Patents Issued in July 29, 2008
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Patent number: 7405905Abstract: There is provided a perpendicular magnetic recording and reproducing system in which the overwrite erase ratio of a perpendicular magnetic head has been improved to prevent the deterioration of an overwrite property. In the perpendicular magnetic head, a third magnetic pole composed of a soft magnetic layer is formed on the leading side of a recording magnetic pole via a non-magnetic layer, thereby reducing magnetic interference from magnetization on a medium with the recording magnetic pole and preventing the deterioration of the overwrite property.Type: GrantFiled: September 8, 2006Date of Patent: July 29, 2008Assignee: Hitachi Global Storage Technologies Japan, Ltd.Inventors: Hisashi Kimura, Kazuhiro Nakamoto, Yoshiaki Kawato, Nobuo Yoshida
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Patent number: 7405906Abstract: A magnetoresistance effect element of the dual spin valve type using a current-perpendicular-to-the-plane (CPP) system where a sensing current flows perpendicular to the stacked faces of a plurality of conductive layers, the magnetoresistance effect element comprises a first unit which includes a free layer and a first pinning layer, a second unit which includes the free layer shared with the first unit and a second pinning layer, a first current control layer which is provided in the first unit and limits the flow quantity of the sensing current, and a second current control layer which is provided in the second unit and limits the flow quantity of the sensing current.Type: GrantFiled: September 9, 2004Date of Patent: July 29, 2008Assignee: Kabushiki Kaisha ToshibaInventors: Tomomi Funayama, Masayuki Takagishi, Katsuhiko Koui, Kohichi Tateyama
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Patent number: 7405907Abstract: A read head for reading magnetically stored data in adjacent tracks of a medium has at least two elongate bodies, each having at least one magnetoresistive part. The magnetoresistive parts have sensor portions defined along a length of the elongate bodies, by electrical connections to the magnetoresistive parts. A shield is provided at least on opposite transfer sides of the elongate bodies. The read head is used for calculating a position error signal by calculating a correlation between signals received from the respective sensor portions when the head is positioned over adjacent tracks on the medium, with one of the sensors positioned near a boundary between the tracks. The position error is calculated by determining the correlation between signals from the respective sensor portions.Type: GrantFiled: August 3, 2004Date of Patent: July 29, 2008Assignee: O-Mass ASInventor: Jørn Raastad
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Patent number: 7405908Abstract: In a CPP magnetic head a free magnetic layer and a magnetic biasing layer are disposed within a central layer stack. To pin the magnetization of the bias layer, an antiferromagnetic (AFM) layer is fabricated on the sides of the central stack. The AFM layer may be comprised of an electrically non-conductive AFM material such as NiO, or, where the AFM material is electrically conductive, such as PtMn or IrMn, a layer of electrical insulation is deposited to prevent the sense current from flowing through the outwardly disposed AFM layer. Portions of the bias layer are deposited upon the outwardly disposed AFM layer, such that the magnetization of the outwardly disposed portions of the bias layer are pinned by the AFM layer, which creates an effective pinning of the central portions of the bias layer. This then provides an effective biasing of the magnetization of the free magnetic layer.Type: GrantFiled: July 30, 2004Date of Patent: July 29, 2008Assignee: Hitachi Global Storage Technologies Netherlands, B.V.Inventor: Hardayal Singh Gill
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Patent number: 7405909Abstract: A current perpendicular to plane (CPP) magnetoresistive sensor having an in-stack bias structure that is pinned by an AFM layer located behind the back edge (stripe height) of the sensor stack. A magnetic coupling layer is exchange coupled to the in-stack bias structure and extends beyond the back edge of the sensor stack where it is pinned by the AFM layer. The magnetic coupling layer may be either directly exchange coupled with the AFM layer or exchange coupled with an intermediate magnetic layer that is itself exchange coupled with the AFM layer. The AFM layer is located entirely beyond the stripe height of the sensor stack and between top and bottom elevations as defined by the top and bottom of the sensor stack. In this way, the AFM can pin the biasing structure without consuming any gap budget.Type: GrantFiled: March 14, 2006Date of Patent: July 29, 2008Assignee: Hitachi Global Storage Technologies Netherlands B.V.Inventor: Hardayal Singh Gill
