Abstract: A mask in which a plurality of mask chips are connected to one another via a supporting member, includes: a plurality of first opening sections that are provided in the plurality of mask chips and that correspond to a pattern to be formed; a cutout section provided at at least one of side faces opposing to each other of the mask chips adjacent to each other; a gap section provided at a connected section connecting the mask chips adjacent to each other, the gap section being composed of the cutout section and including a second opening section corresponding to a pattern to be formed; and a block section that is provided at at least one of the mask chips adjacent to each other and that covers the gap section other than the second opening section.

Abstract: Provided are a Schottky barrier tunnel single electron transistor and a method of manufacturing the same that use a Schottky barrier formed between metal and semiconductor by replacing a source and a drain with silicide as a reactant of silicon and metal, instead of a conventional method of manufacturing a single electron transistor (SET) that includes source and drain regions by implanting dopants such that an artificial quantum dot is formed in a channel region. As a result, it does not require a conventional PADOX process to form a quantum dot for a single electron transistor (SET), height and width of a tunneling barrier can be artificially adjusted by using silicide materials that have various Schottky junction barriers, and it is possible to improve current driving capability of the single electron transistor (SET).

Abstract: A wiring board which can realize a small and thin passive component such as solid condenser, resistor, coil, transistor or so on is provided. A wiring board which forms an electronic component by mounting a passive element, comprising an insulating board provided with an opening having predetermined pattern, a wiring formed with predetermined pattern on said insulating board, and an external terminal filled to said opening, connected with said wiring by said filling, and exposed to a bottom of said insulating board where said wiring is formed.

Abstract: A microelectronic device including, in one embodiment, a plurality of active devices located at least partially in a substrate, at least one dielectric layer located over the plurality of active devices, and an inductor located over the dielectric layer. At least one of the plurality of active devices is located within a columnar region having a cross-sectional shape substantially conforming to a perimeter of the inductor. The at least one of the plurality of active devices may be biased based on a desired Q factor of the inductor or and/or an operating frequency of the microelectronic device.

Abstract: Improvements in the level of integration of a core buck and/or boost DC-DC voltage regulator sub-circuit lead to a lower manufacturing cost structure, an improved performance from lessened intrinsic parasitic resistance, a smaller die size and, thus, higher wafer yield. Further, by integrating certain components on-chip, the cost and complexity of the conventional hybrid circuit implementation is improved.

Abstract: A capacitor includes a first electrode, an insulating film and a second electrode. The insulating film includes n layers of barrier layers each consisting of a material having a bandgap larger than a first bandgap and having a relative permittivity smaller than a first relative permittivity, and (n?1) layers of well layers each consisting of a material having a bandgap smaller than the first bandgap and having a relative permittivity larger than the first relative permittivity. The barrier layers and the well layers are stacked by turns. Discrete energy levels are formed in each of the well layers by a quantum effect. Thicknesses of the n layers of the barrier layers are not smaller than 2.5 angstroms. A thickness dm (angstrom) and a relative permittivity ?m of an m-th barrier layer satisfying the condition: 2.5 >(d1/?1+d2/?2+. . . +dn/?n).

Abstract: A bipolar transistor with a substrate having a collector region and a base structure provided thereon. An emitter structure is formed over the base structure and an extrinsic base structure is formed over the base structure and over the collector region beside and spaced from the emitter structure. A dielectric layer is deposited over the substrate and connections are formed to the extrinsic base structure, the emitter structure and the collector region.

Abstract: Many integrated circuits include a type of transistor known as a bipolar junction transistor, which has an emitter contact formed of polysilicon. Unfortunately, polysilicon has a relatively high electrical resistance that poses an obstacle to improving switching speed and current gain of bipolar transistors. Current fabrication techniques involve high temperature procedures that melt desirable low-resistance substitutes, such as aluminum, during fabrication. Accordingly, one embodiment of the invention provides an emitter contact structure that includes a polysilicon-carbide layer and a low-resistance aluminum, gold, or silver member to reduce emitter resistance. Moreover, to overcome manufacturing difficulties, the inventors employ a metal-substitution technique, which entails formation of a polysilicon emitter, and then substitution or cross-diffusion of metal for the polysilicon.

