Manufacturing Circuit On Or In Base Patents (Class 29/846)
  • Patent number: 10699990
    Abstract: An integrated circuit (IC) device includes an IC die and a plurality of leads. Each lead includes an unplated proximal end including a first material, and an unplated distal end including the first material. A plated bond wire portion extends between the proximal and distal ends and includes the first material and a plating of a second material thereon. A plurality of bond wires extend between the IC die and the plated bond wire portions of the leads. An encapsulation material surrounds the IC die and bond wires so that the unplated proximal end and plated bond wire portion of each lead are covered by the encapsulation material.
    Type: Grant
    Filed: August 8, 2018
    Date of Patent: June 30, 2020
    Assignee: STMicroelectronics SDN BHD
    Inventor: Cheeyang Ng
  • Patent number: 10674615
    Abstract: A method for manufacturing a wiring board includes preparing a core substrate having first and second surfaces, forming a first build-up structure including interlayer insulating layers and conductor layers on the first surface of the substrate, and forming a second build-up structure including interlayer insulating layers and one or more conductor layers on the second surface of the substrate. The forming of the first structure includes laminating the insulating layers and metal layers on first surface side of the substrate and forming the conductor layers from all of the metal layers on the first surface side, and the forming of the second structure includes laminating the insulating layers and metal layers on second surface side of the substrate, forming the one or more conductor layers from one or more of the metal layers on the second surface side, and entirely removing the other metal layers on the second surface side.
    Type: Grant
    Filed: May 31, 2017
    Date of Patent: June 2, 2020
    Assignee: IBIDEN CO., LTD.
    Inventor: Naoki Kurahashi
  • Patent number: 10651785
    Abstract: A photovoltaic assembly comprising; (a) at least two photovoltaic components that are adjacent to each other in a first direction, each photovoltaic component comprising (i) a partial recess in communication with the partial recess in an adjacent photovoltaic component and (ii) one or more connector receptors aligned in a second direction which is non-parallel to the first direction; (b) a connector located at feast partially in the partial recess of the photovoltaic component and at least partially in the partial recess of the adjacent photovoltaic component so that the connector connects the photovoltaic component to the adjacent photovoltaic component, the connector comprising: (i) a flexible housing having a first end and a second end; (ii) one or more connection ports at the first end; (iii) one or more connection ports at the second end; and (iv) one more flexible electrical conductors that extend from the one or more connection ports at the first end to the one or more connection ports at the second en
    Type: Grant
    Filed: June 4, 2014
    Date of Patent: May 12, 2020
    Assignee: DOW GLOBAL TECHNOLOGIES LLC
    Inventors: James R. Keenihan, Leonardo C. Lopez, Joseph A. Langmaid, Shane Washburn, Darius Eghbal, Vijay Karthik Koneru, Kelvin L. Leung
  • Patent number: 10651320
    Abstract: A method of manufacturing a circuit board includes: forming a plurality of metal electrodes so as to be separated from each other on a holding sheet by cutting a metal foil held on the holding sheet to remove a portion of the metal foil; forming adhesive layers on surfaces of the plurality of metal electrodes; adhering the adhesive layers to a base material by closely contacting the adhesive layers with the base material; and transcribing the adhesive layers and the plurality of metal electrodes onto the base material by detaching the holding sheet from the plurality of metal electrodes.
    Type: Grant
    Filed: May 2, 2019
    Date of Patent: May 12, 2020
    Assignee: DSM IP ASSETS B.V.
    Inventors: Koichi Kumai, Ryuji Ueda, Kentaro Kubota, Shigeki Kudo, Minoru Kawasaki
  • Patent number: 10642399
    Abstract: A display device is disclosed. In one aspect, the display device includes a substrate including a display area and a non-display area adjacent to the display area and a display member formed over the substrate in the display area. The display device also includes an encapsulation layer formed over the display member and encapsulating the display member together with the substrate and a plurality of first touch lines formed over the encapsulation layer in the display area. The first touch lines extend in a first direction. The display device further includes a plurality of second touch lines formed on the same layer as the first touch lines in the display area. The second touch lines extend in the first direction and are spaced apart from the first touch lines.
    Type: Grant
    Filed: September 6, 2019
    Date of Patent: May 5, 2020
    Assignee: Samsung Display Co., Ltd.
    Inventors: Yong-Hwan Park, Jong Seok Kim, Chi Wook An, Seong Jun Lee, Sang Hyun Jun
  • Patent number: 10597500
    Abstract: An object of the invention is achieved by a method for producing a composite material, including the steps of combining a resin precursor and a reinforcing fiber and carrying out a polymerization reaction of the resin precursor. That is, a thermoplastic resin composite material having high strength can be obtained by the production method.
    Type: Grant
    Filed: July 13, 2017
    Date of Patent: March 24, 2020
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Shigeru Horie, Nobuhiko Matsumoto, Kousuke Ikeuchi, Masao Someya
  • Patent number: 10566135
    Abstract: An electromagnet includes a stacked body formed by stacking and thermocompression-bonding a plurality of insulating base materials having thermoplasticity and including wound linear conductors which define a spiral coil. In a region of each of the insulating base materials surrounded by each of the wound linear conductors, each of low mobility members is formed of a material having mobility lower than that of the insulating base materials at a temperature upon thermocompression-bonding of the insulating base materials.
