Multiple configuration light emitting device package
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The broken lines are for illustrative purposes only and form no part of the claimed design.
Claims
The ornamental design for a multiple configuration light emitting device package, as shown and described.
D615504 | May 11, 2010 | Keller et al. |
D631020 | January 18, 2011 | Chuang et al. |
D637565 | May 10, 2011 | Wu et al. |
20090108281 | April 30, 2009 | Keller et al. |
20100140634 | June 10, 2010 | van de Ven et al. |
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20110127912 | June 2, 2011 | Lee et al. |
Type: Grant
Filed: Jan 31, 2011
Date of Patent: Dec 13, 2011
Assignee: Cree, Inc. (Durham, NC)
Inventors: Peter S. Andrews (Durham, NC), Raymond Rosado (Apex, NC), Michael P. Laughner (Cary, NC), David T. Emerson (Chapel Hill, NC), Jeffrey C. Britt (Cary, NC)
Primary Examiner: Selina Sikder
Attorney: Jenkins, Wilson, Taylor & Hunt, P.A.
Application Number: 29/384,476