Abstract: A semiconductor package mounted on a printed circuit board using improved-reliability solder joints is described. The semiconductor package includes a lead frame pad and lead frame lead attached to the solder joints, a semiconductor chip mounted on top of the lead frame pad, wires electrically connecting the semiconductor chip and the lead frame lead, an epoxy molding compound that exposes the lower portion surface of the lead frame pad and part of the lead frame lead, and protrusions fixed to the lower portion surface of the epoxy molding compound and positioned between the solder joints, with the protrusions supporting the semiconductor package when the epoxy molding compound is mounted on the printed circuit board.

Abstract: A semiconductor device having a leadframe comprised of a base metal (110, e.g., copper), a chip mount pad (103) and a plurality of lead segments (104). Each of the segments has a first end (104a) near the mount pad and a second end (104b) remote from the mount pad. The device further has a semiconductor chip (103) attached to the mount pad and electrical interconnections (107) between the chip and the first segment ends. Encapsulation material (120) covers the chip, the bonding wires and the first segment ends, yet leaves the second segment ends exposed. At least portions of the second segment ends have the base metal covered by a layer of solderable metal (130, e.g., nickel) and by an outermost layer of noble metal (140, e.g., stack of palladium and gold).

Abstract: A mounting structure includes a mounting substrate on which a plurality of mounting pads each constituting a portion of a conductive pattern extending in a Y direction are arranged in an X direction, the X direction and the Y direction being two directions orthogonal to each other, and a member that is mounted on the mounting substrate so as to be electrically connected to the mounting pads. In the mounting structure, a first conductive layer, an insulating layer, a second conductive layer, and a third conductive layer are formed on the mounting substrate in this order from a lower side to an upper side.

Abstract: A electronic circuit device is provided with an electronic component provided with an electrode, a substrate having an upper surface on which the electronic component is mounted, external electrode that is formed near the electronic component mounted on the upper surface of the substrate and that is connected to the electrode, an insulating protrusion that is provided across the upper surface of the external electrode, and a sealing resin that seals the electronic component without covering the external electrode. The upper surface of the external electrode is partitioned by the protrusion into a first area that is located on the sealing resin side and a second area that is located the side opposite to the first area. The adherence of fine particles such as flakes of the sealing resin to the external electrode is suppressed, so that a stable electric connection between the external electrode and the electric equipment can be maintained.

Abstract: A multi-chips stacked package at least comprises a substrate, a lower chip, an upper chip, an adhesive layer, a supporting body and an encapsulation. The lower chip is disposed on the substrate and the upper chip is attached to the lower chip via the adhesive layer. In addition, the lower chip and the upper chip are electrically connected to the substrate via first electrically conductive wires and second electrically conductive wires respectively. Furthermore, the supporting body is disposed on the lower chip and at the periphery of the upper surface of the lower chip, and covered by the upper chip. The top of the supporting body is apart from the back surface of the upper chip with a distance. Accordingly, when the second electrically conductive wires are bonded the upper chip to the substrate with a larger bonding force to cause the upper chip to be tilted more, the supporting body will support the upper chip and prevent the upper chip from contacting the first electrically conductive wires.

Abstract: One embodiment of the present invention provides an apparatus that reduces voltage noise for an integrated circuit (IC) device. This apparatus includes an interposer, which is configured to be sandwiched between the IC device and a circuit board. This interposer has a bottom surface, which is configured to receive electrical connections for power, ground and other signals from the circuit board, and a top surface, which is configured to provide electrical connections for power, ground and the other signals to the IC device. A plurality of bypass capacitors are integrated into the interposer and are coupled between the power and ground connections for the IC device, so that the plurality of bypass capacitors reduce voltage noise between the power and ground connections for the IC device.

Abstract: A semiconductor device includes an interface chip and a plurality of DRAM chips consecutively layered on the interface chip. A plurality of source electrodes, a plurality of ground electrodes, and a plurality of signal electrodes penetrate DRAM chips and interconnect the DRAM chips to the interface chip, which is connected to an external circuit. Each source electrode, a corresponding signal electrode and a corresponding ground electrode are arranged adjacent to one another in this order to reduce electromagnetic noise during operation of the DRAM chip.