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Patent number: 7405910Abstract: A universal hybrid solid-state switchgear for power transmission or distribution systems incorporates a fast mechanical switch and solid-state power electronics switching circuits to provide circuit breaker and fault current limiting applications.Type: GrantFiled: November 30, 2006Date of Patent: July 29, 2008Assignee: Electric Power Research Institute, Inc.Inventors: Arindam Maitra, Mark McGranaghan, Jih-Sheng Lai, Tom Short, Frank Goodman
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Patent number: 7405911Abstract: A circuit arrangement with a voltage link converter includes a link capacitor and circuit branches arranged parallel thereto. The circuit branches each include circuit elements, connected in series. A short circuit thyristor is provided to protect against short circuit currents. A short circuit protection arrangement is provided for connection to the link circuit capacitor and the circuit branches. The above includes a parallel connection of the short circuit thyristors with opposed conducting pairs of protective diodes connected in series. The short circuit protection arrangement is connected parallel to the link circuit capacitor and each connection point between two circuit elements of a circuit branch which are connected in series, is connected to a connection point between two protection diodes of the short circuit protection arrangement which are connected in series.Type: GrantFiled: June 16, 2003Date of Patent: July 29, 2008Assignee: Siemens AktiengesellschaftInventor: Andreas Fuchs
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Patent number: 7405912Abstract: The present invention relates to an arc fault detection apparatus using a microcomputer, which divides current paths into a low current path and a high current path depending on the intensity of load current using a source voltage that is applied to a lead wire and determines whether an arc fault signal exists, and which presets a circuit breaking time against the generation of an arc, corresponding to the magnitude of a load, and immediately breaks a circuit if a corresponding arc fault signal is detected within the preset circuit breaking time.Type: GrantFiled: February 14, 2006Date of Patent: July 29, 2008Inventor: Sam Kyoung Sung
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Patent number: 7405913Abstract: A semiconductor device in includes a transistor and a surge absorption element such as Zener diode, that are formed on the same substrate and connected in parallel. The surge absorption element has a resistance during breakdown operation that is smaller than the resistance of the surge absorption element during breakdown operation of the transistor. In addition, the secondary breakdown current of the surge absorption element is larger than the secondary breakdown current of the transistor. Upon application of a high ESD voltage and high surge voltage, the energy of the ESD and surge is absorbed by operation of the surge absorption element and is limited to a voltage equal to or less than the breakdown voltage of the transistor, which would otherwise be destroyed.Type: GrantFiled: March 15, 2004Date of Patent: July 29, 2008Assignee: Fuji Electric Device Technology Co.Inventors: Hiroshi Tobisaka, Tatsuhiko Fujihira, Shin Kiuchi, Yoshiaki Minoya, Takeshi Ichimura, Naoki Yaezawa, Ryu Saitou, Shouichi Furuhata, Yuichi Harada
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Patent number: 7405914Abstract: An electrostatic discharge (ESD) protection circuit for the protection of an electronic circuit from an ESD event. The electronic circuit, in operation, is provided with a supply voltage and a reference voltage (typically electrical ground) via voltage terminals and/or power supply buses. The protection circuit includes two bipolar transistors in series, where the transistors are coupled between the supply voltage terminal/bus and the reference voltage terminal/bus. The bases of the transistors are coupled via a connection including two resistors in series, where the connection point between the two resistors is coupled with the connection point between the two transistors.Type: GrantFiled: May 28, 2004Date of Patent: July 29, 2008Assignees: Interuniversitair Microelektronica Centrum (IMEC), AMI SemiconductorInventors: Koen Reynders, Mahmud Zubeidat, Vincent De Heyn
