Quad-24JW surface mount package

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Description

FIG. 1 is a perspective view of a quad-24JW surface mount package showing my new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a bottom plan view thereof;

FIG. 4 is a front elevational view thereof;

FIG. 5 is a rear elevational view thereof;

FIG. 6 is a left side elevational view thereof; and,

FIG. 7 is a right side elevational view thereof.

Claims

The ornamental design for quad-24JW surface mount package, as shown and described.

Referenced Cited
U.S. Patent Documents
D317592 June 18, 1991 Yoshizawa
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D402638 December 15, 1998 Farnworth et al.
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D428859 August 1, 2000 Kawafuji et al.
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D441727 May 8, 2001 Sekimoto
D461170 August 6, 2002 Williams et al.
D461172 August 6, 2002 Harnden et al.
D462062 August 27, 2002 Williams et al.
D467231 December 17, 2002 Harnden et al.
D467560 December 24, 2002 Harnden et al.
D467884 December 31, 2002 Williams et al.
D467885 December 31, 2002 Harnden et al.
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Patent History
Patent number: D560623
Type: Grant
Filed: Oct 11, 2005
Date of Patent: Jan 29, 2008
Assignee: GEM services, Inc. (Santa Clara, CA)
Inventors: James Harnden (Hollister, CA), Anthony Chia (Singapore), Liming Wong (Shanghai), Hongbo Yang (Shanghai)
Primary Examiner: Selina Sikder
Attorney: Townsend and Townsend and Crew LLP
Application Number: 29/240,402