Gas nozzle for substrate processing apparatus
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The broken lines shown in the drawings represent portions of the gas nozzle for substrate processing apparatus that form no part of the claimed design.
Claims
We claim the ornamental design for a gas nozzle for substrate processing apparatus, as shown and described.
| D58914 | September 1921 | Kerr |
| D258309 | February 17, 1981 | Leighton |
| D322470 | December 17, 1991 | Garlich |
| 6553986 | April 29, 2003 | Liu |
| 6851420 | February 8, 2005 | Jennings |
| D613116 | April 6, 2010 | Roberts |
| D695883 | December 17, 2013 | Vest |
| D771772 | November 15, 2016 | Morita |
| D783351 | April 11, 2017 | Fujino |
| D847301 | April 30, 2019 | Yoshida |
| D851763 | June 18, 2019 | Mathews |
| 20080171296 | July 17, 2008 | Yen |
| 20100154775 | June 24, 2010 | Robinson |
Type: Grant
Filed: Jul 5, 2018
Date of Patent: Jun 23, 2020
Assignee: KOKUSAI ELECTRIC CORPORATION (Tokyo)
Inventors: Yusaku Okajima (Tokyo), Toru Kagaya (Tokyo), Hiroaki Hiramatsu (Tokyo), Shinya Ebata (Tokyo)
Primary Examiner: Derrick E Holland
Assistant Examiner: Andrew Kerr
Application Number: 29/655,565