Abstract: A semiconductor device includes a first transistor having a first gate oxide layer with a first thickness; a second transistor having a second gate oxide layer with a second thickness different from the first thickness; and at least one of a capacitor and a variable capacitance diode. One of the capacitor and the variable capacitance diode includes a first electrode having a first area and a second area; a second electrode formed in the first area with the first gate oxide layer in between; and a third electrode formed in the second area with the second gate oxide layer in between. The second electrode and third electrode have comb shapes nested inside one another.

Abstract: A semiconductor package by which contacts are made to both sides of the dice is manufactured on a wafer scale. The back side of the wafer is attached to a metal plate. The scribe lines separating the dice are saw cut to expose the metal plate but the cuts do not extend through the metal plate. A metal layer, which may include a number of sublayers, is formed on the front side of the dice, the metal covering the exposed portions of the metal plate and extending the side edges of the dice. Separate sections of the metal layer may also cover connection pads on the front side of the dice. A second set of saw cuts are made coincident with the first set of saw cuts, using a blade that is narrower than the blade used to make the first set of saw cuts. As a result, the metal layer remains on the side edges of the dice connecting the back and front sides of the dice (via the metal plate).

Abstract: A memory cell structure and control of the memory operation are simplified, and the cost of production is decreased, by way of a semiconductor nonvolatile memory having a transistor including a gate electrode provided on a p-type semiconductor substrate via a gate insulating film, and a source region and a drain region, which are a pair of n-type impurity diffusion regions in the surface layer region of the semiconductor substrate at positions sandwiching the gate electrodes therebetween. A first resistance-varying portion and a second resistance-varying portion are sandwiched by the source region, drain region and channel-forming region. The n-type impurity concentration in the resistance-varying portions is lower than in the source and drain regions.

Abstract: A semiconductor package comprising a die paddle defining multiple corners and opposed first and second surfaces. At least one set of leads extends at least partially about the die paddle in spaced relation thereto. Each of the leads has opposed first and second surfaces. Attached to and extending from one of the corners of the die paddle is at least one tie bar which itself has opposed first and second surfaces and at least one aperture disposed therein and extending between the first and second surfaces thereof. Attached to the first surface of the die paddle is a semiconductor die which is electrically connected to at least one of the leads. A package body at least partially covers the die paddle, the leads, the tie bar and the semiconductor die such that the second surfaces of the leads are exposed in and substantially flush with a common exterior surface of the package body, and a portion of the package body extends through the aperture of the tie bar.

Abstract: An image reading apparatus (10) includes a photoelectric conversion element formation substrate (4) having a plurality of photoelectric conversion elements (2) on a reverse surface of an information reading surface, and a supporting substrate (1) bonded by an adhesive resin (5) to the photoelectric conversion element formation substrate (4) so that the supporting substrate (1) is integrated with the photoelectric conversion element formation substrate (4) and faces the plurality of photoelectric conversion elements (2) on the photoelectric conversion element formation substrate (4). With this arrangement, provided is a photoelectric conversion apparatus and manufacturing method of same in which (a) a process of bonding a micro glass sheet is not required and (b) a protrusion of an installation portion toward a surface of a document is eliminated.

Abstract: A hermetically sealed area includes a substrate having microelectronics thereon. A desiccant is operatively disposed within the hermetically sealed area. An equipotential region is substantially maintained around the desiccant.

Abstract: An LED package structure and a method for making the same are described. The LED package structure has at least one LED die, at least one metallic frame relating to the LED die, and an insulative body packaging the LED die and the metallic frame. The metallic frame has a first contact corresponding to the LED die and a second contact being relative to the first contact. The first and the second contacts inside the insulative body are electrically isolated from each other. The first contact has at least one recess around the LED die, and the second contact has at least one groove formed thereon.

