG. 4 is a back view of the processor package.
FIG. 5 is a right side view of the processor package.
FIG. 6 is a left side view of the processor package.
FIG. 7 is a bottom view of the processor package; and,
FIG. 8 is a cross-sectional view of the processor package taken along line 8—8 in FIG. 2.
Claims
The ornamental design for a processor package, as shown and described.
Referenced Cited
U.S. Patent Documents
D343833 | February 1, 1994 | Barr |
D344504 | February 22, 1994 | Barr |
D344725 | March 1, 1994 | Barr |
D398592 | September 22, 1998 | Klinker |
D405437 | February 9, 1999 | Klinker |
D405772 | February 16, 1999 | Klinker |
D413109 | August 24, 1999 | Klinker |
D413315 | August 31, 1999 | Klinker |
D413316 | August 31, 1999 | Klinker |
5973924 | October 26, 1999 | Gillespie, Jr. |
Patent History
Patent number: D436357
Type: Grant
Filed: Aug 19, 1998
Date of Patent: Jan 16, 2001
Assignee: Intel Corporation (Santa Clara, CA)
Inventor: Thomas S. Klinker (San Francisco, CA)
Primary Examiner: M. H. Tung
Attorney, Agent or Law Firm: Blakely, Sokoloff, Taylor & Zafman LLP
Application Number: 29/092,486
Type: Grant
Filed: Aug 19, 1998
Date of Patent: Jan 16, 2001
Assignee: Intel Corporation (Santa Clara, CA)
Inventor: Thomas S. Klinker (San Francisco, CA)
Primary Examiner: M. H. Tung
Attorney, Agent or Law Firm: Blakely, Sokoloff, Taylor & Zafman LLP
Application Number: 29/092,486
Classifications