Abstract: An under-bump metallization (UBM) design comprises a semiconductor chip having a plurality of interconnect layers, a passivation layer atop the plurality of interconnect layers, and a UBM layer atop the passivation layer, wherein a surface of the UBM layer comprises at least a first area recessed into the passivation layer and a second area recessed into the passivation layer. A metal bump may be formed atop the UBM layer. A center portion of the metal bump is mounted within the first area while an anchor portion of the metal bump is mounted within the second area.

Abstract: The invention provides a CSP type semiconductor device with high reliability. The semiconductor device includes a pad electrode formed on a semiconductor substrate, a first passivation film covering an end portion of the pad electrode and having a first opening on the pad electrode, a plating layer formed on the pad electrode in the first opening, a second passivation film covering an exposed portion of the pad electrode between an end portion of the first passivation film and the plating layer, covering an end portion of the plating layer, and having a second opening on the plating layer, and a conductive terminal formed on the plating layer in the second opening.

Abstract: An integrated circuit system includes providing a semiconductor substrate having a semiconductor device provided thereon. A first dielectric layer is formed over the semiconductor substrate, and a first conductor core is formed in the first dielectric layer. A stop layer is formed over the first conductor core. A second dielectric layer is formed over the stop layer. A channel and a via are formed in the second dielectric layer. The channel and the via in the second dielectric layer are wet cleaned. A barrier metal layer is deposited to line the channel and the via in the second dielectric layer. The barrier metal layer is selectively etched from the bottom of the via in the dielectric layer, and a second conductor core is formed over the barrier metal layer to fill the second channel and the via to connect the second conductor core to the first conductor core.

Abstract: The present invention discloses an interconnect structure for an integrated circuit formed on a semiconductor substrate. In one embodiment, the first conductive layer is formed above the semiconductor substrate. A first via contact is formed on the first conductive layer. A second via contact is formed on the first via contact. A second conductive layer is formed on the second via contact. One of the first and second via contacts has a cross-sectional area substantially larger that of another for improving a landing margin thereof, thereby eliminating a need of using a landing pad between the first and second via contacts.

Abstract: A semiconductor product includes, a substrate with a first dielectric layer having contact hole fillings for contacting active areas in the substrate. A second dielectric layer with contact holes is provided therein. The contact holes have a width in a first lateral direction. The product further includes conductive lines, each conductive line passing over contact holes in the second dielectric layer and contacting a plurality of contact hole fillings in the first dielectric layer. The conductive lines have a width, in the first lateral direction, that is smaller than the width of the contact holes of the second dielectric layer. The conductive lines are in direct mechanical contact with the contact hole fillings and thereby remove the need to provide any conventional “contact to interconnect” structures.

Abstract: A semiconductor device. A diffusion barrier layer overlies a substrate. An adhesion promoting layer overlies the diffusion barrier layer. A first dielectric layer between the diffusion barrier layer and the adhesion promoting layer comprises at least one via opening through the diffusion barrier layer and the adhesion promoting layer. A second dielectric layer overlies the adhesion promoting layer, comprising a trench opening above the via opening. A metal interconnect fills the via and trench openings.

Abstract: A semiconductor device includes a guard ring formed in an inter-level insulating film on a semiconductor substrate to surround an element forming region on the semiconductor substrate and containing Cu as a main component. And the device further includes a first barrier film formed on an interface between the inter-level insulating film and the guard ring and containing a compound of a preset metal element and a constituent element of the inter-level insulating film as a main component.

Abstract: A semiconductor device includes at least three or more wiring layers stacked in an interlayer insulating film on a semiconductor substrate, a seal ring provided at the outer periphery of a chip region of the semiconductor substrate and a chip strength reinforcement provided in part of the chip region near the seal ring. The chip strength reinforcement is made of a plurality of dummy wiring structures and each of the plurality of dummy wiring structures is formed to extend across and within two or more of the wiring layers including one or none of the bottommost wiring layer and the topmost wiring layer using a via portion.