Abstract: A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a metal pillar, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The chip and the metal pillar are embedded in the encapsulant, the routing line extends laterally beyond the metal pillar towards the chip, and the metal pillar is welded to the routing line.

Abstract: What is invented is a semiconductor device (10) comprising a pellet (12) having a ground electrode (18), an outside signal terminal (15) connected to the pellet (12), so as to receive signal which is likely to include noise. Therein, said outside signal terminal (15) is surrounded with a ground terminal (17) connected to said ground electrode (18) in at least a half periphery.

Abstract: The present invention describes a rewiring plate for components with connection grids of between approx. 100 nm and 10 ?m, which rewiring plate includes a base body and passages with carbon nanotubes, the lower end of the passages opening out into contact connection surfaces, and the carbon nanotubes forming an electrically conductive connection from the contact connection surfaces to the front surface of the base body.

Abstract: A semiconductor device comprises a substrate, an external terminal provided on the substrate, an internal wiring pattern electrically connected to the external terminal, a semiconductor chip mounted on the substrate and electrically connected to the internal wiring pattern, and an antenna pattern. The antenna pattern provided at each of adjacent two corner portions of the substrate and is grounded.

Abstract: A method and apparatus for making a package having improved heat conduction characteristics and high frequency response. A relatively thick package substrate, such as copper, has a wiring layer bonded to one face, leaving the opposite face exposed, for example, to be a surface for connection to a heat sink. One ore more chips are bonded to the wiring layer, and an array of connectors, such as solder balls are provided around the periphery of the chip(s) for connection to a printed circuit board. In some embodiments, the printed circuit board has a hole that the chip(s) extend into to allow smaller external-connection solder balls. In some embodiments, a second heat sink is connected to the back of the chip through the PCB hole.

Abstract: A packaged semiconductor chip includes features such as a chip carrier having a large thermal conductor which can be solder-bonded to a circuit panel so as to provide enhanced thermal conductivity to the circuit panel and electromagnetic shielding and a conductive enclosure which partially or completely surrounds the packaged chip to provide additional heat dissipation and shielding. The packaged unit may include both an active semiconductor chip and a passive element, desirably in the form of a chip, which includes resistors and capacitors. Inductors may be provided in whole or in part on the chip carrier.

Abstract: A holding fixture that holds a component and mounts the component on an electronic circuit board includes a holding member that holds the component at a side of a first surface of the electronic circuit board, a first fixing member that includes a first base that is engageable with the holding member, and an elastic member that is pivotally attached to the base, sandwiches the electronic circuit board at a side of a second surface of the electronic circuit board, and elastically supports the holding member at the side of the first surface, the second surface opposing to the first surface, and a second fixing member that includes a second base that is engageable with the holding member, and a projection member that projects from the second surface of the electronic circuit board and is engageable with the elastic member.

Abstract: A semiconductor module structure and a method of forming the semiconductor module structure are disclosed. The structure incorporates a die mounted on a substrate and covered by a lid. A thermal compound is disposed within a thermal gap between the die and the lid. A barrier around the periphery of the die extends between the lid and the substrate, contains the thermal compound, and flexes in response to expansion and contraction of both the substrate and the lid during cycling of the semiconductor module. More particularly, either the barrier is formed of a flexible material or has a flexible connection to the substrate and/or to the lid. The barrier effectively contains the thermal compound between the die and the lid and, thereby, provides acceptable and controlled coverage of the thermal compound over the die for heat removal.

Abstract: A technique for manufacturing an electronic assembly uses a mold that has a first mold portion and a second mold portion. The first mold portion includes a plurality of spaced mold pins extending from an inner surface. A cavity of the first and second mold portions provides a mold cavity, when joined. A backplate is also provided that includes a plurality of support pedestals and an integrated heatsink extending from a first side of the backplate. A substrate includes a first side of an integrated circuit (IC) die mounted to a first side of the substrate. The backplate and the substrate are placed within the cavity of the second mold portion and the support pedestals are in contact with the first side of the substrate. The first and second mold portions are joined and the mold pins contact a second surface of the substrate during an overmolding process.

Abstract: The present invention relates to a semiconductor device in which electrodes formed on a semiconductor chip and electrodes formed on a wiring board are electrically connected via projecting elastic electrodes, and further relates to a mounting method of reducing a pressure applied to electrodes formed on a substrate or underlying wirings when a semiconductor chip and a wiring board are bonded.

