Substrate processing unit
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This application contains subject matter related to the following co-pending U.S. design patent applications:
Application Ser. No. 29/606,724, filed herewith and entitled “Substrate Processing Unit”; and
Application Ser. No. 29/606,730, filed herewith and entitled “Substrate Processing Unit”.
The broken lines in the figures depict unclaimed portions of the substrate processing unit and form no part of the claimed design.
Claims
The ornamental design for a substrate processing unit, as shown and described.
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Type: Grant
Filed: Jun 7, 2017
Date of Patent: Oct 16, 2018
Assignee: Hitachi High-Technologies Corporation (Tokyo)
Inventors: Yusaku Sakka (Tokyo), Hiromichi Kawasaki (Tokyo)
Primary Examiner: Mitchell I. Siegel
Assistant Examiner: Khawaja Anwar
Application Number: 29/606,718