Abstract: A semiconductor device having a configuration, which provides a prevention from a disconnection occurred by a setback of an interconnect that is caused in a microinterconnect having a linewidth of equal to or smaller than 0.1 ?m connected through a via is provided. An insulating film 204 is formed on a silicon substrate 203, and an M1 interconnect 103 and an M2 interconnect 104 are alternately disposed in this region, and these interconnects are connected through the vias 105. Here, widths of the M1 interconnect 103 and the M2 interconnect 104 are all 70 nm, which is the minimum linewidth. In such structure, the via 105 has a width, which is the same as the minimum linewidth of the M1 interconnect 103 and the M2 interconnect 104, and that the M1 interconnect 103 and the M2 interconnect 104 are commonly connected through a plurality of vias 105.

Abstract: A thermal interface material is provided using composite particles. Advantages include increased thermal conductivity and improved mechanical properties such as lower viscosity. In selected embodiments free particles such as metallic particles or carbon nanotubes, etc. are included in a thermal interface material along with composite particles. An advantage of including free particles along with composite particles includes improved packing density within selected embodiments of thermal interface materials.

Abstract: A semiconductor device includes a first metal layer provided above a semiconductor substrate, an interlayer insulating film provided above the first metal layer, a second metal layer that is provided in an opening formed in the interlayer insulating film and is in contact with an underlying layer, the second metal layer being connected to the first metal layer, and a first barrier layer that is provided between the second metal layer and the interlayer insulating film and has a different main composition from that of the underlying layer.

Abstract: A semiconductor chip includes a semiconductor substrate 11, a through via 12 provided in a through hole 17 that passes through the semiconductor substrate 11, insulating layers 21-1 to 21-3 laminated on the semiconductor substrate 11, a multi-layered wiring structure 14 having a first wiring pattern 22 and a second wiring pattern 23, and an external connection terminal 15 provided on an uppermost layer of the multi-layered wiring structure 14, wherein the through via 12 and the external connection terminal 15 are connected electrically by the second wiring pattern 23.

Abstract: A method of interconnecting terminals so as to obtain an excellent electrical connection between terminals such as opposing electrodes and a mounting method for semiconductor devices using this connecting method are provided. Electrode pads 21 of a semiconductor chip 20 and lands 11 which are provided on a substrate 10 so as to correspond with the electrode pads 21 are placed so as to oppose each other with an electrically conductive adhesive therebetween. Then, the electrically conductive adhesive is heated to a temperature which is higher than the melting point of electrically conductive particles contained in the electrically conductive adhesive and at which a resin is not completely cured, and the electrically conductive particles are bonded to each other. Then, the semiconductor chip 20 and the substrate 10 are secured by completely curing the resin in the electrically conductive adhesive.

Abstract: Flip-chip bonding structures using an MCM-D substrate are disclosed. A flip-chip bonding structure using an MCM-D substrate includes: a silicon substrate, a Si-bump disposed at a predetermined position of the silicon substrate, wherein a material of the Si-bump is the same as the silicon substrate, a dielectric layer disposed on the silicon substrate and a transmission line formed on the Si-bump to connect to a circuit formed on the dielectric layer.

Abstract: A substrate for device bonding includes a substrate having an electrode layer and a solder layer formed on the electrode layer, wherein the solder layer is a Pb-free solder layer which comprises (1) a base metal composed of (i) Sn, (ii) Sn and Au, or (iii) In, (2) at least one metal selected from the group consisting of Bi, In (only in the case where the base metal is Sn, or Sn and Au), Zn, Au (only in the case where the base metal is In) and Sb, and (3) at least one metal selected from the group consisting of Ag, Ni, Fe, Al, Cu and Pt, and the solder layer has a thickness of 1 to 15 ?m and a surface roughness (Ra) of not more than 0.11 ?m.

Abstract: Provided is a semiconductor device with improved signal transmission characteristics. The semiconductor device includes a substrate and a semiconductor chip. The substrate includes connection pads mounted in a central area of a top surface of the substrate, balls attached to a bottom surface of the substrate, and an area on the bottom of the substrate directly below the connection pads which is depopulated of balls. The semiconductor chip Whose bottom surface is mounted on one of the two sections has an edge-pad structure in which chip pads are disposed on a portion of a top surface so as to be adjacent to the connection pads. The connection pads are connected to the corresponding chip pads by bonding wires. The semiconductor chip is less than half the size of the substrate. The chip pads are disposed in the same direction as the connection pads. The connection pads are aligned in one or more rows in a central area of the substrate.