Abstract: In a shadow mask vapor deposition system, a first conductor is vapor deposited on a substrate and an insulator is vapor deposited on the first conductor. A second conductor is then vapor deposited on at least the insulator. The insulator layer is plasma etched either before or after the vapor deposition of the second conductor to define in the insulator layer a via hole through which at least a portion of the first conductor is exposed. An electrical connection is established between the first and second conductors by way of the via hole.

Abstract: A method for forming an interconnect structure with nanocolumnar intermetal dielectric is described involving the construction of an interconnect structure using a solid dielectric, and introducing a regular array of vertically aligned nanoscale pores through stencil formation and etching to form a hole array and subsequently pinching off the tops of the hole array with a cap dielectric. Variations of the method and means to construct a multilevel nanocolumnar interconnect structure are also described.

Abstract: A wiring layer is provided on a semiconductor substrate and extends in a predetermined direction. An external connection electrode terminal is provided on the wiring layer through a plurality of column-shaped conductors. The column-shaped conductors are located under the external connection electrode terminal. A density of arrangement of the column-shaped conductors is varied according to a direction of extension of the wiring layer.

Abstract: There is disclosed a semiconductor device comprising at least one first insulating film provided above a substrate, being formed with at least one first recess having a first width, and being formed with at least one second recess having a second width which is 1/x (x: positive numbers larger than 1) a size of the first width and having a same depth as the first recess, a second insulating film provided at both sides of the first recess and at a lower part of the second recess, and a conductor provided inside of the second insulating films provided at the both sides of the first recess with extending from an opening of the first recess to a bottom surface thereof, and provided with extending from an opening of the second recess to an upper surface of the second insulating film provided at the lower part of the second recess.

Abstract: In a capacitive semiconductor sensor, a sensor chip and a circuit chip are contained in a package. First bump members are mounted on second electrodes disposed on a second surface of the circuit chip, respectively. The sensor chip is mounted at its first surface on the second surface of the circuit chip so that first electrodes disposed on the first surface of the sensor chip are electrically mechanically connected to the second electrodes through the first bump members, respectively. Second bump members are mounted on third electrodes disposed on the second surface of the circuit chip, respectively. The third electrodes are electrically mechanically connected to lead electrodes disposed to the package through the second bump members, respectively.

Abstract: An electronic device can include a top side with circuit structures. The circuit structures form the bottom region of a cavity. Each cavity can be surrounded by a cavity frame made of plastic and can have a cavity cover made of semiconductor material.

Abstract: A semiconductor package with an encapsulated passive component mainly includes at least a substrate having a surface, a passive component and a molding compound. A plurality of SMD pads (Solder Mask Defined pads) and a solder mask are formed on the surface of the substrate. Each SMD pad has an exposed sidewall portion exposed out of the solder mask. A blocking bar is formed between the exposed sidewall portions of the SMD pads. There is at least a flowing channel formed between the blocking bar and the exposed sidewall portions. The passive component is mounted on the surface of the substrate and connected to the SMD pads, the flowing channel is located under the passive component. It is advantageous to fill the molding compound into the flowing channel.

Abstract: A columnar bump formed of copper etc. is formed on a wiring film of a semiconductor chip through an interconnected film and an adhesive film in a wafer unit by electrolytic plating in which package formation is possible. An oxidation prevention film is formed of such as gold on an upper surface or a part of the upper surface and side surface. A wet prevention film of such as an oxide film is formed on the columnar bump side as needed. If this bump is soldered to the pad on a packaging substrate, solder gets wet in the whole region of the columnar bump upper surface and only a part of the side surface. Stabilized and reliable junction form can be thus formed. Moreover, since the columnar bump does not fuse, the distance between a semiconductor board and a packaging board is not be narrowed by solder.

Abstract: A semiconductor device having a molded sealing resin for sealing a semiconductor chip on a circuit board thereof reduces resin burrs resulting from the leakage of the sealing resin, and also restrains the occurrence of disconnection caused by a wiring layer being crushed. In the semiconductor device, the sealing resin for sealing the semiconductor chip is molded on the circuit board that has a plurality of wiring patterns and a solder resist for insulatively covering the wiring patterns formed on the front surface thereof, the interval of the wiring patterns is set to range from 50% to 200% of its adjacent interval in a molding line area of the sealing resin.

