Quad-28JW surface mount package
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Description
Claims
The ornamental design for quad-28JW surface mount package, as shown and described.
Referenced Cited
U.S. Patent Documents
D317592 | June 18, 1991 | Yoshizawa |
5742169 | April 21, 1998 | Akram et al. |
D402638 | December 15, 1998 | Farnworth et al. |
5949241 | September 7, 1999 | Akram et al. |
D428859 | August 1, 2000 | Kawafuji et al. |
6222379 | April 24, 2001 | Farnworth et al. |
D441727 | May 8, 2001 | Sekimoto |
D461170 | August 6, 2002 | Williams et al. |
D461172 | August 6, 2002 | Harnden et al. |
D462062 | August 27, 2002 | Williams et al. |
D467231 | December 17, 2002 | Harnden et al. |
D467560 | December 24, 2002 | Harnden et al. |
D467884 | December 31, 2002 | Williams et al. |
D467885 | December 31, 2002 | Harnden et al. |
7057273 | June 6, 2006 | Harnden et al. |
Patent History
Patent number: D558694
Type: Grant
Filed: Oct 11, 2005
Date of Patent: Jan 1, 2008
Assignee: GEM Services, Inc. (Santa Clara, CA)
Inventors: James Harnden (Hollister, CA), Anthony Chia (Singapore), Liming Wong (Shanghai), Hongbo Yang (Shanghai)
Primary Examiner: Selina Sikder
Attorney: Townsend and Townsend and Crew LLP
Application Number: 29/240,406
Type: Grant
Filed: Oct 11, 2005
Date of Patent: Jan 1, 2008
Assignee: GEM Services, Inc. (Santa Clara, CA)
Inventors: James Harnden (Hollister, CA), Anthony Chia (Singapore), Liming Wong (Shanghai), Hongbo Yang (Shanghai)
Primary Examiner: Selina Sikder
Attorney: Townsend and Townsend and Crew LLP
Application Number: 29/240,406
Classifications
Current U.S. Class:
Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)