Pressing member for substrate polishing apparatus
Latest EBARA CORPORATION Patents:
- Buffer chamber and AM system including a buffer chamber
- Substrate holding apparatus, substrate suction determination method, substrate polishing apparatus, substrate polishing method, method of removing liquid from upper surface of wafer to be polished, elastic film for pressing wafer against polishing pad, substrate release method, and constant amount gas supply apparatus
- Plating apparatus
- Substrate cleaning system and substrate cleaning method
- Plating method and plating apparatus
Description
Claims
The ornamental design for a pressing member for a substrate polishing apparatus, as shown and described.
Referenced Cited
U.S. Patent Documents
1867620 | July 1932 | Forse |
3867797 | February 1975 | Meier |
5271185 | December 21, 1993 | Hosokawa |
5335530 | August 9, 1994 | Homm |
5445554 | August 29, 1995 | Hosokawa |
5476413 | December 19, 1995 | Hasegawa et al. |
5476414 | December 19, 1995 | Hirose et al. |
5493380 | February 20, 1996 | Saitou et al. |
5564965 | October 15, 1996 | Tanaka et al. |
5960729 | October 5, 1999 | Matsumoto et al. |
5973271 | October 26, 1999 | Fujita |
6248005 | June 19, 2001 | Ozaki |
7955113 | June 7, 2011 | Chang |
D834075 | November 20, 2018 | Kamimura |
20010041523 | November 15, 2001 | Bonachera et al. |
20020061211 | May 23, 2002 | Kamijo et al. |
20020137439 | September 26, 2002 | Hakomori et al. |
20020164930 | November 7, 2002 | Hakomori |
20030186624 | October 2, 2003 | Koike et al. |
20040087253 | May 6, 2004 | Mahadev et al. |
20040180610 | September 16, 2004 | Togawa |
20050275398 | December 15, 2005 | Yamashita |
20080085658 | April 10, 2008 | Katsuoka et al. |
20080182482 | July 31, 2008 | Nomura et al. |
20090011651 | January 8, 2009 | Lin et al. |
20090177083 | July 9, 2009 | Matsumura |
20090264053 | October 22, 2009 | Manens et al. |
20100170716 | July 8, 2010 | Ishida et al. |
20110003540 | January 6, 2011 | Takahashi et al. |
20110132956 | June 9, 2011 | Kempka, Jr. |
20110237164 | September 29, 2011 | Seki et al. |
20140042005 | February 13, 2014 | Lee |
Patent History
Patent number: D851141
Type: Grant
Filed: Aug 14, 2018
Date of Patent: Jun 11, 2019
Assignee: EBARA CORPORATION (Tokyo)
Inventors: Kenji Kamimura (Tokyo), Masayuki Nakanishi (Tokyo), Satoru Yamamoto (Tokyo), Yasuyuki Miyasawa (Tokyo), Kenji Kodera (Tokyo)
Primary Examiner: Patricia A Palasik
Application Number: 29/659,970
Type: Grant
Filed: Aug 14, 2018
Date of Patent: Jun 11, 2019
Assignee: EBARA CORPORATION (Tokyo)
Inventors: Kenji Kamimura (Tokyo), Masayuki Nakanishi (Tokyo), Satoru Yamamoto (Tokyo), Yasuyuki Miyasawa (Tokyo), Kenji Kodera (Tokyo)
Primary Examiner: Patricia A Palasik
Application Number: 29/659,970
Classifications
Current U.S. Class:
Element Or Attachment (D15/126)