Abstract: A semiconductor wafer includes a plurality of active circuit die areas, each of which being bordered by a dicing line region through which the plurality of active circuit die areas are separated from each other by mechanical wafer dicing. Each of the plurality of active circuit die areas has four sides. An overcoat covers both the active circuit die areas and the dicing line region. An inter-layer dielectric layer is disposed underneath the overcoat. A reinforcement structure includes a plurality of holes formed within the dicing line region. The plurality of holes are formed by etching through the overcoat into the inter-layer dielectric layer and are disposed along the four sides of each active circuit die area. A die seal ring is disposed in between the active circuit chip area and the reinforcement structure.

Abstract: In the control device for motor generator in which an engine is started and power generation is performed while a vehicle is running, a field current limit value Ifm in electric driving to start the engine is larger than a field current limit value Ifg in power generation. In the power generation, an inverter mode in a low rotation speed zone for boosting and an alternator mode in a high rotation speed zone for rectifying and outputting a generated voltage without boosting are provided. A field current limit value Ifgi in the inverter-mode power generation and a field current limit value Ifga in the alternator-mode power generation are set differently from each other, and the larger value is set as the value Ifg.

Abstract: A method is disclosed for estimating engine power output for an engine in a hybrid electric vehicle powertrain that includes an electric motor and an electric generator. Selected powertrain variables, including electric motor torque and electric generator torque, are used in determining desired vehicle traction wheel torque and an estimated engine power. A calibrated delay in calculating estimated engine power following a time sampling of the values for motor torque and generator torque avoid inertial effects.

Abstract: A wind turbine generator system can regulate the rotational velocity of the wind turbine within an operation range even when the wind velocity suddenly changes and can perform continuous operation of the wind turbine. The wind turbine generator system includes a generator connected to the shaft of the wind turbine and a converter connected to the generator. When the rotational velocity of the wind turbine is within a predetermined range, power outputted from the generator is controlled so as to follow the instruction concerning the generator output given from the wind turbine to the converter. When the rotational velocity of the wind turbine is out of the predetermined range, the power outputted from the generator is controlled without following the instruction concerning generator output given from the wind turbine to the converter.

Abstract: A supply line structure for supplying energy to the electrical components of an automotive vehicle and for transmitting information between at least some of the electrical components, the supply lines being disposed, in particular in a star structure having at least one star point; in order to be able to transmit high supply currents, the supply line structure is configured in such a way that at least a part of the supply lines includes a coaxial arrangement of a plurality of outer litz wires about a central litz wire.

Abstract: An airbag device includes a squib, an ignition circuit, and a noise protection circuit. The noise protection circuit includes two zener diodes whose cathodes are facing each other and connected with each other. Further, the noise protection circuit is connected in parallel with the ignition element to thereby protect the ignition circuit from noise. This decreases the number of components in the noise protection circuit to thereby achieve the compact and low-cost airbag device.

Abstract: An automotive power control center that includes a housing, a first conductor coupled to the housing, a second conductor, a control circuit, which is coupled to the housing, and a semiconductor. The second conductor is coupled to the housing and insulated from the first conductor. The solid-state device includes a first terminal, which is electrically coupled to the first conductor, a second terminal, which is electrically coupled to the second conductor, and a third terminal, which is electrically coupled to the control circuit. The solid-state device is configured to selectively control transmission of electricity between the first and second terminals in response to a signal transmitted from the control circuit through the third terminal. In some embodiments the solid-state device may be removably coupled to the housing. In other embodiments, the solid-state device may be fixedly coupled to the various conductors and terminals.

Abstract: An automotive power control center that includes a housing, a first conductor coupled to the housing, a second conductor, a control circuit, which is coupled to the housing, and a semiconductor. The second conductor is coupled to the housing and insulated from the first conductor. The solid-state device includes a first terminal, which is electrically coupled to the first conductor, a second terminal, which is electrically coupled to the second conductor, and a third terminal, which is electrically coupled to the control circuit. The solid-state device is configured to selectively control transmission of electricity between the first and second terminals in response to a signal transmitted from the control circuit through the third terminal. In some embodiments the solid-state device may be removably coupled to the housing. In other embodiments, the solid-state device may be fixedly coupled to the various conductors and terminals.