    Type: Grant
    Filed: December 20, 2018
    Date of Patent: February 18, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Kosuke Nishino, Kuniaki Yosui
  • Patent number: 10550463
    Abstract: The present disclosure relates to the technical field of mobile communication, and particularly to a method for manufacturing an antenna, and further relates to a mobile device. The manufacturing method provided comprises: S1: forming a paint coating on a surface of a ceramic back shell; S2: forming a concave area on the paint coating; and S3: forming the antenna in the concave area. The antenna manufactured by using the method for manufacturing an antenna provided by the present disclosure is difficult to bend, and is difficult to come into untight attachment with a back shell of a mobile phone, which can make the antenna occupy an installation space in the mobile device as little as possible.
    Type: Grant
    Filed: August 13, 2018
    Date of Patent: February 4, 2020
    Assignee: AAC Technologies Pte. Ltd.
    Inventors: Liyi Zhou, Xiaolong Zhu, Jian Yang, Xihua Cao, Jiandui Wang, Ying Zhang
  • Patent number: 10496215
    Abstract: An input device described herein includes at least one dual purpose electrode that is used to perform both capacitive sensing to detect an input object (e.g., a finger or stylus) and force sensing to determine the force applied by the input object on the input device. During a first time period, the input device performs capacitive sensing using a first electrode of the plurality of sensor electrodes. However, during a second time period, the input device excites the first electrode and measures a resistance corresponding to the first electrode. The input device determines a force applied by an input object on the input device based on the measured resistance.
    Type: Grant
    Filed: October 24, 2016
    Date of Patent: December 3, 2019
    Assignee: SYNAPTICS INCORPORATED
    Inventors: Tom Vandermeijden, Tetsuo Tanemura, Koji Kokubu
  • Patent number: 10472728
    Abstract: A copper foil for printed circuits is prepared by forming a primary particle layer of copper on a surface of a copper foil, and then forming a secondary particle layer based on ternary alloy composed of copper, cobalt and nickel on the primary particle layer. The average particle size of the primary particle layer is 0.25 to 0.45 ?m, and the average particle size of the secondary particles layer based on ternary alloy composed of copper, cobalt and nickel is 0.05 to 0.25 ?m. Provided is a copper foil for printed circuits, in which powder fall from the copper foil can be reduced and the peeling strength and heat resistance can be improved by forming a primary particle layer of copper on a surface of a copper foil, and then forming a secondary particle layer based on copper-cobalt-nickel alloy plating on the primary particle layer.
    Type: Grant
    Filed: June 10, 2016
    Date of Patent: November 12, 2019
    Assignee: JX Nippon Mining & Metals Corporation
    Inventors: Hideta Arai, Atsushi Miki
  • Patent number: 10412827
    Abstract: A rigid-flex circuit board includes a core substrate, a first outer conductive circuit layer, and a second outer conductive circuit layer. The core substrate includes a first base layer and a second base layer. A first conductive circuit layer is formed on a surface of the first base layer, and a second conductive circuit layer is formed on a surface of the second base layer. An insulating layer is located between the first base layer and the second base layer. The first conductive circuit layer and the second conductive circuit layer are embedded within the insulating layer. A portion of the core substrate located within the first opening and the second opening is defined as a flexible board section, and the portions of the core substrate located outside of the first opening and the second opening are defined as a hard board section.
    Type: Grant
    Filed: September 29, 2018
    Date of Patent: September 10, 2019
    Assignees: QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD, Avary Holding (Shenzhen) Co., Limited.
    Inventors: Tzu-Chien Yeh, Lin-Jie Gao
  • Patent number: 10379650
    Abstract: In an embodiment of the disclosure, a touch-sensing display panel includes a substrate, connection electrodes, a touch-sensing device layer, a buffer layer, a display device, and conductive vias. The substrate has a display area and a non-display area connecting the display area. The connection electrodes are located on the non-display area of the substrate. The touch-sensing device layer is located on the substrate. The buffer layer covers the touch-sensing device layer. The display device including a first electrode layer, a second electrode layer, and a display medium layer is disposed on the buffer layer and corresponds to the display area. The first electrode layer and the second electrode layer extend from the display area to the non-display area. The conductive vias penetrate the buffer layer and correspond to the non-display area. The first electrode layer and the second electrode layer are electrically connected to the connection electrodes via the conductive vias.
    Type: Grant
    Filed: October 7, 2016
    Date of Patent: August 13, 2019
    Assignee: Industrial Technology Research Institute
    Inventors: Chih-Chia Chang, Kuang-Jung Chen, Yi-Chuan Lu, Kai-Ming Chang
  • Patent number: 10375834
    Abstract: Methods of and devices for using additive processes (e.g., 3D printing) to embed components inside an object are disclosed. In some embodiments, the components include active components, such as computer chips. In other embodiments, the components include passive components, such as inductor, resistor, and capacitors. The methods and devices disclosed herein can be used for rapid prototyping and fast manufacturing.