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Patent number: 7405915Abstract: An electrostatic discharge protection circuit for use in a semiconductor device includes an electrostatic signal discharge unit for discharging an electrostatic signal; a first electrostatic detection voltage supplying unit for generating an electrostatic detection voltage in response to an alternating current component of the electrostatic signal; a driving unit for generating a driving voltage in response to the electrostatic detection voltage in order to drive the electrostatic signal discharge unit; and a second electrostatic detection voltage supplying unit enabled in response to the driving voltage for continuously supplying the electrostatic detection voltage to the driving unit in response to a direct current component of the electrostatic signal.Type: GrantFiled: March 3, 2006Date of Patent: July 29, 2008Assignee: Hynix Semiconductor Inc.Inventor: Nak-Heon Choi
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Patent number: 7405916Abstract: A control apparatus includes a plurality of load circuits, a power supply wiring line that connects the load circuits to a DC power supply in common, and a counter electromotive force detecting unit that detects counter electromotive force generated on the power supply wiring line. Each of the load circuits includes a load, a semiconductor switch configured to turn ON/OFF the load for protecting the corresponding load circuit, and a current detecting unit that detects an abnormal increase of a load current flowing through the corresponding load circuit. When the current detecting unit detects an abnormal increase of the load current and the counter electromotive force detecting unit detects that an occurrence of the counter electromotive force which exceeds a predetermined threshold value, the semiconductor switch corresponding to the load circuit is cut off.Type: GrantFiled: July 6, 2005Date of Patent: July 29, 2008Assignee: Yazaki CorporationInventor: Shunzou Ohshima
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Patent number: 7405917Abstract: The present invention provides a method and apparatus for determining the functional status of an electromagnetic valve having a solenoid and plunger including determining the electro-mechanical switching time of a valve based on characteristics of an electrical characteristic responsive to the solenoid; comparing the valve electro-mechanical switching time to a predetermined value; and generating a valve status signal dependant on the results of the comparison.Type: GrantFiled: June 16, 2006Date of Patent: July 29, 2008Assignee: Festo AG & Co.Inventors: Oliver Ahrens, Otto Szenn, Wjatscheslaw Missal, Karl-Heinz Forster
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Patent number: 7405918Abstract: A method is provide for controlling an inductive load device (ILD). The method includes providing a voltage potential across ILD and disabling a flow of current through the ILD resulting from the voltage potential across the ILD when a voltage across a sensing device rises to substantially equal an upper threshold value. The rate at which the voltage across the sensing device rises is a function of resistive and inductive characteristics of the ILD. The method additionally includes enabling the flow of current through the ILD resulting from the voltage potential across the ILD when the voltage across the sensing device decays to substantially equal a lower threshold value. The rate at which the voltage across the sensing device decays is a function of the resistive and inductive characteristics of the ILD.Type: GrantFiled: March 30, 2005Date of Patent: July 29, 2008Assignee: Yazaki North America, Inc.Inventor: Richard P Cuplin
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Patent number: 7405919Abstract: A power supply circuit produces a supply voltage to be supplied to a microprocessor which is an integrated circuit. A transmission line type noise filter includes a signal input terminal, a signal output terminal and two ground terminals corresponding respectively to the signal input terminal and the signal output terminal. The transmission line type noise filter eliminates a high-frequency component of DC voltage applied to the signal input terminal and outputs it from the signal output terminal. A first power supply line pattern, formed on a printed-circuit board, connects an output terminal of the power supply circuit with the signal input terminal of the transmission line type noise filter. A second power supply line pattern connects the signal output terminal of the transmission line type noise filter with a power supply terminal of the microprocessor. A ground land pattern is connected with an external ground potential through via holes and makes a connection between the two ground terminals.Type: GrantFiled: June 22, 2006Date of Patent: July 29, 2008Assignee: Sony Computer Entertainment Inc.Inventor: Kazuaki Mitsui
