Methods for forming integrated circuits within substrates
The invention includes methods for forming integrated circuits within substrates, and embedded circuits. In one aspect, the invention includes a method of forming an integrated circuit within a substrate comprising: a) providing a recess in a substrate; b) printing an antenna within the recess; and c) providing an integrated circuit chip and a battery in electrical connection with the antenna. In another aspect, the invention includes a method of forming an integrated circuit within a substrate comprising: a) providing a substrate having a first recess and a second recess formed therein; b) printing a conductive film between the first and second recesses and within the first and second recesses, the conductive film forming electrical interconnects between and within the first and second recesses; c) providing a first electrical component within the first recess and in electrical connection with the electrical interconnets therein; d) providing a second electrical component within the second recess and in electrical connection with the electrical interconnects therein; and e) covering the first electrical component, the second electrical component and the conductive film with at least one protective cover. In another aspect, the invention includes an embedded circuit comprising: a) a substrate having a recess therein, the recess having a bottom surface and a sidewall surface joined to the bottom surface; b) interconnect circuitry formed on the bottom and sidewall surfaces; and c) an integrated circuit chip within the recess and operatively connected to the interconnect circuitry. Method of forming a radio frequency identification (RFID) device. In one embodiment, a recess is provided in a plastic substrate containing an integrated circuit comprising RFID circuitry. A conductive material extends over a sidewall of the recess and is coupled to the integrated circuit in a first region and to an antenna in a second region. A flexible film may be disposed over the recess, the integrated circuit, and the conductive material.
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More than one reissue application has been filed for the reissue of U.S. Pat. No. 6,329,213 B1. The reissue applications are application Ser. Nos. 10/734,072 (the present application), 11/302,543, and 11/496,088, all of which are continuation reissues of U.S. Pat. No. 6,329,213 B1.
TECHNICAL FIELDThe invention pertains to methods of forming integrated circuits within substrates, and to embedded circuits. The invention is thought to have particular application towards methods of forming integrated circuits within personal cards, such as personal identification cards and credit cards.
BACKGROUND OF THE INVENTIONSmart cards typically include an integrated circuit providing both memory and processing functions, have words or pictures printed on them, and control who uses information stored in the integrated circuit and how the information is used.
Some smart cards have length and width dimensions corresponding to those of credit cards. The size of such smart cards is determined by an international standard (ISO 7816). ISO 7816 also defines the physical characteristics of the plastic, including temperature tolerance and flexibility. ISO 7816 also defines the position of electrical contacts and their functions, and the protocol for communications between the integrated circuit and readers (vending machines, pay phones, etc.) The term “smart card”, as used herein, is meant to include cards that include microprocessors. Such cards might not conform to ISO 7816.
Several types of plastic are used for the casings or housings of smart cards. PVC and ABS are typical. PVC can be embossed, but is not recyclable. ABS is not readily embossed, but is recyclable.
Smart cards have many different applications. For example, smart cards can be pre-paid cards used instead of money for making purchases from vending machines, gaming machines, gas stations, car washes, photocopiers, laundry machines, cinemas, fast-food restaurants, retail outlets, or anywhere where cash is used. For example, they are commonly used in Europe with public telephones. A timer is used to detect a balance from the card automatically while a conversation continues. Smart cards can be used as food stamps, or for redeeming other government-provided benefits. Because the transaction is electronic, the telephone, vending machine, etc. does not need to store cash, so risk of loss due to theft can be reduced. Change does not need to be stored and disbursed, and received payment can be directly wired to a bank. Pre-paid cards can be a form of advertising, because they can have logos or other information printed on them. The user would typically carry the card for weeks before using up the value on the card.
To authenticate a conventional credit card, a telephone call must be made to verify that sufficient funds are available. Smart cards permit such verification to be performed off-line, thus saving telecommunication charges. Smart cards thus provide an advantage over conventional credit cards. Smart cards can also be used as keys to gain access to restricted areas, such as secure areas of buildings, or to access parking lots.
Radio frequency identification devices (RFIDs) can also be considered smart cards if they include an integrated circuit. RFIDs are described in detail in U.S. patent application Ser. No. 08/705,043, filed Aug. 29, 1996, and incorporated herein by reference. RFIDs comprising integrated circuits may be referred to as intelligent RFIDs or as remote intelligent communication (RIC) devices.