Abstract: A semiconductor chip package is formed by a first semiconductor chip and a second semiconductor chip, which have electrodes for wiring at surfaces thereof, being integrated and mounted in a state in which reverse surfaces thereof oppose one another. Therefore, two semiconductor chips can be freely combined and mounted regardless of chip sizes thereof, and lengths of wires can be shortened. Thus, a wire-bonding yield can be improved, and a semiconductor package having excellent electric characteristics can be obtained.

Abstract: A high density electronic circuit for use in an implantable stimulation device that comprises a flexible substrate that has the advantage of integrating “chip-and-wire” microelectronic circuits and flexible interconnections that are adapted to conform to the body compatible housing into a single structure. The flexible substrate has die attach pads, each die attach pad having a set of wire bond pads therearound, each wire bond pad being connected to conductors formed within the substrate according to circuit function. A plurality of chip-and-wire integrated circuit (IC) chips are mounted by epoxy die attachment on the die attach pads, each IC chip has a plurality of contact pads formed on a top surface thereof, and gold wire bonds electrically connect the plurality of contact pads to the wire bonds pads. The wire bonds include a primary bond and, optionally, a safety bond for reinforcement. Other techniques are disclosed to enable the use of the gold wire bonds on a flexible substrate.

Abstract: In a memory and/or data processing device having at least two stacked layers which are supported by a substrate or forming a sandwiched self-supporting structure, wherein the layers include memory and/or processing circuitry with mutual connections between the layers and/or to circuitry in the substrate, the layers the are mutually arranged such that contiguous layers form a staggered structure on at least one edge of the device and at least one electrical edge conductor is provided passing over the edge on one layer and down one step at a time, enabling the connection to an electrical conductor in any of the following layers in the stack. A method for manufacturing a device of this kind includes the steps for adding the layers successively, one layer at a time, such that the layers form a staggered structure, and for providing one or more layers with at least one electrical contact pad for linking to one or more interlayer edge connectors.

Abstract: The present invention relates to a three-dimensional multichip stack electronic package structure and method for making the same, including a main substrate having at least a pin-hole set and at least a flexible substrate having at least a pin terminal. At least an electronic device including an active component and a passive component is attached to the flexible substrate by adhesion. In the flexible substrate, electric signals of the electronic device are delivered to the pin terminal through at least a conductive wire for transmitting electric signals. In assembly, the pin terminal of the flexible substrate is inserted into the pin hole of the main substrate. Then, the flexible substrate is folded so as to package the electronic device in a three-dimensional multichip stack manner.

Abstract: A connection arrangement for a micro lead frame plastic (MLP) package is provided that includes a paddle configured to be connected to a circuit board and a first ground pad and a second ground pad each connected to the paddle. The first and second ground pads together with the paddle are configured to provide continuity of ground between the circuit board and a chip mounted to the paddle.

Abstract: Solder joints coupling pins to a microelectronic package substrate are enshrouded with an encapsulation material. In this manner, pin movement is limited even if the pin solder subsequently melts.

Abstract: A semiconductor package includes a wiring board, a semiconductor chip flip-chip bonded to the wiring board, an adhesive coated on the wiring board, a stiffener ring attached to the wiring board, and a heat spreader attached to the stiffener ring and the semiconductor chip. The stiffener ring includes a window through which the semiconductor chip is exposed and multiple through holes. A thermal interface material (TIM) coated on the back surface of the semiconductor chip. The stiffener ring is attached to the heat spreader by portions of the adhesive squeezed onto the upper surface of the stiffener ring via the through holes, and the semiconductor chip is attached to the heat spreader by the TIM. A method for manufacturing a semiconductor package includes: flip-chip bonding a semiconductor chip to a wiring board; coating an adhesive on the wiring board; and attaching a stiffener ring to the wiring board. The stiffener ring includes a window through which the semiconductor chip is exposed and through holes.

Abstract: An embodiment of the present invention is a technique to provide heat extraction for semiconductor devices. At least a thermoelectric film is fabricated onto a bare wafer. The backside of the bare wafer is bonded to an active wafer having at least a device. The bonded bare and active wafers are annealed.