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Patent number: 7405920Abstract: A flat type capacitor-use polypropylene film having a Ad(thickness determined by micrometer method—thickness determined by weighing method) of 0.05-0.2 ?m and a lengthwise shrinkage dimensional change rate of 3% or less, or a flat type capacitor-use polypropylene film having a ?d of 0.1-0.3 ?m and a lengthwise F5 value of 50 MPa or more, and a flat type capacitor using it. A film excellent in handling ability in a capacitor element winding process is obtained, and a small, a large-capacity flat type capacitor excellent in withstand voltage characteristics such as self-recovering property, and used suitably under a high rated voltage, is obtained.Type: GrantFiled: March 16, 2004Date of Patent: July 29, 2008Assignee: Toray Industries, Inc.Inventors: Kimitake Uematsu, Isamu Moriguchi, Masahito Iwashita, Akira Oda
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Patent number: 7405921Abstract: In one aspect of the invention, a thin layer capacitor element has a capacitor with a dielectric layer made of a metal oxide and a protective insulating layer made of a resin material, and a barrier layer made of a non-conductive inorganic material is provided between the capacitor and the protective insulating layer. In another aspect of the invention, a thin layer capacitor element is constituted so that a capacitor structure is covered with at least one protective insulating layer composed of a cured resin, the cured resin being formed from at least one resin precursor selected from the group consisting of thermosetting resins, photosetting resins and thermoplastic resins.Type: GrantFiled: July 14, 2006Date of Patent: July 29, 2008Assignee: Fujitsu LimitedInventors: Kazuaki Kurihara, Takeshi Shioga, John David Baniecki, Mamoru Kurashina
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Patent number: 7405922Abstract: A high reliability and low power consumption anti-lock brake system is disclosed. The two pilot valves are controlled so as not to be energized concurrently. The secondary battery of the anti-lock brake system is charged by a power supply and/or a generator. An electric double layer capacitor having a housing made of functionally graded aluminum ceramic material is used as the secondary battery.Type: GrantFiled: February 6, 2006Date of Patent: July 29, 2008Assignee: NEC Tokin CorporationInventors: Kiyoshi Kawaguchi, Nobuo Seko, Tatsuo Itoh, Takashi Nagai, Yoshiaki Okita, Hiroyasu Yamamoto
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Patent number: 7405923Abstract: The invention provides a circuit breaker panel with several safety features. The main breaker is separated from the circuit breakers by a non-conducting shield. The main breaker is also covered by a transparent, non-conducting shield. A further transparent non-conducting shield separates the circuit breakers from the neutral and ground bus bars. The neutral and ground bus bars are offset from one another to prevent wire crowding. Bending posts extending from the back plate of the panel help control the wire in the panel to prevent it from crossing bus bars or circuit breakers.Type: GrantFiled: May 4, 2006Date of Patent: July 29, 2008Assignee: Golden Technology Management, LLCInventors: Sean F. Kelly, John P. Gaus
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Patent number: 7405924Abstract: Disclosed is an electronic device utilizing interferometric modulation and a package of the device. The packaged device includes a substrate, an interferometric modulation display array formed on the substrate, and a back-plate. The back-plate is placed over the display array with a gap between the back-plate and the display array. The device further includes reinforcing structures which are integrated with the back-plate. The reinforcing structures add stiffness to the back-plate. The back-plate may have a thickness varying along an edge thereof.Type: GrantFiled: March 25, 2005Date of Patent: July 29, 2008Assignee: IDC, LLCInventors: Brian Gally, Lauren Palmateer, William J. Cummings