Smart cards will typically contain an integrated circuit, typically provided as a packaged integrated circuit chip (IC chip). The smart card may also comprise electrical interconnects for connecting the IC chip to terminals. In other instances, the electronic interconnects will comprise an antenna, such as, for example, when the integrated circuit comprises radio frequency identification device circuitry. In other instances, an antenna, battery and IC may be inserted into smart cards. As smart cards are intended to be conveniently carried by persons, it is desirable to produce smart cards which are relatively thin, preferably having a size and shape similar to credit cards. This enables the cards to be carried on a person, such as, for example, in a persons's wallet.
SUMMARY OF THE INVENTIONThe invention encompasses methods for forming integrated circuits within substrates, and embedded circuits.
In one aspect, the invention encompasses a method of forming an integrated circuit within a substrate. A recess is formed in the substrate, and an antenna is printed within the recess. An integrated circuit chip and a battery are provided in operative electrical connection with the antenna.
In another aspect, the invention encompasses a method of forming a plurality of cards. A substrate sheet is provided and a plurality of recesses are formed within the substrate sheet. The individual recesses have bottom surfaces and sidewall surfaces joined to the bottom surfaces. A conductive film is printed within the recesses to form electrical interconnects within the recesses. The electrical interconnects extend along the bottom surfaces and the sidewall surfaces of the recesses, and also on top surfaces of the substrate sheet. Integrated circuit chips are placed within the recesses and in electrical connection with the electrical interconnects. The integrated circuit chips and the conductive film within the recesses are covered with a protective cover. The substrate sheet is divided into a plurality of cards.
In another aspect, the invention encompasses an embedded circuit. The embedded circuit includes a substrate having a recess therein; a conductive circuit printed within the recess and an integrated circuit chip bonded to the conductive circuit.
In another aspect, the invention encompasses an embedded circuit. The embedded circuit includes a substrate having a recess therein; a conductive circuit provided within the recess; an integrated circuit chip bonded to the conductive circuit; and a battery in electrical connection with the integrated circuit chip.
In accordance with another embodiment, a recess is provided in a plastic substrate containing an integrated circuit comprising RFID circuitry. A conductive material extends over a sidewall of the recess and is coupled to the integrated circuit in a first region and to an antenna in a second region. A flexible film may be disposed over the recess, the integrated circuit, and the conductive material.
Preferred embodiments of the invention are described below with reference to the following accompanying drawings.
This disclosure of the invention is submitted in furtherance of the constitutional purposes of the U.S. Patent Laws “to promote the progress of science and useful arts” (Article 1, Section 8).
A first embodiment method of the present invention is described with reference to
Substrate 10 comprises a substrate body 13, a front surface 12, and an opposing back surface 11 (shown in FIG. 5). A recess 14 is provided through front surface 12 and into substrate 10. Recess 14 can be formed by conventional methods. Examples include cutting with a blade, grinding wheel or laser. Another example method for forming recess 14 is to form the recess in situ at a time of card creation by injection molding the card in a shape comprising recess 14. Recess 14 has a bottom surface 16 and sidewall surfaces 18 joined to bottom surface 16. As most clearly shown in
Still referring to
Referring to
After curing, circuit 22 will have a thickness and associated degree of conductivity. If the conductive is lower than desired as may occur if, for example, conductive material of circuit 22 is too thin, or not adequately a low resistance material, the conductivity can be enhanced by providing an electroless plated metal, such as copper or nickel, against substrate 10 and circuit 22. The electroless plated metal selectively plates conductive circuit 22, while not plating non-conductive surfaces of substrate 10. The electroless plating of metal can be accomplished by conventional methods.
Referring to
In the preferred embodiment, antenna 26 constitutes a part of, and is formed at the same time as, the other integrated circuitry. It is noted that antenna 26 could be formed in two steps, with a portion of antenna 26 being formed before or after pad printing of circuit 22. For instance, the portion of antenna 26 extending along upper surface 12 could be formed prior to printing circuit 22. Then, a portion of antenna 26 could be printed as part of circuit 22 to create nodes 32 and 33, and to connect the previously formed portion of antenna 26 with nodes 32 and 33. In such circumstances, the portion of antenna 26 which is not formed as part of circuit 22 could be formed by methods other than those utilized to form circuit 22. For instance, if circuit 22 is pad printed, the portion of antenna 26 not formed as part of circuit 22 could be formed by a method other than pad printing. Such other methods will be recognized by persons of ordinary skill in the art.