Abstract: There is provided a small-size electronic heat pump device which is low in power consumption and which secures a vacuum gap without use of an additional circuit. The electronic heat pump device includes an emitter 1 and a collector 2. An electrically and thermally insulative spacer section 5 for keeping a space, i.e. vacuum gap G between an emitter electrode 11 and a collector electrode 21 constant is integrally formed in a semiconductor substrate 20 of the collector 2, which makes it possible to maintain the vacuum gap to be a specified space while a back flow of heat is prevented in a simple structure with a reduced number of component parts.

Abstract: In order to inhibit the connection failure due to the degradation of the connection interface strength of the electrode pad and the warp thereof in the semiconductor device having an electrode pad, a metal layer formed on the electrode pad, and a metal bump formed on the metal layer, in the present invention, gold (Au) is contained in the metal layer, the metal bump is made of solder mainly made of Sn and designed to have an average height H of 100 ?m or less per unit area in the electrode pad, and the concentration of Au of the metal layer dissolved in the solder is set to 1.3×10?3 (Vol %) or less. More preferably, the metal bump contains palladium (Pd), and the solder coating for forming the metal bump on the electrode pad is performed by using the dipping and the paste printing in combination.

Abstract: Wafer-level chip-scale packaging technology is used for improving performance or reducing size of integrated circuits by using metallization of pad-to-bump-out beams as part of the integrated circuit structure. Chip-scale packaging under bump metal is routed to increase the thickness of top metal of the integrated circuit, increasing current carrying capability and reducing resistance. An exemplary embodiment for a power MOSFET array integrated structure is described. Another exemplary embodiment illustrated the use of chip-scale processes for interconnecting discrete integrated circuits.

Abstract: According to some embodiments, a device includes a first conductive plane electrically coupled to a first terminal associated with a first polarity and a second terminal associated with the first polarity, a second conductive plane electrically coupled to a third terminal associated with a second polarity, a dielectric disposed between the first conductive plane and the second conductive plane, a third conductive plane electrically coupled to the second terminal and not electrically coupled to the first terminal, and a second dielectric disposed between the second conductive plane and the third conductive plane. A first capacitance is present between the first terminal and the third terminal, a second capacitance is present between the second terminal and the third terminal, and the first capacitance and the second capacitance may be substantially dissimilar.

Abstract: There is provided a method of manufacturing a semiconductor device in which interconnect capacitance is restrained. The semiconductor device 200 comprises a semiconductor substrate; a second interconnect insulating film 216 constituted of a ladder-type hydrogen siloxane formed on the semiconductor substrate; a second protection film 217 provided on the second interconnect insulating film 216; and an upper interconnect 270 formed in the second interconnect insulating film 216 and the second protection film 217. The second interconnect insulating film 216 is constituted of for example an L-Ox™ (trademark) film, and the second protection film 217 is constituted of for example a silicon oxide film.

Abstract: The semiconductor device comprises on a semiconductor substrate an insulating structure formed of a plurality of insulating films; an interconnection structure buried in the insulating structure and formed of a plurality of conducting layers; and a plurality of dummy patterns formed of the same conducting layer as the conducting layers forming the interconnection structure and buried in a surface side of the respective insulating films, and the dummy patterns near the interconnection structure are connected with each other through via portions. Thus, the insulating structure near the interconnection structure are reinforced, and the generation of cracks and peelings in the interfaces between the insulating films or in the inter-layer insulating films due to mechanical stresses or thermal stresses can be prevented.

Abstract: The present invention relates to a thin film transistor substrate and a metal wiring method thereof, more particularly to a thin film transistor substrate comprising self-assembled monolayers between the substrate and the metal wiring, and a metal wiring method thereof. Since a thin film transistor substrate of the present invention comprises three-dimensionally cross-linked self-assembled monolayers between the Si surface and the metal wiring, it has good adhesion ability and anti-diffusion ability.