    Type: Grant
    Filed: August 25, 2014
    Date of Patent: August 6, 2019
    Assignee: Flextronics AP, LLC.
    Inventors: Weifeng Liu, Murad Kurwa
  • Patent number: 10312297
    Abstract: Disclosed is an organic light emitting display device and a touch sensing method for the same. The organic light emitting display device includes a first driving electrode disposed on a portion of a first area of a display device, a second driving electrode disposed on a portion of a second area of the display device and connected to the first driving electrode, a first sensing electrode disposed on another portion of the first area and configured to correspond to the first driving electrode, and a second sensing electrode disposed on another portion of the second area and configured to correspond to the second driving electrode. An organic light emitting display device in which a thinner thickness is implemented and calculation of a touch point is performed more quickly by effectively transmitting a driving signal and a touch sensing method for the same is provided.
    Type: Grant
    Filed: December 27, 2016
    Date of Patent: June 4, 2019
    Assignee: LG Display Co., Ltd.
    Inventors: JaeGyun Lee, JiHyun Jung, SuChang An, Sangkyu Kim, Hyangmyoung Gwon, Yangsik Lee
  • Patent number: 10292270
    Abstract: The invention relates to a contact bump connection (24) and to a method for producing a contact bump connection between an electronic component being provided with at least one terminal face (11) and a contact substrate (26) being contacted with the component and having at least one second terminal face (25), wherein the first terminal face is provided with a contact bump (10), which has a raised edge (15) and has at least one displacement pin (16) in a displacement compartment (18) being surrounded by the raised edge and being open towards a head end of the contact bump, and wherein, in a contact region (31) with the first terminal face, the second terminal face has a contact bead (30), which is formed by displacement of a contact material (29) of the second terminal face into the displacement compartment and which surrounds the displacement pin, said contact bead having a bead crown (33) which is oriented to a bottom (17) of the displacement compartment and is raised relative to a level contact surface (32)
    Type: Grant
    Filed: August 9, 2013
    Date of Patent: May 14, 2019
    Assignee: SMARTRAC TECHNOLOGY GMBH
    Inventors: Carsten Nieland, Frank Kriebel
  • Patent number: 10274830
    Abstract: The present disclosure relates to a dynamic lithographic exposure method, and an associated apparatus, which exposes a photosensitive material over a plurality of depths of focus respectively spanning a different region of the photosensitive material. By exposing the photosensitive material over a plurality of depths of focus, the exposure of the photosensitive material is improved resulting in a larger lithographic process window. In some embodiments, the dynamic lithographic exposure method is performed by forming a photosensitive material over a substrate. The photosensitive material is exposed to electromagnetic radiation at a plurality of depths of focus that respectively span a different region within the photosensitive material. Exposing the photosensitive material to the electromagnetic radiation modifies a solubility of an exposed region within the photosensitive material. The photosensitive material is then developed to remove the soluble region.
    Type: Grant
    Filed: January 6, 2017
    Date of Patent: April 30, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Jun-Yih Yu, De-Fang Huang, De-Chen Tseng, Jia-Feng Chang, Li-Fang Hsu
  • Patent number: 10252314
    Abstract: Targeting mass production, the present invention provides an advanced method of manufacturing pure niobium plate end-group components from pure niobium plate material for superconducting high frequency accelerator cavity by means of innovative shear-blanking followed by innovative forging procedures, wherein the invention is to convert the procedure/production method from the conventional machining or waterjet cutting followed by the conventional cold forging to the whole press-forming The invention gives the drastic effects on cost-effectiveness and press-performance.
    Type: Grant
    Filed: December 15, 2016
    Date of Patent: April 9, 2019
    Assignees: SHINOHARA PRESS SERVICE CO., LTD.
    Inventors: Kiyohiko Nohara, Nobuyuki Kawabata, Hideyoshi Nakamura, Kyohei Miyajima, Masayuki Shinohara, Hitoshi Hayano, Akira Yamamoto, Takayuki Saeki, Shigeki Kato, Masashi Yamanaka
  • Patent number: 10243155
    Abstract: The present invention provides a groove structure employed for printing film formation, wherein the groove structure is located on a substrate, comprises a dam and a groove formed by the dam surrounding, and the dam comprises at least two layers of branch dam layers, which are stacked up, and material of the branch dam layers is silicon nitride or silicon oxide, and material of a top side branch dam layer is silicon oxide, wherein the inclined circumferential surface of the groove, which is surrounded by the branch dam layer manufactured with silicon oxide and the upper surface of the top side branch dam layer are hydrophobic surfaces, and an inclined circumferential surface of the groove, which is surrounded by the branch dam layer manufactured with silicon nitride, is a hydrophilic surface.