Abstract: A wiring layer is provided on a semiconductor substrate and extends in a predetermined direction. An external connection electrode terminal is provided on the wiring layer through a plurality of column-shaped conductors. The column-shaped conductors are located under the external connection electrode terminal. A density of arrangement of the column-shaped conductors is varied according to a direction of extension of the wiring layer.

Abstract: One example electronic assembly includes a substrate that has a plurality of contacts which become bonded to a plurality of contacts on a die. The electronic assembly further includes a male member that extends from at least one of the substrate and the die and a female member that extends from the other of the substrate and the die. The male member is inserted into the female member to align the die relative to the substrate. The male member and the female member may have any configuration as long as one or more portions of the male member extend partially, or wholly, into the female member. An example method includes aligning a die relative to a substrate by inserting a male member that extends from one of the die and the substrate into a female member that extends from the other of the die and the substrate.

Abstract: A semiconductor device with semiconductor device components embedded in a plastics composition is disclosed. In one embodiment, organosilicon and organometallic compounds are used for producing an adhesion promoter layer. The adhesion promoter layer on the surfaces of the semiconductor device components of a semiconductor device has a microporous morphology and has an average thickness D of between 5 nm?D?300 nm.

Abstract: A wire bonding apparatus 10 including an XYZ drive mechanism 20 for moving a bonding arm 21 that has a bonding capillary 24 at its tip end, an XYZ drive mechanism 30 for driving a plasma arm 31 that has a plasma capillary 40 having a high-frequency coil wound at its tip end portion end, a gas supply unit 60 for supplying gas to the plasma capillary, and a high-frequency power supply unit 80 for supplying high-frequency electric power to the high-frequency coil. With a supply of high-frequency electric power to the high-frequency coil, gas is being a plasma inside the plasma capillary and is ejected from its tip end against a bonding subject 8, thus performing surface treatment on the bonding subject; and using the bonding capillary, bonding is performed interconnectedly with this surface treatment.

Abstract: Devices include at least one semiconductor die including at least one surface that is at least partially covered by a photopolymer material. The photopolymer material includes a plurality of discrete particles dispersed through a polymerized matrix. In some embodiments, the photopolymer material may cover at least a portion of each of a plurality of semiconductor dice attached to a substrate. Furthermore, the photopolymer material may cover only a portion of each of the plurality of semiconductor dice, and another photopolymer material may cover another portion of each of the plurality of semiconductor dice.

Abstract: The present invention relates to a method of treating a liquefied natural gas (LNG) stream, the method at least comprising the steps of: (a) supplying a stream comprising LNG as at least two separate streams to a vessel comprising a contacting zone, a first stream being fed above the contacting zone and a second stream being fed below the contacting zone; (b) supplying a stream comprising an inert fluid to the vessel; (c) contacting at least the first stream supplied in step (a) with the stream supplied in step (b) in the contacting zone, thereby obtaining an LNG stream being enriched in inert fluid; and (d) removing the LNG stream obtained in step (c) from the vessel.

Abstract: This invention is about the multi-layered membrane of disk-typed and tube-typed membrane air diffuser. This system is installed in the aeration tank of the sewage and waste water treatment system that is used to make the air, which was supplied from the blower, fine bubbles to spray them so that the oxygen in the air can be efficiently dissolved into the sewage and waste water. By doing it, this system analyzes and removes the biochemical oxygen demand and suspended solids biologically, and enables to be appropriately mixed so that the sedimentation within the aeration tank can be prevented.

Abstract: An aeration system for a submerged membrane module has a set of aerators connected to an air blower, valves and a controller adapted to alternately provide a higher rate or air flow and a lower rate of air flow in repeated cycles. In an embodiment, the air blower, valves and controller, simultaneously provide the alternating air flow to two or more sets of aerators such that the total air flow is constant, allowing the blower to be operated at a constant speed. In another embodiment, the repeated cycles are of short duration. Transient flow conditions result in the tank water which helps avoid dead spaces and assists in agitating the membranes.