Abstract: A circuit substrate comprises a glass substrate 16, through-holes 18 formed through the glass substrate 16 and via electrodes 20 buried in the through-holes 18. An opening width of the through-holes 18 is minimum inside the glass substrate and is increased toward both surfaces of the glass substrate 16. Accordingly, the detachment of the via electrodes 20 can be prevented without increasing the surface roughness of the inside walls of the through holes, and stresses generated in the core substrate can be mitigated.

Abstract: A semiconductor package and method for fabricating the same is disclosed. In one embodiment, the semiconductor package includes a circuit board, at least two semiconductor chips, electric connection means, an encapsulant, and a plurality of conductive balls. The circuit board has a resin layer and a circuit pattern. The resin layer is provided with an opening at its center portion. The circuit pattern is formed on at least one of upper and lower surfaces of the resin layer and includes one or more bond fingers and ball lands exposed to the outside. The semiconductor chips have a plurality of input/output pads on an active surface thereof. The semiconductor chips are stacked at a position of the opening of the circuit board, with at least one of the chips being within the opening. Alternatively, both chips are in the opening. The electric connection means connects the input/output pads of the semiconductor chips to the bond fingers of the circuit board.

Abstract: A stud bump structure for electrical interconnection between a pair of members includes a base portion, and a stem portion. The base portion is affixed to a pad or trace in one of the pair of members to be interconnected (such as an integrated circuit chip), and the stem end is configured to contact a metal pad on the other member (such as a printed circuit board) to complete the interconnect. According to the invention, the stem end is truncated to form a transverse plane, and the stem is more compliant than the base. Also, a method for forming a stud bump on a contact surface, includes forming a bump base portion on the surface, drawing out a generally conical tail from a top of the base, and truncating the tail to form a stem portion having a planar transverse top surface and having a length from the top of the base portion to the top surface. In some embodiments the tail portion, at least, of the stud bump is formed using a wire bonding tool.

Abstract: A semiconductor device having a semiconductor substrate and a bonding pad portion formed on the semiconductor substrate, the bonding pad portion having: an insulating film formed on the semiconductor substrate and a first-level conductive pad layer of a large island shape formed on the insulating film; first-level to (n?1)-level (n is an integer of 3 or larger) interlayer insulating films formed on and over the insulating film; second-level to n-level conductive pad layers formed on the interlayer insulating films in areas generally corresponding to an area where the first conductive pad layer was formed; a plurality of small diameter first through holes from the first-level to (n?1) level formed through the first-level to (n?1) level interlayer insulating films in areas generally corresponding to an area where the first conductive pad layer; a plurality of first contact plugs filled in the small diameter first through holes from the first-level to (n?1)-level, the first contact plugs at each level being cond

Abstract: A semiconductor device which can meet the requirement for a further increase in pins, which multi-functionalization and faster operation would entail is to be provided. Bonding pads and bonding pads are arranged in a zigzag pattern in a direction along an outer circumference of a main surface of a chip. To focus on power supply-line bonding pads among all the bonding pads, an odd number of bonding pads are to be arranged in a direction of the outer circumference of the main surface between adjoining bonding pads. A greater width is secured for the power supply-line bonding pads than for other bonding pads, and a diameter of wires to be connected to the power supply-line bonding pads is set greater than that of other wires.

Abstract: A mark-shaped pad. A bonding pad structure with at least one mark-shaped bonding pad comprises: a bottom metal layer disposed over the surface of a rectangular semiconductor substrate to connect the circuit electrically, an inter-metal dielectric layer disposed over the bottom metal layer, metal plugs formed in the inter-metal dielectric layer to connect with the bottom metal layer, a top metal layer disposed over the inter-metal dielectric layer connecting with the metal plugs, and a passivation layer disposed over the top metal layer with openings to expose the top metal layer portions as bonding pads, wherein at least one bonding pad is mark-shaped, e.g. “”, “”, “” or “”, to indicate the orientation of the bonding pads on the rectangular semiconductor substrate.