    Type: Grant
    Filed: June 21, 2016
    Date of Patent: March 26, 2019
    Assignee: SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Xingyu Zhou, Weijing Zeng
  • Patent number: 10191190
    Abstract: A mirror for use in high power optical applications, the mirror comprising: a support plate comprising a synthetic diamond material; and a reflective coating disposed over the support plate, wherein the reflective coating comprises a bonding layer of carbide forming material which bonds the reflective coating to the synthetic diamond material in the support plate, a reflective metal layer disposed over the bonding layer, and one or more layers of dielectric material disposed over the reflective metal layer, wherein the bonding layer and the reflective metal layer together have a total thickness in a range 50 nm to 10 ?m with the reflective metal layer having a thickness of no more than 5 ?m, and wherein the support plate and the reflective coating are configured such that the mirror has a reflectivity of at least 99% at an operational wavelength of the mirror.
    Type: Grant
    Filed: December 4, 2014
    Date of Patent: January 29, 2019
    Assignee: ELEMENT SIX TECHNOLOGIES LIMITED
    Inventors: Joseph Dodson, Yevgeny Vasilievich Anoikin, Daniel Twitchen, Mark Robin McClymont
  • Patent number: 10188001
    Abstract: The present invention relates to printed circuit boards (PCBs), and more particularly, to methods of forming high aspect ratio through holes and high precision stub removal in a printed circuit board (PCB). The high precision stub removal processes may be utilized in removing long stubs and short stubs. In the methods, multiple holes of varying diameter and depth are drilled from an upper and/or lower surface of the printed circuit board utilizing drills of different diameters.
    Type: Grant
    Filed: January 22, 2015
    Date of Patent: January 22, 2019
    Assignee: SANMINA CORPORATION
    Inventors: Douglas Ward Thomas, Shinichi Iketani, Dale Kersten
  • Patent number: 10168024
    Abstract: The invention provides a lighting panel, for use for example within a modular surface system, comprising one or more strips of solid state lighting elements associated with a reflector structure. The lighting panel is adapted for improved uniformity of light intensity across the width of its output area. Lighting elements comprise two or more subsets, each subset adapted to collectively generate a different light intensity profile across the width of the panel output window. The subsets are selectively adapted to generate profiles which, when blended, mutually offset one another's deviations from some common mean intensity across the width of the output window, thereby generating a combined intensity profile of improved uniformity. Embodiments include arrangements in which subsets of lighting elements are adapted to have differing actual or virtual optical path lengths to the reflector surface.
    Type: Grant
    Filed: December 15, 2015
    Date of Patent: January 1, 2019
    Assignee: PHILIPS LIGHTING HOLDING B.V.
    Inventors: Silvia Maria Booij, Hendrik Jan Kettelarij, Ronald Cornelis De Gier, Michiel De Jong
  • Patent number: 10170680
    Abstract: A method for adjusting a qubit includes measuring a qubit characteristic of a qubit device and computing a modification to correct the qubit characteristic. A geometry of a shunt capacitor is adjusted using a laser direct write process. The qubit characteristic is verified.
    Type: Grant
    Filed: September 16, 2015
    Date of Patent: January 1, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: David W. Abraham, Jay M. Gambetta, Mary B. Rothwell
  • Patent number: 10149980
    Abstract: A high density electrical connector system is disclosed which may make use of first and second connector components. The first connector component has a first substrate with a first plurality of electrical feedthroughs and at least a first plurality of electrically conductive bond pads in communication with the first plurality of electrical feedthroughs. The second connector component has a second substrate with a second plurality of electrical feedthroughs and at least a second plurality of electrically conductive bond pads in communication with the second plurality of electrical feedthroughs. An electrical coupling subsystem is disposed between the first and second connector components and makes electrical contact between associated pairs of the first and second pluralities of electrically conductive bond pads. A plurality of fasteners may be used for clamping the first and second connector components in facing relationship.
    Type: Grant
    Filed: June 24, 2015
    Date of Patent: December 11, 2018
    Assignee: Lawrence Livermore National Security, LLC
    Inventors: Kedar G. Shah, Satinderpall S. Pannu, Susant Patra
  • Patent number: 10134939
    Abstract: An optical sensor module has a light receiver and a light-emitter which is surrounded by a light blocking wall, wherein the light receiver is disposed on a main plate and the light-emitter is disposed on a side plate separately from the main plate. The light blocking wall is formed as a light barrier wall between the light receiver and the light-emitter. A projecting portion projecting upward from the main plate is enclosed by the light barrier wall, and a top face of the projecting portion is higher than the light receiving face and the light-emitting face.
    Type: Grant
    Filed: October 20, 2017
    Date of Patent: November 20, 2018
    Assignees: Lite-On Opto Technology (Changzhou) Co., Ltd., Lite-On Technology Corp.
    Inventors: Tsan-Yu Ho, Chen-Hsiu Lin, Meng-Sung Chou
  • Patent number: 10085347
    Abstract: Method for the manufacture of a circuit board containing a component and circuit board containing a component. The invention is based on first manufacturing (101-102 or 101-103) an intermediate product, which contains the insulator layer of the circuit board and the components, which are set in place inside the insulator layer, in such a way that the contact elements of the components face the surface of the intermediate product. After this, the intermediate product is transferred to the circuit-board manufacturing line, on which a suitable number of conducting-pattern layers and, if necessary, insulator layers are manufactured (104) on one or both sides of the intermediate product, in such a way that, when manufacturing the first conducting-pattern layer, the conductor material forms an electrical contact with the contact elements of the components. Alternatively, stages (101-105) can also be performed on a single manufacturing line.