Abstract: Disclosed are a control circuit and control method for a comparator-controlled type DC-DC converter that can prevent the generation of audible noise due to the difference between relevant switching frequencies and prevent the increase in the input power source ripple voltage. A phase comparator FC outputs a compared-result signal CONT in correspondence with the phase difference between an output signal FP2 and a delay signal FR1. A delay circuit DLY2 performs a feedback control for adjusting the amount of retardation time in correspondence with the compared-result signal CONT. And, the delay circuit DLY2 outputs a delay signal FR2 after the passage of a prescribed amount of retardation time from the time when the falling edge of an output signal SQB2 has been input.

Abstract: A stopper member is included in a linear actuator comprising a stator assembly, a rotor assembly, an output shaft, and a stopper pin which is fixedly disposed at a frontward portion of the output shaft, and which is adapted to axially control the mode and amount of movement of the output shaft initiated by rotation of the rotor assembly. The stopper member is disposed fixedly with respect to the stator assembly and stops the axial movement of the output shaft without making it happen that the stopper pin which moves together with the output shaft touches the rotor assembly.

Abstract: A permanent magnet type generator includes a rotor having 4n (n is a positive integer) permanent magnet poles disposed in a circumferential direction of the rotor to have circumferential gap between adjoining poles and a stator that has 3n teeth and coils wound around the teeth. The stator core includes a pair of core end plates and a laminate core disposed between the core end plates. Each core end plate has a circumferential width that relates to the gap distance at portions opposite the permanent magnet poles.

Abstract: A motor resolver assembly includes a resolver stator and a resolver rotor positioned radially inward of and rotatable with respect to the resolver stator. First and second relatively rotatable shield components generally surround the resolver stator and rotor to shield them from electromagnetic energy from a radially outward motor rotor and motor stator. A method of measuring speed and position of the motor rotor relative to the motor stator is also employed.

Abstract: A spindle motor is provided in which an end portion of a winding of a coil maintains insulation from a base and the end portion of the winding of the coil can be easily threaded through a hole of a printed circuit board when the end portion of the winding of the coil is drawn out. For this, the spindle motor includes a base fixed with a stator having a coil, an insulating sheet provided between the stator and the base, and a printed circuit board provided in the base on an outer side of the motor. Holes are formed in the base, insulating sheet and printed circuit board so as to communicate with each other, and an winding end portion of the coil is led out to the outside of the motor. The diameter C of the hole 19 in the printed circuit board and the diameter B of the hole 18 of the insulating sheet are smaller than the diameter A of the hole 17 of the base, and the diameter C of the hole 19 is larger than the diameter B of the hole 18.

Abstract: In axial magnetic bearing apparatus in which a rotary disc made of a magnetic material is fixedly attached to a rotating shaft, and electromagnets are disposed on opposite sides of the rotary disc so as to have suitable very small distances therefrom respectively, so as to bear the rotating shaft axially in a non-contact state, a deep groove for forming an air layer having large magneto-resistance is provided all over the outer circumference of the rotary disc. Thus, formation of a magnetic circuit not contributing to position control is relieved, and the weight of the disc is reduced so that the position control performance of the axial magnetic bearing and the natural frequency of a rotor are improved.

Abstract: A power generating system includes a torque converter system receiving a rotational motion having a first torque from a source and producing a rotational output having a second torque different from the first torque, a transfer system having a first portion coupled to the rotational output of the torque converter system and a second portion magnetically coupled to the first portion, and a generator system coupled to the transfer system to produce and electrical output.

Abstract: A phase winding of a stator winding comprises one or more pairs of interconnected partial coil, each partial coil formed of sequentially connected U-shaped segment pairs, each pair comprising a large segment and small segment. Two segment legs, of the large and small segment respectively of such a pair, constitute first and second conductor layers of a first stator slot and have their tip portions mutually connected. The remaining two segment legs respectively constitute fourth and third conductor layers of a second slot that is distant by one pole pitch, and have their respective tip portions mutually connected.