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Patent number: 7405925Abstract: A display apparatus comprising an LCD panel, a panel support supporting the LCD panel, a front cover disposed in front of the LCD panel, and a rear cover disposed in the rear of the LCD panel and the panel support and coupled with the front cover, further comprising at least one coupling extended from one of a rear surface of the front cover and a front face of the rear cover toward the other thereof, having an groove formed on its plane; and at least one rib formed at the other thereof, being engaged with the groove of the coupling. With this configuration, there is provided a display apparatus capable of facilitating an assembling and disassembling of the front cover and the rear cover, decreasing the time to be consumed for the assembling and disassembling. In addition, the display apparatus has slim and compact in appearance.Type: GrantFiled: July 16, 2001Date of Patent: July 29, 2008Assignee: Samsung Electronics Co., Ltd.Inventor: Ki-Hyub Sung
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Patent number: 7405926Abstract: A sliding flat panel display and keyboard module for monitoring and controlling server computers on a server rack is described. The sliding flat panel display and keyboard module has an L-shaped supporting frame, a vertical sliding rail, a horizontal sliding rail, a flat panel display, and a keyboard. The vertical sliding rail and the horizontal sliding rail are respectively disposed on a vertical surface and a horizontal surface of the L-shaped supporting frame. The flat panel display couples to the vertical sliding rail and the keyboard couples to the horizontal sliding rail, so that the flat panel display and the keyboard are able to slide on the L-shaped supporting frame horizontally.Type: GrantFiled: August 15, 2005Date of Patent: July 29, 2008Assignee: Aten International Co., Ltd.Inventors: Sui-An Wu, You-Lin Shih
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Patent number: 7405927Abstract: A latching mechanism comprising a hook connected to a first component. The hook has a first position disposed within the first component and a second position extending from the first component. The latching mechanism further comprising a receptacle disposed within a second component and engaged with the hook. A magnet is disposed within the second component and moves the hook from the first position to the second position as the second component is disposed in close proximity to the first component. A push-button release mechanism is disposed within the first component and moves the hook from the second position so as to disengage said hook from said receptacle.Type: GrantFiled: September 10, 2004Date of Patent: July 29, 2008Assignee: Hewlett-Packard Development Company, L.P.Inventor: Jeffrey A. Lev
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Patent number: 7405928Abstract: A data storage cartridge includes a first housing and a second housing forming an inner chamber with an open front end and an open rear end. An information storage device is positioned within the chamber. A pair of intermediate strips are positioned lengthwise between the first housing and the second housing which hold together the first and second housing. A front end cap is positioned in the open front end to close the chamber. A rear end cap is positioned in the open rear end to close the chamber.Type: GrantFiled: May 3, 2004Date of Patent: July 29, 2008Assignee: Hewlett-Packard Development Company, L.P.Inventors: Kenneth G. Robertson, Raymond L. Gradwohl, Jacques L. Gagne
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Patent number: 7405929Abstract: A docking station suitable for being detachably installed to a portable computer is provided. The docking station includes a body, an electrical connector, a lever, a fixing sleeve, a sliding sleeve, and a latch. The electrical connector is fixed on the body and electrically connected to the portable computer. The lever has a connecting portion, a first ejection portion, and a second ejection portion. The connecting portion is pivotally connected to the body. The first ejection portion is disposed between the connecting portion and the second ejection portion. The fixing sleeve is fixed in the body and has a receiving aperture. The sliding sleeve passes through the receiving aperture and has an assembling aperture. The second ejection portion contacts the sliding sleeve. The latch is disposed in the assembling aperture and pivotally connected to the fixing sleeve. The first ejection portion contacts the bottom of the latch.Type: GrantFiled: June 27, 2007Date of Patent: July 29, 2008Assignee: Inventec CorporationInventors: Cheng-Hsiang Chuang, Cheng-Yu Wu