Referring to
In the illustrated embodiment, interconnects 23 and 24 connect battery 36 to integrated circuit 38, and antenna 26 connects with integrated circuit 38. Battery 36, interconnects 23 and 24, integrated circuit 38 and antenna 26 together form a radio frequency identification device (RFID).
After provision of circuit 22 and one or both of components 36 and 38 within recess 14, a protective cover is ideally formed over circuit 22 and recess 14.
Referring to
It is noted that the methods of
After provision of a protective cover over recess 14, the construction of a card is substantially finished. The card may then be covered with a laminating film for cosmetic, printability, or logo reasons. An example laminating film would be a thin (less than about one mil) PVC sheet bonded to substrate 10 with an adhesive.
A second embodiment method of the present invention is described with reference to
Referring to
In the illustrated embodiment, components 36a and 38a are each within a recess, with component 36a being within first recess 52 and component 38a being within second recess 54. First recess 52 comprises a bottom surface 56 and sidewall surfaces 58. Second recess 54 comprises a bottom surface 60 and sidewall surfaces 62. Sidewall surfaces 58 and 62 can extend non-perpendicularly form bottom surfaces 56 and 60, respectively, to simply printing of circuit 22a over such sidewall surfaces. First recess 52 is separated from second recess 54 by one of the sidewall surfaces 62. The separating sidewall 62 extends non-perpendicularly from both of bottom surface 56 and bottom surface 60. Interconnects 23a and 24a extend over the separating sidewall surface 62 and along bottom surfaces 60 and 56. Interconnects 23a and 24a thus extend continuously from electrical component 36a to electrical component 38a.
Substrate 10a comprises a front surface 12a and an opposing back surface 11a. Preferably, first recess 52 and second recess 54 both extend through the same of either front surface 12a or back surface 11a. In
Subsequent processing of substrate 10a can be performed in accordance with the processing of either
A third embodiment method of the present invention is described with reference to
A substrate 10b comprises a substrate body 13b, a front surface 12b, and an opposing back surface 11b. A recess 14b is provided through front surface 12b and into substrate 10b. Electrical components 36b and 38b are within recess 14b and connected by interconnects 23b and 24b. A loop antenna 26b is electrically connected with component 38b. Loop antenna 26b extends from component 38b, out of recess 14b, and along surface 12b of substrate 10b. Antenna 26b crosses over itself at a bypass 70. Antenna 26b comprises a first portion 66 and a second portion 68 at bypass 70, with second portion 68 crossing over first portion 66. Bypass 70 comprises an insulative material 72 separating first portion 66 from second portion 68. Insulative material 72 can comprise, for example, silicon dioxide.
Methods for forming antenna 26b will be recognized by persons of ordinary skill in the art. Such methods could include, for example, printing methods similar to those discussed above in discussing
Although the embodiment of
It is noted that although antenna second portion 68 is illustrated as being substantially perpendicular to antenna first portion 66 at bypass 70, the invention encompasses other embodiments (not shown) in which an antenna second portion is non-perpendicular to an antenna first portion at a bypass of the antenna portions.
The processing described above with reference to
Although
The formation of a number of individual cards from a single sheet substrate is illustrated in
In compliance with the statue, the invention has been described in language more or less specific as to structural and methodical features. It is to be understood, however, that the invention is not limited to the specific features shown and described, since the means herein disclosed comprise preferred forms of putting the invention into effect. The invention is, therefore, claimed in any of its forms or modifications within the proper scope of the appended claims appropriately interpreted in accordance with the doctrine of equivalents.
Claims
1. A method of forming a radio frequency communication device comprising:
- providing a recess within a substrate;
- providing at least a portion of an antenna within the recess;
- providing an integrated circuit at least partially within the recess and in operative electrical connection with the antenna; and
- wherein the antenna is a loop antenna which crosses itself at a bypass, said bypass comprising dielectric material between crossing portions of the loop antenna.
2. A method of forming an integrated circuit within a substrate comprising:
- providing a recess in a substrate;
- providing substantially an entirety of an antenna within the recess; and
- providing an integrated circuit chip and a battery supported by the substrate and in operative electrical connection with the antenna.
3. A method of forming an integrated circuit within a substrate comprising:
- providing a recess in a substrate;
- providing at least a portion of an antenna within the recess;
- providing an integrated circuit chip and a battery supported by the substrate and in operative electrical connection with the antenna; and
- wherein the antenna is provided within the recess and on a portion of the substrate outside of the recess.
