System including multiple instrument modules and arrangement thereof

Info

Patent number: D855199
Type: Grant
Filed: Jan 29, 2018
Date of Patent: Jul 30, 2019
Assignee: Siemens Healthcare Diagnostics Inc. (Tarrytown, NY)
Inventors: Daniel LiCalzi (New York, NY), Youngsang Lee (Flushing, NY), Mark Lloyd (Townsend, DE), Gregory Bange (Newark, DE), Richard Warwick (Newark, DE), Robert Faranda (Boxborough, MA), Richard Watson (Norwell, MA), Justin Cumming (Topsfield, MA)
Primary Examiner: Wan Laymon
Assistant Examiner: Mark Booker
Application Number: 29/635,201

Description

Description

FIG. 1 is a front perspective view of a system including multiple instrument modules and arrangement thereof in accordance with a first embodiment;

FIG. 2 is a rear perspective view of a system including multiple instrument modules and arrangement thereof;

FIG. 3 is a front elevational view of a system including multiple instrument modules and arrangement thereof;

FIG. 4 is a rear elevational view of a system including multiple instrument modules and arrangement thereof;

FIG. 5 is a left side elevational view of a system including multiple instrument modules and arrangement thereof in accordance with another embodiment;

FIG. 6 is a right side elevational view of a system including multiple instrument modules and arrangement thereof;

FIG. 7 is a top view of a system including multiple instrument modules and arrangement thereof;

FIG. 8 is a bottom view of a system including multiple instrument modules and arrangement thereof;

FIG. 9 is a front perspective view of a system including multiple instrument modules and arrangement thereof in accordance with a second embodiment;

FIG. 10 is a front elevational view of a system including multiple instrument modules and arrangement thereof;

FIG. 11 is a rear elevational view of a system including multiple instrument modules and arrangement thereof;

FIG. 12 is a left side elevational view of a system including multiple instrument modules and arrangement thereof;

FIG. 13 is a right side elevational view of a system including multiple instrument modules and arrangement thereof;

FIG. 14 is a top view of a system including multiple instrument modules and arrangement thereof; and,

FIG. 15 is a bottom view of a system including multiple instrument modules and arrangement thereof in accordance with an embodiment.

The broken lines shown in the figures represent portions of the system including multiple instrument modules and arrangement thereof that form no part of the claimed design.

Claims

We claim the ornamental design for a system including multiple instrument modules and arrangement thereof, as shown and described.