Grounded electrode for a plasma processing apparatus

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Description

FIG. 1 is a front, top and right side perspective view of grounded electrode for a plasma processing apparatus showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a right side elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a top plan elevational view thereof;

FIG. 6 is a rear elevational view thereof; and,

FIG. 7 is a bottom plan elevational view thereof.

Claims

The ornamental design for grounded electrode for a plasma processing apparatus, as shown.

Referenced Cited
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Patent History
Patent number: D556704
Type: Grant
Filed: Aug 25, 2005
Date of Patent: Dec 4, 2007
Assignee: Hitachi High-Technologies Corporation (Tokyo)
Inventors: Tsutomu Nakamura (Hikari), Susumu Tauchi (Shunan), Akitaka Makino (Hikari)
Primary Examiner: Selina Sikder
Assistant Examiner: Thomas J Johannes
Attorney: Antonelli, Terry, Stout & Kraus, LLP.
Application Number: 29/236,982