Abstract: A vehicle-mounted generator is powered by relative wind produced by the combination of ambient wind and motion of the vehicle, or by movement of water when mounted on the hull of a water-borne vehicle. A rigid cylindrical housing forms an enclosed interior chamber. Wind asymmetrically enters the chamber through an inlet located on one side of a central longitudinal drive shaft, and exits through an outlet located at the top of the housing. A spiraling parabolic deck forms a floor of the interior chamber, and spirals around the central longitudinal shaft from the bottom of the housing to the outlet at the top. A turbine mounted on the drive shaft within the outlet converts energy of the exiting wind to mechanical energy. An electrical generator converts the mechanical energy into electrical energy for recharging a battery or powering an electric motor.

Abstract: An electrical output power generation system is provided. A gas turbine engine rotor spool with at least one alternator rotor and steam turbine rotor are integrated and within a engine body having a combustor or external heat source having fluid communication with the bladed compressor rotor and a gas turbine bladed rotor of the said rotor spool. The alternator rotor has permanent magnets retained and positioned in close proximity and co-axial to the electrical stator having iron laminat and electrical wires. Relative rotational motion between the electrical stator and alternator rotor cause magnetic flux and subsequent electricity to be generated. The steam energy to drive the said rotor spool integrated steam turbine rotor can be from the gas turbine engine exhaust waste heat and or thru external heat energy sources.

Abstract: A programmable power system may be used to control the supply of power from a battery to protect the battery from accidental discharge and excessive wear. A programmable power control unit may be connected between a battery and one or more battery operated devices. Typically, the battery is installed in a vehicle (e.g., a motor vehicle, an airplane, or a watercraft) although the unit may be used with any battery powered system. The programmable power control unit may be used to control the supply of power from the battery to one or more auxiliary devices, such as, for example, a two-way CB and ham radio, an AM/FM radio, a music player, a PDA, a TV, a DVD player, a cellular phone, a radar device, a GPS device, a data terminal, a display, and a computer. The programmable power control unit automatically turns the devices on in response to a predetermined battery operating condition, and turns the devices off after a predetermined time period in response a non operating condition.

Abstract: Disclosed is a magnetic floating device in which a movable magnet is sandwiched by fixed magnets in the manner that the same magnetic poles are opposed to each other, such that the movable magnet and the fixed magnets are held relatively movably in a floating direction and an intersecting direction that intersects with a polarization direction of the fixed magnets. The second magnet is placed within a range of extreme value position of a distribution of the magnetic flux density, with respect to the intersecting direction, as produced between the fixed magnets by the fixed magnets, at an opposing surface of the second magnet, being opposed to the fixed magnets. This arrangement assures a large force in the floating direction while making the force in the lateral shift direction weak. Hence, energy consumption of a lateral-direction control mechanism can be reduced significantly.

Abstract: A monolithic integrated circuit arrangement containing a substrate, a functional unit formed in and/or on the substrate, and an energy supply unit, which is formed in and/or on the substrate and is coupled to the functional unit and has an inductance and a permanent magnet. The inductance and the permanent magnet are arranged such that, under a vibration on the circuit arrangement, the permanent magnet is moved relative to the inductance such that an electrical induced voltage for supplying the functional unit with electrical energy is induced by the inductance.

Abstract: A step motor includes a rotor having four magnetic poles, a first magnetic pole magnetically excited by a first coil, a second magnetic pole magnetically excited by a second coil, and a third magnetic pole magnetically excited by the first coil and the second coil. A gap D between the third magnetic pole and the rotor is larger than a gap d between the first magnetic pole and the rotor and the gap d between the second magnetic pole and the rotor, so that a magnetic attraction is generated between a pole of the rotor and the first magnetic pole and between another pole of the rotor and the second magnetic pole. With this step motor applied to a shutter driving mechanism of a camera, it is possible to surely retain the shutter state even when the current does not flow.