4. The method of claim 3 wherein the antenna comprises a predominate portion within the recess.
5. The method of claim 3 wherein the antenna comprises a predominate portion outside of the recess.
6. A method of forming an integrated circuit within a substrate comprising:
- providing a recess in a substrate;
- providing at least a portion of an antenna within the recess;
- providing an integrated circuit chip and a battery supported by the substrate and in operative electrical connection with the antenna; and
- wherein the antenna is a loop antenna which crosses itself at a bypass, said bypass comprising dielectric material between crossing portions of the loop antenna.
7. The method of claim 3 wherein at least one of the battery and the integrated circuit chip are provided at least partially within the recess.
8. The method of claim 3 wherein the battery is bonded to the substrate within the recess.
9. The method of claim 3 wherein the step of providing the antenna comprises printing a conductive film.
10. The method of claim 3 wherein the step of providing the antenna comprises pad printing a conductive film.
11. A method of forming an integrated circuit within a substrate comprising:
- providing a recess in a substrate;
- providing at least a portion of a loop antenna within the recess, the loop antenna comprising a bypass where portions of the antenna cross one another, the bypass comprising a dielectric material between the crossing portions of the antenna; and
- providing an integrated circuit chip in operative electrical connection with the antenna.
12. The method of claim 11 wherein the portions of the antenna which cross one another are substantially perpendicular to one another.
13. A method of forming an integrated circuit within a substrate comprising:
- providing a recess in a substrate;
- pad printing a conductive material within the recess to form at least a portion of a conductive circuit within the recess and to form at least a portion of an antenna within the recess;
- placing an integrated circuit chip within the recess and bonding the integrated circuit chip to the conductive circuit and the antenna; and
- placing a battery within the recess and in electrical connection with the integrated circuit chip.
14. The method of claim 13 wherein the substrate is a card configured for carrying on a person.
15. The method of claim 13 further comprising, after the printing, providing an electroless metal within the recess to selectively plate the conductive circuit.
16. The method of claim 13 further comprising, after bonding the chip to the conductive circuit, filling the recess with a liquid encapsulation material and curing the encapsulation material into a solid mass.
17. The method of claim 13 further comprising, after bonding the chip to the conductive circuit, covering the recess with a protective cover.
18. A method of forming an integrated circuit within a substrate comprising:
- providing a substrate having a recess formed therein, said recess having a bottom surface and a sidewall surface joined to the bottom surface;
- pad printing a conductive film within the recess to form electrical interconnects within the recess and to form at least a portion of an antenna, the electrical interconnects extending along the bottom surface and the sidewall surface of the recess;
- placing an integrated circuit chip within the recess and in electrical connection with the electrical interconnects;
- covering the integrated circuit and the conductive film within the recess with a protective cover; and
- wherein the integrated circuit comprises radio frequency identification device circuitry, and further comprising placing a battery within the recess and in electrical connection with the radio frequency identification device circuitry through the electrical interconnects.
19. A method of forming a device comprising:
- providing a recess within a substrate;
- providing at least a portion of an antenna within the recess;
- providing an integrated circuit at least partially within the recess and in operative electrical connection with the antenna;
- wherein the antenna crosses itself at a bypass, said bypass comprising dielectric material between crossing portions of the antenna; and
- wherein the antenna includes a connection between the integrated circuit and a first antenna portion, the first antenna portion extending from at least partially within the recess to outside the recess, a second connection between the integrated circuit and a second antenna portion, the second antenna portion extending from at least partially within the recess to outside the recess, and a third antenna portion outside of the recess and coupled to the first and second antenna portions.
20. A method comprising:
- forming a recess in a plastic substrate, the recess having an approximately planar bottom surface and four sidewall surfaces that slope outward from the bottom surface toward an upper surface of the substrate; and subsequently performing the steps of:
- providing a monolithic integrated circuit chip within the recess, the chip comprising RFID circuitry coupled to first and second antenna ports to provide memory and processing functions, the first and second antenna ports configured to be electrically coupled together via an antenna and, subsequent to the forming of the recess:
- providing a first conductive layer coupled to the first antenna port of the chip and extending over at least a portion of a first of the sidewall surfaces; and
- providing a second conductive layer coupled to the second antenna port of the chip and extending over at least a portion of a second of the sidewall surfaces.