    Type: Grant
    Filed: March 18, 2015
    Date of Patent: September 25, 2018
    Assignee: GE Embedded Electronics Oy
    Inventors: Risto Tuominen, Petteri Palm, Antti Iihola
  • Patent number: 10083785
    Abstract: A magnetic sheet 1 of an embodiment includes a stack of a plurality of magnetic thin strips and resin film parts. The stack includes from 5 to 25 pieces of the magnetic thin strips. The magnetic thin strips are provided with cutout portions each having a width of 1 mm or less (including 0 (zero)). A ratio (B/A) of a total length B of the cutout portions provided to the magnetic thin strip to a total outer peripheral length A of an outer peripheral area of the magnetic thin strip arranged on one of the resin film parts is in a range of from 2 to 25.
    Type: Grant
    Filed: October 24, 2013
    Date of Patent: September 25, 2018
    Assignees: Kabushiki Kaisha Toshiba, Toshiba Materials Co., Ltd.
    Inventors: Takao Sawa, Katsuhiko Yamada, Tadao Saito
  • Patent number: 10075009
    Abstract: A receiving antenna of a wireless power receiving device wirelessly charging electrical power according to an embodiment of the present invention includes a substrate, a soft magnetic layer stacked on the substrate, including a soft magnetic material, and having gaps at predetermined intervals, and a coil stacked on the soft magnetic layer and receiving electromagnetic energy emitted from a wireless power transmission device.
    Type: Grant
    Filed: June 16, 2014
    Date of Patent: September 11, 2018
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Heejung Lee, Seok Bae, Jai Hoon Yeom
  • Patent number: 10051747
    Abstract: Methods for the production of a circuit board involving the removal of a subregion in accordance with various embodiments of the invention are disclosed. In one embodiment, the production of a circuit board, made of at least two interconnected layers of material, involving the removal of a subregion including a portion of at least one of the at least two interconnected layers from the circuit board includes providing an adhesion preventing material under the subregion to be removed to a layer in the at least two interconnected layers that is adjacent to the at least one layer including the subregion, separating edge regions of the subregion to be removed from adjoining regions of the circuit board, connecting an external surface of the subregion to be removed to an external element, and displacing the external element to separate the subregion to be removed from the adjacent layer of the circuit board.
    Type: Grant
    Filed: December 3, 2012
    Date of Patent: August 14, 2018
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Markus Leitgeb, Gerald Weidinger, Gerhard Schmid, Ljubomir Mareljic, Volodymyr Karpovych
  • Patent number: 10037117
    Abstract: A two-dimensional sensor arrangement is provided that detects locations, e.g. finger locations, in two or three dimensions, which is particularly suitable for touch-sensitive touchpads or touchscreens. The sensor arrangement includes a sensing zone in which a plurality of sensors are arranged, and contact zone, e.g. externally thereto, in which a plurality of electrically conductive contact points are arranged, which are connected to the sensors. The number of contact points is very small, although the electrically conductive components of the sensor arrangement form a single-layered network.
    Type: Grant
    Filed: November 9, 2016
    Date of Patent: July 31, 2018
    Assignee: SCHOTT AG
    Inventors: Thomas Zenker, Franziska Back, Franziska Riethmueller
  • Patent number: 10017383
    Abstract: An approach includes a method of fabricating a switch. The approach includes forming a fixed electrode, forming a first cantilevered electrode, forming a second cantilevered electrode aligned vertically over the first fixed electrode, and which has an end that overlaps and is operable to directly contact an end of the first cantilevered electrode upon an application of a voltage to the fixed electrode, and forming a hermetically sealed volume encapsulating the first fixed electrode, the second fixed electrode, the first cantilevered electrode, and the second cantilevered electrode.
    Type: Grant
    Filed: October 15, 2015
    Date of Patent: July 10, 2018
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Stephen E. Luce, Anthony K. Stamper
  • Patent number: 10008797
    Abstract: Flexible printed circuit (FPC) connector includes a flex circuit having first and second side surfaces and a thickness extending between the first and second side surfaces. The flex circuit includes a plurality of stacked substrate layers. The FPC connector also includes a conductive pathway extending through the flex circuit and a substrate protrusion coupled to the second side surface and projecting a distance away from the second side surface. The substrate protrusion is formed from at least one dielectric layer. The FPC connector also includes a contact pad that is directly coupled to at least one of the substrate protrusion or the second side surface of the flex circuit. The contact pad is electrically coupled to the conductive pathway.