Abstract: An automotive alternator includes a rear frame having a rear end wall and a cover member covering a brush device. The cover member is connected to the rear end wall of the rear frame, and a vibration-absorbing member made of a rubber material is disposed between the rear end wall and the cover member. The vibration-absorbing member has a cylindrical portion disposed between a center opening of the rear end wall and an extending portion of the cover member and a rear disc portion disposed between the rear end wall and a front surface of the cover member. The cylindrical portion is compressed in the radial direction while the rear disc portion is compressed in the axial direction, thereby alleviating vibration of the brush device in both the radial and the axial directions.

Abstract: A drive system includes a plurality of electric power devices, a drive case having a plurality of case segments which are connected to each other, each of the electric power devices being contained in one of the case segments, and a plurality of inverters, one for each of the electric power devices. The inverters are collectively attached to one of the case segments, and a flow path of a coolant for cooling the inverters is positioned between the case segment to which the inverters are attached and the inverters. Accordingly, a cooling unit which performs heat insulation and cooling between the drive system and the inverters is positioned only on the outer surface of one of the case segments and does not extend across the connection interfaces between the case segments. Therefore, the risk of leakage of the coolant into the drive case can be substantially eliminated.

Abstract: The motor cooling system of the present invention is a system for cooling a three-phase alternating current motor mounted on a vehicle as a traction motor where oil is introduced as cooling oil from driving-related equipment of the vehicle, wherein the traction motor is equipped with a stator having a neutral point, wherein the vehicle is in a high-load driving state when a larger load is applied to the traction motor than a predetermined amount, the neutral point contacts the cooling oil with a larger contact amount than when the vehicle is not in the high-load driving state.

Abstract: The present invention relates to an electric motor having a high degree of protection against the ingress of foreign particles and moisture, in particular an electronically commutated external rotor DC motor, having a stator (1), having a rotor (2) and having an electronics housing (6) which extends transversely with respect to the motor shaft (3) and accommodates in its interior (4) a printed circuit board (5) having open-loop and closed-loop control electronics and commutation electronics. In this case, connection openings (6c) are located in a base (6b) of the electronics housing (6), connection elements (7), which connect the stator (1) and the printed circuit board (5) to one another, passing through the connection openings (6c), and a seal (8, 8a, 8c, 8e, 11, 12, 18, 24) seals at least the connection openings (6c) in the base (6b) of the electronics housing (6) through which the connection elements (7) pass.

Abstract: A motor assembly comprises a plurality of redundant bearings, a plurality of coaxial support elements, with at least one of the support elements rotatable about an axis of rotation, and an armature rotatably guided by the plurality of support elements to rotate about the axis of rotation. The bearings provide redundancy to continue armature rotation in the event one bearing fails.

Abstract: An arrangement with an electric motor facilitates mounting of the motor, particularly of a miniature or subminiature motor. The motor (20) has a stator (56), a rotor (24), and a support flange (36) coupled to the motor. A motor mount (22) is formed with an opening (94) for engagement with the support flange (36). The opening has, on its rim, a motor-side shoulder (96) that has a substantially frustoconical shape and faces axially toward the motor (20) after mounting. The support flange (36) is shaped for guidance of a snap-lock element (82) that extends along at least a portion of the circumference of the support flange (36) and is resiliently deflectable radially inward, by means of an inwardly directed force. The snap-lock element (82) is so configured that it snap-locks outward against the motor-side shoulder (96) of the opening (94) when the motor is mounted.

Abstract: A motor includes a circumferential wall part of a case provided with an opening part on one end side in an axial direction and at least a magnet fixed to the inner peripheral face of the circumferential wall part. At least a part of the outer peripheral face of the magnet is fixed to the inner peripheral face of the circumferential wall part with a first adhesive, and further, the outer peripheral edge part of a first end face of the magnet that is located on a side of the opening part is fixed to the inner peripheral face of the circumferential wall part with a second adhesive.

Abstract: An insulator covering the teeth (31) of an armature (3) in an inner-rotor motor is composed of a tooth insulator (321), outer-side insulator (322), upper-end insulator (323), and lower-end insulator (324). The tooth insulator (321) is composed of substantially annular top and bottom members that are assembled from above and below to the teeth (31).

