Semiconductor device

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Description

FIG. 1 is a top, left and rear side perspective view of a semiconductor device, showing my new design;

FIG. 2 is bottom, right and rear side perspective view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a right side elevational view thereof;

FIG. 7 is a top plan view thereof;

FIG. 8 is a bottom plan view thereof;

FIG. 9 is another top, left and rear side perspective view thereof, shown in a used condition mounted on a board shown in broken lines; and,

FIG. 10 is another rear view thereof, shown in a used condition mounted on a board shown in broken lines.

The broken lines shown in the drawing views in FIGS. 9 and 10 form no part of the claimed design.

Claims

The ornamental design for a semiconductor device, as shown and described.

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Patent History
Patent number: D805485
Type: Grant
Filed: Jan 25, 2017
Date of Patent: Dec 19, 2017
Assignee: Mitsubishi Electric Corporation (Tokyo)
Inventor: Tatsuya Kawase (Chiyoda-ku)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/591,886