Grooves formed around a semiconductor device on a circuit board

- Nitto Denko Corporation
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Description

FIG. 1 shows a plan view of grooves formed around a semiconductor device on a circuit board showing our new design.

FIG. 2 shows an enlarged view of the claimed portion identified by the dot-dash line in FIG. 1; and,

FIG. 3 shows an enlarged sectional view along the line 3—3 in FIG. 2.

The special dot-dash broken line defines the boundary of the claimed design; the gray stippling indicates the surface of the groove bed; the broken lines show environmental detail for illustrative purposes only and form no part of the claimed design.

Claims

The ornamental design for grooves formed around a semiconductor device on a circuit board, as shown and described.

Referenced Cited
U.S. Patent Documents
3676748 July 1972 Kobayashi et al.
D279670 July 16, 1985 Lukits
D288556 March 3, 1987 Wallgren
D295401 April 26, 1988 Klees
5008614 April 16, 1991 Shreeve et al.
D318271 July 16, 1991 Hasegawa et al.
D319629 September 3, 1991 Hasegawa et al.
D374541 October 15, 1996 Garza
5969590 October 19, 1999 Gutierrez
6114937 September 5, 2000 Burghartz et al.
D487430 March 9, 2004 Asaka et al.
D510103 September 27, 2005 Allard et al.
Foreign Patent Documents
11-8275 January 1999 JP
Other references
  • Office Action dated Nov. 4, 2005 for Japanese Application No. 2005-010995 (2 pages).
  • English Translation of Japanese Publication No. 11-8275 dated Jan. 12, 1999 (16 pages).
  • English translation of Office Action dated Nov. 4, 2005 for Japanese Patent Application No. 2005-010995 (1 page).
Patent History
Patent number: D566060
Type: Grant
Filed: Oct 11, 2005
Date of Patent: Apr 8, 2008
Assignee: Nitto Denko Corporation (Osaka)
Inventors: Tetsuya Ohsawa (Osaka), Emiko Tani (Osaka)
Primary Examiner: Daniel Bui
Assistant Examiner: Thomas J Johannes
Attorney: Osha Liang LLP
Application Number: 29/240,188