    Type: Grant
    Filed: July 10, 2015
    Date of Patent: June 26, 2018
    Assignee: TE Connectivity Corporation
    Inventors: Mudhafar Hassan-Ali, Jason Larson
  • Patent number: 10001888
    Abstract: A touch sensor panel including a plurality of drive lines crossing a plurality of sense lines, forming an array. The plurality of drive lines and the plurality of sense lines are formed by interconnecting sections of at least one conductive material having a truncated diamond shape or formed of interconnected conductive lines. At least one conductive dummy region may be disposed in an area of the touch sensor panel around the truncated diamond shape sections or interconnected conductive lines of the plurality of drive lines and the plurality of sense lines. One or more lines may be formed overlapping the interconnected sections of each of the plurality of drive lines and the plurality of sense lines.
    Type: Grant
    Filed: March 11, 2015
    Date of Patent: June 19, 2018
    Assignee: Apple Inc.
    Inventors: Seung Jae Hong, Martin Paul Grunthaner, Steven Porter Hotelling, Lynn Youngs
  • Patent number: 9999167
    Abstract: An apparatus for removing cables is provided. The apparatus includes a worktable. An upper surface of the worktable is used to fix at least one motherboard separately. Each motherboard includes a cable fixed thereon. The apparatus includes a feeding assembly, a driving assembly and a removing assembly. The driving assembly and the removing assembly are located on the feeding assembly. The feeding assembly is used to drive the driving assembly and the removing assembly to move to a pre-defined position. The driving assembly is used to drive the removing assembly to remove the cable from the motherboard.
    Type: Grant
    Filed: May 15, 2015
    Date of Patent: June 12, 2018
    Assignees: Fu Tai Hua Industry (Shenzhen) Co., Ltd., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Yu-Ching Liu, Fu-Chi Yang, Jin-Song Zheng, Jing-Bin Liang, Hai-Gui Huang, Qin-Xian Yi, Ji-Ke Shan, Xue-Wu Mo
  • Patent number: 9999137
    Abstract: A method for filling a via on a printed circuit board formulates a paste as a dispersion of copper particulate that includes nanocopper particles in a solvent and a binder and depositing the paste into a via cavity formed in the printed circuit board. Heating the paste-filled cavity removes most of the solvent. The method sinters the deposited paste in the via cavity, planarizes the sintered via, and overplates the filled via with copper.
    Type: Grant
    Filed: November 3, 2015
    Date of Patent: June 12, 2018
    Assignee: Intrinsiq Materials, Inc.
    Inventors: David Ciufo, Janet Heyen
  • Patent number: 9974945
    Abstract: According to an embodiment, an electrode array for a transmodiolar implant is disclosed. The implant includes a substrate, a conductive metal located at a plurality of discrete portions on the substrate; and a single layer of insulation material over the conductive metal and the substrate. The single layer of insulation material includes a plurality of apertures that expose the conductive metal, the exposed conductive metal forming a plurality of electrodes, the electrode array having a Young's modulus of at least 100 GPa.
    Type: Grant
    Filed: November 6, 2015
    Date of Patent: May 22, 2018
    Assignee: OTICON MEDICAL A/S
    Inventors: Guillaume Tourrel, Dan Gnansia, Nicolas Veau
  • Patent number: 9961768
    Abstract: A multilayer wiring substrate that can realize a higher-density wiring structure is obtained. Provided is a multilayer wiring substrate, where a multilayer body including a first insulating layer and a second insulating layer stacked on the bottom surface of the first insulating layer includes printed wiring electrodes; the printed wiring electrodes are formed by printing with and sintering conductive paste; the printed wiring electrodes respectively include first wiring electrode portions located on the second insulating layer and second wiring electrode portions respectively joined to first wiring electrode portions; and the second wiring electrode portions respectively extend into through holes and, further, are exposed at the top surface of the first insulating layer.
    Type: Grant
    Filed: October 21, 2015
    Date of Patent: May 1, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yoshihito Otsubo, Toru Meguro, Tatsunori Kan
  • Patent number: 9952726
    Abstract: A touch module includes a plurality of sensing electrodes partly crossing with each other and a plurality of signal lines electronically connected to a corresponding sensing electrode from amongst the plurality of sensing electrodes. Each sensing electrode includes a main sensing portion, a first sub-sensing portion, and a second sub-sensing portion. The first sub-sensing portion and the second sub-sensing are symmetrically located on opposite surfaces of the main sensing portion. The first sub-sensing portion includes a first solid portion. The second sub-sensing portion includes a second solid portion. The first sub-sensing portion defines a first receiving portion in a middle of first sub-sensing portion for receiving the second receiving portion of the adjacent and crossed sensing electrode. The second sub-sensing portion defines a second receiving portion from edges of the second sub-sensing portion for receiving the first receiving portion of the adjacent and crossed sensing electrode.
    Type: Grant
    Filed: September 18, 2015
    Date of Patent: April 24, 2018
    Assignees: INTERFACE OPTOELECTRONIC (SHENZHEN) CO., LTD., GENERAL INTERFACE SOLUTION LIMITED
    Inventor: Kung-Chieh Huang
  • Patent number: 9942993
    Abstract: An approach for through-hole component soldering for a PCB, and a resulting PCB assembly, that eliminates protruding solder joints, is provided. The approach comprises back-drilling, from a bottom surface of a PCB, one or more through-holes, wherein each back-drilled through-hole is back-drilled to a depth partially through the PCB and at a diameter that is larger than the diameter of the through hole. Solder paste is applied to the PCB. The components are placed on the PCB, inserting each pin into a corresponding through-hole. The PCB is passed through a solder process, whereby, within each through-hole having a component pin inserted therein, the solder paste is wicked into the through-hole, and forms a solder joint with the respective pin. Each solder joint of a back-drilled through-hole is situated within the through-hole in a manner whereby the solder joint does not protrude beyond the bottom surface of the PCB.