Abstract: Method of vaporizing thermally sensitive substances, wherein the vaporization is carried out in a vaporizer having a porous structured surface and the temperature difference between the product-side surface of the vaporizer and the temperature of the vaporizing product are limited to from 0.1 to 10° C.

Abstract: There is provided a vaporizer in which the path of a reaction tube can be kept long, and vaporization can be promoted evenly by radiation heat from a heater by agitating a carrier gas into which a source solution is dispersed in the direction crossing the passing direction of the gas, the agitation being made by a centrifugal force produced when the gas passes through the reaction tube. A carrier gas into which a source solution consisting of a liquid or powder is dispersed is supplied from the upstream side to a spiral reaction tube 103, and the carrier gas into which the source solution is dispersed and which passes through the reaction tube 103 is vaporized by radiation heat from a heater 104.

Abstract: A method for laminating an optical assembly and the optical assembly formed thereby. An ultra thin lens is injection molded and may include a bifocal feature. A support lens, e.g. of the single vision type, is provided with a photochromic coating. A flexible two stage compound application process prepares the two lenses for lamination.

Abstract: The present application relates to a method of moulding a contact lens using a male mould (3) and a female mould (5). The method comprises the steps of introducing lens-forming material in a liquid state into the female mould. The male mould is then inserted into the female mould to a first relative position to form an assembly of the male and female moulds in which the moulds together define a moulding cavity (11) and a reservoir (21) for lens-forming material. During the insertion of the male mould to the first position thereof, part of the liquid state lens-forming material is expelled from the moulding cavity to the reservoir. Curing of the lens-forming material is then initiated in the moulding cavity whilst keeping open a pathway between the moulding cavity and the reservoir so as to allow lens forming material to flow from the reservoir into the moulding cavity to compensate for shrinkage of the lensforming material during curing.

Abstract: A process of dosing a starting material (SM) for optical lenses, into a female mould half (2), comprises the steps of: positioning a dosing tip (1) at a start position (P2) above the female mould half (2) and close to the edge of or laterally outside that portion (20) defining the lens-shaping surface, creating a continuous flow of starting material (SM) through the dosing tip (1) into the female mould half (2), moving the dosing tip (1) from the start position (P2) towards an end position (P3) in the region of the centre of the female mould half (2) once the starting material (SM) has contacted the surface (21) of the female mould half (2) with the dosing tip (1) being in the start position (P2), wherein the continuous flow of starting material (SM) through the dosing tip (1) and the movement of the dosing tip (1) from the start position (P2) to its end position (P3) are controlled such, that a continuous bead (B) of starting material (SM) is deposited on the surface (21) of the female mould half (2) a

Abstract: A process for porting air inflated flexible resin impregnated cured in place liner by pulling without loss of pressure is provided. A selectively openable bulkhead fitting is installed at the pull-in end. The filling may be installed in the end of a pull-in liner; on a porting sleeve or secured to an inflated pulled in or inverted liner. A port is formed through the bulkhead fitting by cutting a hole through the valve assembly. A steam fitting with an exhaust hose is coupled to the bulkhead fitting while maintaining pressure in the inflation bladder. Steam for curing the resin is then introduced into the inversion apparatus to cure the resin and is exhausted through the exhaust hose.

Abstract: According to one embodiment, a method for manufacturing a substrate for a discrete track recording media, the method includes forming an imprint resist layer on a substrate, imprinting, on the imprint resist layer, a stamper formed with patterns of protrusions and recesses corresponding to recording track zones and servo zones to transfer the patterns of protrusions and recesses to the imprint resist layer, removing the stamper from the imprint resist layer, and diffusing liquefied CO2 in a process chamber set at a pressure of 2 to 5 atm, diffusing liquefied H2O in the process chamber set at a pressure of 0.01 to 1 atm, or diffusing a reactive gas selected from a group consisting of liquefied CF4, CHF3, SF6, and C2F6 in the process chamber set at an arbitrary pressure, to jet spray the liquefied gas onto a surface of the substrate.