21. The method of claim 20, wherein providing the first and second conductive layers comprises printing.
22. The method of claim 20, further comprising forming a conductive adhesive between the first conductive layer and the first antenna port and forming a conductive adhesive between the second conductive layer and the second antenna port.
23. The method of claim 20, further comprising:
- providing at least a portion of an antenna over the upper surface of the substrate and coupling the antenna to the first and second conductive layers; and
- providing a flexible plastic film over the recess, the chip, and the antenna, the flexible plastic film being bonded to the portion of the antenna.
24. The method of claim 20, further comprising:
- providing at least a portion of an antenna formed using a first process over the upper surface of the substrate;
- coupling the antenna to the first and second conductive layers, the first and second conductive layers having been formed using a second process; and
- providing a flexible plastic film over the recess, the chip, and the antenna.
25. A method comprising:
- providing a plastic substrate comprising a plurality of recesses, each of the recesses having a bottom surface and four sidewall surfaces that extend non-perpendicularly from the bottom surface toward an upper surface of the substrate; and subsequently performing the steps of: disposing a plurality of integrated circuits within the plurality of recesses such that each of the recesses contains an integrated circuit, each of the integrated circuits comprising RFID circuitry coupled to first and second antenna ports to provide memory and processing functions, the first and second antenna ports configured to be electrically coupled together via an antenna; and providing a plurality of continuous conductive films, each of the continuous conductive films having a first portion and a second portion, the first portion being coupled to respective ones of the integrated circuits disposed within the recesses and the second portions extending above the upper surface of the substrate.
26. The method of claim 25, wherein the substrate comprises a plurality of rows of recesses and a plurality of columns of recesses.
27. The method of claim 25, further comprising covering the plurality of integrated circuits and the plurality of continuous conductive films with an insulting material initially provided as a liquid material that is subsequently cured into a non-liquid material, and wherein each of the continuous conductive films is disposed over at least one respective sidewall surface between the first and second portions.
28. The method of claim 25, wherein the continuous conductive films comprise printed films.
29. The method of claim 25, wherein the first portion of each of the continuous conductive films is coupled to respective ones of the integrated circuits using a conductive adhesive.
30. A method comprising:
- forming a recess in a plastic substrate, the recess having a bottom surface and four sidewall surfaces that extend non-perpendicularly from the bottom surface toward an upper surface of the substrate; and subsequently performing the steps of: providing an antenna portion disposed outside of the recess; disposing an integrated circuit within the recess, the integrated circuit comprising RFID circuitry coupled to first and second antenna ports to provide memory and processing functions; disposing a conductive material layer over at least one of the four sidewall surfaces to couple the integrated circuit to the antenna portion outside the recess, wherein the antenna portion is configured to electrically couple the first antenna port to the second antenna port; and providing a flexible film over the recess, the integrated circuit, and the conductive material layer.
31. The method of claim 30, wherein depositing the conductive material layer comprises printing a film.
32. The method of claim 30, further comprising coupling the integrated circuit to the conductive material layer using a conductive adhesive.
33. The method of claim 32, wherein the conductive material layer is disposed over the bottom surface at a first end and over the upper surface at a second end.
34. The method of claim 33, further comprising covering the conductive material layer with an insulating material and bonding the flexible film directly on at least a portion of the insulating material.
35. The method of claim 34, wherein the antenna comprises a material layer that is different from the conductive material layer.
36. The method of claim 30, further comprising covering the conductive material layer with an insulating material and bonding the flexible film over the insulating material.
37. The method of claim 36, wherein covering the conductive material layer with the insulating material comprises forming the insulting material directly on the conductive material layer and over the upper surface of the substrate.
38. The method of claim 37, wherein covering the conductive material layer with the insulating material includes depositing a liquid material and curing the liquid material to form the insulting material.
39. The method of claim 38, wherein depositing the conductive material layer comprises printing a film.
40. The method of claim 39, wherein the film is less than about one mil in thickness.
41. A method comprising:
- providing a plastic substrate comprising a recess, the recess having a bottom surface and sidewall surfaces that extend non-perpendicularly from the bottom surface toward an upper surface of the substrate, each of the sidewall surfaces sloping outward from the bottom surface toward the upper surface;
- providing an antenna, at least a portion of which is a first conductive film disposed above the upper surface;
- providing an integrated circuit within the recess, the integrated circuit comprising RFID circuitry coupled to first and second antenna ports to provide memory and processing functions;
- providing a second conductive film, separate from the first conductive film, having a first region coupled to the integrated circuit and a second region coupled to the portion of the antenna; and
- disposing a flexible film above the recess, the antenna, the integrated circuit, and the second conductive film, and electrically coupling the first and second antenna ports together via the antenna.