    Type: Grant
    Filed: December 26, 2014
    Date of Patent: April 10, 2018
    Assignee: DISH TECHNOLOGIES L.L.C.
    Inventors: Andros Thomson, Jr., Yt Ho
  • Patent number: 9924883
    Abstract: Disclosed herein are neural probes comprising an L1 polypeptide functional fragment thereof on the exterior surface of the probe, devices including such electrodes, and methods of their use. The disclosed embodiments are useful, for example, for in methods of recording and/or stimulating neural signals in a subject.
    Type: Grant
    Filed: June 27, 2014
    Date of Patent: March 27, 2018
    Assignee: University of Pittsburgh—Of the Commonwealth System of Higher Education
    Inventors: Xinyan T. Cui, Carl F. Lagenaur, Erdrin Azemi, Noah R. Snyder
  • Patent number: 9917013
    Abstract: In one embodiment, die are singulated from a wafer having a back layer by placing the wafer onto a carrier substrate with the back layer adjacent the carrier substrate, forming singulation lines through the wafer to expose the back layer within the singulation lines, and applying a pressure substantially uniformly along the second major surface to batch separate the layer of material in the singulation lines. In one embodiment, a fluid filled vessel can be used to apply the pressure.
    Type: Grant
    Filed: January 11, 2017
    Date of Patent: March 13, 2018
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventor: Gordon M. Grivna
  • Patent number: 9906879
    Abstract: Disclosed herein, among other things, are systems and methods for solderless module connectors for hearing assistance devices. One aspect of the present subject matter includes a method of assembling a hearing assistance device. According to various embodiments, the method includes providing a structure including a laser-direct structuring (LDS) portion, and inserting a flexible universal circuit module (UCM) having conductive surface traces into the structure. The UCM is electrically connected to the LDS portion using direct compression without the use of wires or solder, according to various embodiments.
    Type: Grant
    Filed: April 22, 2015
    Date of Patent: February 27, 2018
    Assignee: Starkey Laboratories, Inc.
    Inventors: David Prchal, Susie Johansson, John Dzarnoski
  • Patent number: 9871897
    Abstract: Apparatuses and methods for creating a sensor stack or element for use in an electronic device. In one example, a method may include providing a substrate made of sapphire; affixing, by physical vapor deposition, a decorative feature on the substrate; providing a silicon layer including a capacitive sensor; and bonding the sensor to the substrate. In one example, the affixing operation may include an icon, logo, symbol or other graphic as the decorative feature. The method may also include reducing the substrate or silicon layer from an initial thickness to a second thickness, the second thickness being thinner that the initiation thickness. The sensor stack may be used or configured as an input button for the electronic device such as a mobile phone, tablet computer, or other computing device.
    Type: Grant
    Filed: September 8, 2014
    Date of Patent: January 16, 2018
    Assignee: APPLE INC.
    Inventors: Benjamin B. Lyon, Patrick E. O'Brien, Scott A. Myers
  • Patent number: 9860994
    Abstract: A circuit board having a substrate, a first metal layer, a second metal layer and a solder mask layer. The first metal layer and the second metal layer with unequal surface areas spacedly arranged on the substrate and respectively providing a first solderable region and a second solderable region with equal surface areas. The solder mask layer having an opening and covered on the substrate, the first metal layer and the second metal layer to expose the first solderable region and the second solderable region. Besides, the first metal layer further provides a window abutted to the first solderable region, and the opening exposes a first blank region and a second blank region. Thus, the problem of unequal solder regions due to offset of the solder mask layer can be avoided, and improving the yield rate of the fabrication process.
    Type: Grant
    Filed: December 2, 2015
    Date of Patent: January 2, 2018
    Assignee: Universal Global Technology (Shanghai) Co., Ltd.
    Inventors: Wan-Chen Chan, Chun-Chi Chiu, Hsun-Fa Li
  • Patent number: 9817528
    Abstract: A touch sensitive device includes a plurality of first electrodes; a plurality of second electrodes, disposed around the plurality of first electrodes; a plurality of first surrounding pattern that are formed by the plurality of first electrodes and the plurality of second electrodes and a plurality of second surrounding patterns that are formed by the plurality of first electrodes and the plurality of second electrodes. Each of the first surrounding patterns comprises one of the first electrodes that interleaves with one of the second electrodes. Each of the second surrounding patterns comprises one of the second electrodes that is sandwiched between another of the second electrodes and one of the second electrodes.