Abstract: An object is to provide an injection molding machine and an injection molding method which can prevent deterioration of injection characteristics and improve the quality of molded products. An injection molding machine includes a cylinder member; an injection member disposed in the cylinder member such that the injection member can advance and retreat; a plurality of heaters disposed on the outer circumference of the cylinder member; temperature detection sections disposed on the cylinder member at a plurality of positions along an axial direction so as to detect temperature of the cylinder member; a recording device (31) which stores a recorded target temperature distribution range indicating an optimal temperature range at each position of the cylinder member; and a control section for adjusting the set temperatures of the heaters such that each of the temperatures detected by means of the temperature detection sections falls within the target temperature distribution range.

Abstract: An apparatus and method for forming a textured polymeric film are disclosed. The apparatus includes a first roller and a second roller, wherein the first roller and the second roller may be configured to cooperatively form the textured polymeric film. In one embodiment, a limited portion of at least the first roller is heated, passively, actively, or by a combination of active and passive techniques.

Abstract: A process for preparation of improved ceiling tiles having different densities at desired points involves the step of preparing a slurry mix of 40-45% hydrated calcium silicate gel and a low density binder; 20-25% reinforcing fibre selected from mineral wool, glass wool and paper pulp; 3-5% gypsum, cellulose pulp and fillers selected from pulverized fly ash and calcium carbonate, pouring the slurry mix into a mould, introducing a false form, subjecting to vacuum and pressure to obtain the more or less material at desired points, removing the false form and further subjecting the semisolid slurry to pressure from top to produce tile with or without reinforcing ribs.

Abstract: A method for manufacturing anti-bacteria silicone rubber compound includes a first step of preparing anti-bacteria basic material by mixing an anti-bacteria agent and silicon oil in a proper proportion and temperature, a second step of rolling and pressing for several times for dispersing the anti-bacteria basic material, a third step of adding the dispersed anti-bacteria basic material in transparent two-liquid-type A/B basic material and stirring this mixture for several times for dispersing it into anti-bacteria silicone rubber compound liquid as a semi-product, and a fourth step of pouring the semi-product in an injecting molding machine for molding various finished semi-transparent anti-bacteria silicone rubber compound products.

Abstract: There is provided a method for producing a cushion material composed of a resin molded article with a spring structure which is so moldable as to allow the mold take any shape and size, is cheap, and resistant to collapsing, does not cause fatigue even after prolonged use, and has high shock absorbing capability and load capacity, and thus suitably used as a material of any supports on which one can sit, rest or mount such as seats of automotive vehicles, motor cycles, bicycles, electric trains, and aircraft, saddles for horse riding, chairs, sofas and beds, and a method for producing a cushion material requiring only a low cost for its disposal.

Abstract: The manufacture of zinc borate and calcium borate powders in a water slurry and drying those powders in a controlled manner such as to leave a desired residual of moisture content uniformly dispersed throughout the product produces a low dust, flowable material. This low dust material results in environmental and economic benefits to users of these preservative borates. The preferred amount of residual moisture is from 2 to 10 percent.

Abstract: An apparatus for placing a mold charge into a cavity includes a pair of hubs mounted for rotation around parallel axes, a link connected between the hubs at positions off-center relative to the parallel axes and a blade connected to the link. Rotation of the hubs causes the blade to travel in an elliptical path relative to an extrusion orifice to cut mold charges from the orifice and place the mold charges into cavities passing beneath the blade. The apparatus preferably includes a drive member that simultaneously rotates both of the hubs to drive the blade relative to the extrusion orifice and cavities. The blade preferably includes an arm that extends into a cavity to place a mold charge into the bottom of the cavity for consistent and accurate placement of the mold charges from one cavity to the next.

Abstract: In apparatus and processes for producing pellets of plastic resins and additives, the heat collected in the quench water of the pelletizer device is used to heat the plastic entering the process. This simple unique idea has an energy saving in the process.

Abstract: A device (1) for ageing a package of stones comprises a cage (24) for locking the package of stones with play being present. For the purpose of the ageing process of the stones, the cage (24) is suspended in a frame (30) which is rotatable about a rotation axis (55). During a rotary movement of the frame (30) and the cage (24), the stones collide against each other, and outer stones of the package additionally collide against plates (21,22,23) of the cage (24). The play between the package of stones and the cage (24) is chosen such that the stones have space to move on the one hand, and that the position and the orientation of the stones in the package are maintained on the other hand Consequently, after the ageing process has finished, the stones can be removed from the ageing device (1) as an ordered package.