Abstract: A stator assembly includes a plurality of stator coil assemblies and a stator coil support structure constructed of a non-magnetic, thermally-conductive material. The stator coil support structure includes an axial passage for receiving a rotor assembly and a plurality of channels positioned radially about the axial passage. Each channel is configured to receive one or more of the stator coil assemblies.

Abstract: An electric motor, power tool using the electric motor, and method of making the electric motor includes making a stator that includes pole portions that have axial lengths less than an axial length of a back iron portion. Alternatively, or in addition, the pole portions have axially opposed ends that decrease in width. Alternatively, or in addition, the pole portions have dovetail features that are received in corresponding recesses of the back iron portion.

Abstract: An aspect of the invention relates to a machine comprising a rotor mounted so it can rotate about a rotational axis, and a superconductive winding located in a winding support. Further, connection devices are provided to retain the winding support inside a rotor external housing. To compensate changes caused by the expansion of the winding support, a connection device should have at least one connection element that extends axially with one end of the element connected to the winding support in a fixed manner, and the opposite free end connected to a centering retaining element of the rotor eternal housing in a non-positive radial fit, so it can be displaced axially.

Abstract: The present invention provides a dynamoelectric rotor enabling electromagnetic noise to be reduced by linking a facing tip end portion and root end portion of adjacent claw-shaped magnetic poles by a linking member and placing a field winding in contact with an inner peripheral surface of the claw-shaped magnetic poles in an electrically-insulated state so as to suppress vibration of the claw-shaped magnetic poles effectively. In the present invention, a tip end portion and a root end portion of adjacent claw-shaped magnetic poles are linked by a linking structure, and a field winding is wound onto a boss portion so as to have a larger diameter than a root inside diameter of the claw-shaped magnetic poles and is placed in contact with an inner peripheral surface of at least one of the claw-shaped magnetic poles with an insulating member interposed.

Abstract: A power system includes a member with two or more sections and at least one pair of electrodes. Each of the two or more sections has a stored static charge. Each of the pair of electrodes is spaced from and on substantially opposing sides of the member from the other electrode and is at least partially in alignment with the other electode. At least one of the member and the at least one pair of electrodes is moveable with respect to the other. When at least one of the sections is at least partially between the pair of electrodes, the at least one of the sections has the stored static electric charge closer to one of the pair of electrodes. When at least one of the other sections is at least partially between the pair of electrodes, the other section has the stored static electric charge closer to the other one of the pair of electrodes.

Abstract: A plurality of stator-side electrodes disposed in a stator is vertically disposed so as to face a plurality of mover-side electrodes disposed on a mover in a protruding manner. Wide areas facing each other can be secured between the electrodes on the stator and the mover-side electrodes even at a narrow space in three dimensions. Great electrostatic attraction force can be generated between both electrodes, and the mover 30 can be driven with greater driving force.

Abstract: A surface acoustic wave device is provided with an input signal electrode 15 and an output signal electrode 16 to and from which an electric signal is inputted or outputted; a first surface acoustic wave resonator 18 including an input terminal 18a connected to the input signal electrode 15 and having a plurality of comb electrodes, an output terminal 18b connected to the output signal electrode 16 and having a plurality of comb electrodes, a common terminal 18c which has a plurality of comb electrodes and which forms interdigital transducers A and B together with the comb electrodes of the input terminal 18a and the comb electrodes of the output terminal 18b; and a second surface acoustic wave resonator 19 connected between the common terminal 18c of the first surface acoustic wave resonator 18 and a pair of grounding terminals 17.

Abstract: Disclosed is an oscillator that relies on redundancy of similar resonators integrated on chip in order to fulfill the requirement of one single quartz resonator. The immediate benefit of that approach compared to quartz technology is the monolithic integration of the reference signal function, implying smaller devices as well as cost and power savings.