    Type: Grant
    Filed: November 17, 2014
    Date of Patent: November 14, 2017
    Assignee: HIMAX TECHNOLOGIES LIMITED
    Inventors: Chia-Wei Hu, Wai Pan Wu, Shen-Feng Tai
  • Patent number: 9780324
    Abstract: An OLED includes a first electrode, a second electrode arranged on the first electrode, a light emitting layer arranged between the first electrode and the second electrode, and a conductive layer arranged within the light emitting layer or being directly contacted with the light emitting layer. In view of the above, by configuring a conductive layer within the OLED, the OLED may be adjusted and balanced by an external voltage such that the OLED may not be limited to the circuit input between two electrodes. In this way, the lighting brightness of the OLED may be adjusted. In addition, the evaporated conductive layer may not damage the light emitting layer, and thus the OLED component of top-emission may be adopted.
    Type: Grant
    Filed: August 24, 2015
    Date of Patent: October 3, 2017
    Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd
    Inventor: Lixuan Chen
  • Patent number: 9723726
    Abstract: A film composite with electrical functionality for application on a substrate includes at least one conductive structure, a first bonding coat, a film layer and a second bonding coat. The first bonding coat is disposed on an underside of the at least one conductive structure, wherein the first bonding coat has an adhesive effect for application of the at least one conductive structure on the substrate. The second bonding coat is disposed between an upper side of the at least one conductive structure and the film layer. The second bonding coat has an adhesive effect, by which the film layer adheres to the at least one conductive structure.
    Type: Grant
    Filed: February 25, 2015
    Date of Patent: August 1, 2017
    Assignee: Schreiner Group GmbH & Co. KG
    Inventors: Wolfram Fischer, Olaf Nitschke, Thomas Samuel, Oliver Wiesener
  • Patent number: 9711424
    Abstract: A low thermal stress package for large area semiconductor dies. The package may include a substrate and at least one pedestal extending from the substrate, wherein the pedestal may have a mounting surface that is smaller than a mounting surface of a semiconductor die that is mounted to the pedestal. The bonded area between the die and the pedestal is therefore reduced relative to conventional semiconductor package substrates, as is the amount of thermal stress sustained by the die during thermal cycling.
    Type: Grant
    Filed: September 16, 2013
    Date of Patent: July 18, 2017
    Assignee: Littelfuse, Inc.
    Inventors: Richard J. Bono, Neil Solano
  • Patent number: 9666729
    Abstract: An electronic device in the form a two-dimensional array of nanopillars extending generally normal to a substrate is provided. The nanopillars are made from a paraelectric or superparaelectric material. In addition, a linear dielectric medium is located between individual nanopillars. A two-dimensional array of paraelectric or superparaelectric nanopillars and a linear dielectric medium form the effective dielectric medium of a paraelectric or superparaelectric varactor. In some instances, the nanopillars are cylindrical nanopillars that have an average diameter and/or average height/length between 1-300 nanometers. In other instances, the nanopillars are quasi-nanoparticles that form self-aligned nano-junctions. In addition, each of the nanopillars has a single paraelectric or superparaelectric dipole domain therewithin. As such, each of the nanopillars can be void of crystallographic defects, polycrystallinity, interactions between ferroic domains, and defects due to ferroic domain walls.
    Type: Grant
    Filed: September 19, 2014
    Date of Patent: May 30, 2017
    Assignee: The United States of America as represented by the Secretary of the Army
    Inventors: Ryan C. Toonen, Mathew P. Ivill, Melanie W. Cole
  • Patent number: 9639721
    Abstract: An encoding module and related systems and components are provided. The encoding module includes a plurality of encoding elements arranged in an array of columns and rows and one or more switching elements configured to selectively connect the encoding elements to a reader. The connection of the encoding elements may be based on the location of a targeted transponder disposed among multiple adjacent transponders to ensure the selective communication with the targeted transponder only. The module is configured for various types and locations transponders to be used within a system, such as a printer-encoder. Each encoding element may include a loaded conductive strip comprising a loop shape portion and a shield that corresponds to the loop shape portion. In another embodiment, an access control system having an encoding module with the plurality of couplers and an access card having a plurality of transponders corresponding to the couplers is provided.
    Type: Grant
    Filed: September 30, 2014
    Date of Patent: May 2, 2017
    Assignee: ZIH Corp.
    Inventors: Boris Y. Tsirline, Robert S. Gawelczyk, Steven R. Kovanko, Anthony Brown, Mao Tian, Karl Torchalski, Michael Fein, Christopher Aiello
  • Patent number: 9596748
    Abstract: A lens mount is attached to a circuit board and covers electrical components on the circuit board. An electrically insulating device is positioned between the lens mount and the circuit board. The circuit board includes a grounding pad adjacent the electrically insulating device. The lens mount includes an aperture aligned with the grounding pad and the electrically insulating device. A conductive glue is dispensed into the aperture to electrically ground the lens mount to the grounding pad. The electrically insulating device seals the conductive glue from the electrical components. A method of grounding a lens mount to a circuit board is provided.
    Type: Grant
    Filed: March 28, 2013
    Date of Patent: March 14, 2017
    Assignee: STMicroelectronics Pte Ltd
    Inventor: Wee Chin Judy Lim