42. The method of claim 41, wherein the second conductive film comprises a printed film.
43. The method of claim 41, wherein the first region of the second conductive film is disposed above the bottom surface.
44. The method of claim 41, wherein the second conductive film is disposed above at least one of the sidewall surfaces between the first and second regions.
45. The method of claim 41, further comprising bonding a conductive adhesive to the integrated circuit and to the first region of the first conductive film.
46. The method of claim 41, further comprising covering the second conductive film with an insulating material and disposing the flexible film over the insulating material.
47. The method of claim 41, wherein at least one of the sidewall surfaces slopes in at least a generally linear manner from the bottom surface.
48. The method of claim 47, further comprising covering the second conductive film with an insulating material and disposing the flexible film over the insulating material.
49. A method comprising:
- providing a plastic substrate comprising a plurality of recesses, each of the recesses having a bottom surface and four sidewall surfaces that extend non-perpendicularly from the bottom surface toward an upper surface of the substrate; and subsequently performing the steps of: disposing a plurality of integrated circuits within the plurality of recesses such that each of the recesses contains no more than a single respective integrated circuit, each respective integrated circuit comprising respective RFID circuitry to provide memory and processing functions, the respective RFID circuitry coupled to respective first and second antenna ports configured to be coupled together via a respective antenna; and forming a plurality of continuous conductive films, each of the continuous conductive films having a first portion and a second portion, the first portion being coupled to respective ones of the integrated circuits disposed within the recesses and the second portion extending above the upper surface of the substrate.
50. The method of claim 49, wherein the substrate comprises a plurality of rows of recesses and a plurality of columns of recesses, and further comprising dividing the substrate into a plurality of singular substrates after forming the plurality of conductive films, each of the singular substrates comprising a single recess.
51. The method of claim 50, wherein each of the continuous conductive films is disposed above at least one respective sidewall surface between the first and second portions, and each of the singular substrates comprises two continuous conductive films.
52. The method of claim 51, wherein forming the plurality of continuous conductive films comprises printing a conductive material.
53. The method or claim 52, wherein the first portion of each of the continuous conductive films is coupled to respective ones of the integrated circuits using a conductive adhesive.
54. A method comprising:
- providing a substrate comprising a recess, the recess having a bottom surface and four sidewall surfaces that extend non-perpendicularly from the bottom surface toward an upper surface of the substrate, each of the sidewall surfaces sloping outward from the bottom surface toward the upper surface;
- providing an antenna, at least a portion of which is a first conductive material disposed above the upper surface;
- providing an integrated circuit within the recess, the integrated circuit comprising RFID circuitry to provide memory and processing functions and coupled to first and second antenna ports of the integrated circuit;
- providing a second conductive material, separated from the first conductive material, having a first region coupled to the integrated circuit and disposed above the bottom surface, having a second region coupled to the portion of the antenna and disposed above the upper surface, and having a third region between the first and second regions and disposed above one of the sidewall surfaces; and
- disposing a flexible film over the recess, the integrated circuit, the antenna, and the second conductive material, wherein the first and second antenna ports are electrically coupled together via the antenna.
55. The method of claim 54, further comprising bonding a conductive adhesive to the integrated circuit and to the first region of the second conductive material.
56. The method of claim 55, wherein providing the second conductive material comprises printing the second conductive material.
57. The method of claim 56, further comprising the second conductive material with an insulating material and disposing the flexible film over the insulating material.
58. The method of claim 57 wherein at least one of the sidewall surfaces slopes in at least a generally linear manner from the bottom surface.
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Type: Grant
Filed: Dec 10, 2003
Date of Patent: Mar 4, 2008
Assignee: Micron Technology, Inc. (Boise, ID)
Inventors: Mark E. Tuttle (Boise, ID), Rickie C. Lake (Meridian, ID)
Primary Examiner: Caridad Everhart
Attorney: Wells St. John, P.S.
Application Number: 10/734,072
International Classification: H01L 21/00 (20060101);