Abstract: A device for use in tissue repair procedures, a surgical tissue repair procedure, and a method of making the device. Specifically, the device is an assembly of a cannulated anchor member with a cord passed through it, and a stopper mounted to an end of the cord to prevent the cord from passing back through the anchor member.

Abstract: A process is provided for producing a three-dimensional object having the steps forming the object (3) in a container (1, 200) arranged within a process chamber (100) on a carrier (4) which can be displaced in the container by sequential selective solidification of layers of a pulverulent material (11) which can be solidified by the action of electromagnetic or particle radiation at positions corresponding to the cross-section of the object in the particular layer, characterised by the step of controlled removal of non-solidified pulverulent material (11) after completing the object (3).

Abstract: Watercraft can be manufactured from a blush-resistant gel coat composition which in its cured state resists long-term water immersion. The cured gel coat composition forms an outer opaque layer in a multilayer (e.g., two-layer) laminate, and is made from an unsaturated polyester resin, reactive diluent, and sufficient pigment to provide an opaque cured coating. The composition is sufficiently free of extender filler so that the cured coating will not exhibit blushing after 6 hours immersion in 66° C. water.

Abstract: The invention relates to a method and device for the production of injection moulded parts, especially preforms, in an injection molding method. The raw material and the additives are fed to a plasticizing worm (4) which injects pressurized plastic melt into the cavities of an injection mould (7,8) and the injection molded parts are removed from the moulds after cooling has occurred. According to the invention, the additives, especially AA blockers or coloring, are added directly to the worm cylinder in liquid form in a dosed manner after the raw material has been inputted. The invention relates more specifically to the injection molding of preforms for the production of PET bottles. One advantage of the invention is that it enables the acetaldehyde content to be reduced by 50%, the dosing time can also be reduced significantly and said dosing can be stabilized in a significant manner.

Abstract: A process for treatment of the plastic profiles is disclosed. The process entails extruding and calibrating a plastic profile and then passing the profile through a bath containing at least one additive.

Abstract: A vascular embolization device comprises an elongated coil having a lumen, said coil and lumen being at least partially embedded in an elongated foam member comprising a flexible, biodegradable, water insoluble, open, interconnecting-cell foam material having embolic characteristics, and capable of allowing cell proliferation into the open cell foam interior. A manufacturing method is disclosed.

Abstract: A method and a device for the production of electrically conductors, especially current-carrying lines, having a sheathing made of a thermoplastic material. An extrusion head having a bore that determines the outer circumference of the conductor is employed for this purpose. The bore is variably adjustable in order to set a different outer circumference of the conductor during the production process.

Abstract: A method of forming a golf ball is disclosed herein. The method includes placing a golf ball precursor product with a thermoplastic polyurethane cover in a solution containing an isocyanate functionality reactive material. The precursor product is then removed from the solution and heated to remove solvent. The precursor product is then placed in an isocyanate solution. The precursor product is then removed and heated to remove solvent to prepare the precursor product for finishing.

Abstract: A method of manufacturing a honeycomb structure according to an embodiment of the present invention is characterized by including the steps of: forming a clay by mixing and kneading a silicon carbide powder raw material, a metal silicon raw material, an organic binder, and a raw material containing alkaline earth metal; forming the clay to form a formed body; and pre-firing and firing the formed body, wherein firing is performed in a protective container made of silicon carbide in which a solid containing aluminum is placed.

Abstract: Dried fibres which are designated for the production of fibre boards are supplied to a fibre roller (17) from a metering device through a feed chute (10) which is subjected to negative pressure, which fibre roller is provided on its surface with a plurality of pins (18) and rotates in such a manner that the fibres (14) are deflected by the pins (18), are directed along a chute section (22) defined by means of a partial section (20) of the periphery of the fibre roller (17) and an opposite-lying wall (21) and gluing means and said fibres are accelerated to approximately the peripheral speed of the fibre roller (17) by means of the pins (18) and an air flow generated by said pins. The fibres (36) lie against a section of the wall and are glued in the region of or adjacent to one end of the wall section and exit at an outlet orifice (23) of the chute section (22).