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Patent number: 7405930Abstract: An electronic apparatus has a housing which is formed with a suction port and an exhaust port. The interior of the housing is partitioned with a first chamber and a second chamber by a partition wall. The first chamber accommodates a CPU generating heat. The suction port and the exhaust port are open to the second chamber. A heat pipe which transfers a heat of the CPU from the first chamber to the second chamber is disposed pass through the partition wall. A fan is disposed in the second chamber. The fan suctions air from the suction ports and discharges the suctioned air from the exhaust port. The heat of the CPU transferred to the second chamber is emitted out of the housing. A part where the heat pipe pass through the partition wall is liquid-tightly sealed through a sealing member.Type: GrantFiled: June 29, 2005Date of Patent: July 29, 2008Assignee: Kabushiki Kaisha ToshibaInventors: Takeshi Hongo, Hiroshi Nakamura
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Patent number: 7405931Abstract: A floating heatsink is disclosed for components mounted within an electromagnetic enclosure. The floating heatsink includes an aperture within the enclosure wall against which a floating heatsink is disposed on the interior of the enclosure. The floating heatsink is dimensioned to overlap the enclosure around the aperture. A resilient bias member is disposed along the overlap between the floating heatsink and the enclosure. The resilient bias member acts as an electromagnetic gasket while urging the floating heatsink against the component. In certain embodiments the component is replaceable via a second aperture in the enclosure. The floating heatsink is particularly useful for overcoming the need for thermal compounds of heatsinks using the enclosure known in the art.Type: GrantFiled: March 17, 2006Date of Patent: July 29, 2008Assignee: Nortel Networks LimitedInventors: Peter Saturley, John Clayton Atkinson
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Patent number: 7405932Abstract: In accordance with certain embodiments, a computer system having an electronic component, a heat sink having a contact surface disposed against the electronic component, and at least one blower embedded within fins of the heat sink.Type: GrantFiled: July 19, 2004Date of Patent: July 29, 2008Assignee: Hewlett-Packard Development Company, L.P.Inventors: Wade Vinson, Art Volkmann, John Franz
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Patent number: 7405933Abstract: A cooling device for cooling electronic components mounted on a substrate, comprising a radiating member having a pair of mounting plates formed of a conductive sheet metal member in generally channel shape in cross section and positioned parallel with each other and a connection plate for connecting the pair of mounting plates to each other and a cooling fan mounted on one of the mounting plates of the radiating member, wherein the other of the mounting plates of the radiating member is formed so as to be mountable on the substrate in an abutting state thereof on the electronic components mounted on the substrate.Type: GrantFiled: November 4, 2005Date of Patent: July 29, 2008Assignee: Fujitsu LimitedInventors: Sonomasa Kobayashi, Kaigo Tanaka, Masaki Iwata
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Patent number: 7405934Abstract: Holding arms of a frame member of a fan axially extend and project outward from both sides of a housing in a direction perpendicular to a rotational axis of the fan. Catch projections are provided on inner surface of the axial ends of the holding arms in a front-rear direction perpendicular to the axial direction and the aforementioned direction. The catch projections are arranged without being covered by or covering other portions in the frame member axially.Type: GrantFiled: March 13, 2006Date of Patent: July 29, 2008Assignee: Nidec CorporationInventors: Takaya Otsuki, Takamasa Yamashita
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Patent number: 7405935Abstract: A service tray for a thermal management system for providing convenient access to components within a liquid thermal management system. The service tray for a thermal management system includes a chassis with an opening and a support unit slidably positioned within the opening. The support unit receives various thermal management devices such as a coolant pump, a filter, a heater and the like. A first rail and a second rail are attached within the interior of the chassis that movably receive a first guide and a second guide of the support unit respectively. Electrical and fluid connectors attached to the chassis and the support unit allow for the connection of the thermal management devices on the support unit to the chassis.Type: GrantFiled: November 28, 2006Date of Patent: July 29, 2008Assignee: Isothermal Systems Research, Inc.Inventor: John A. Carey
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Patent number: 7405936Abstract: A hybrid cooling system and method of fabrication are provided for a multi-component electronics system. The cooling system includes an air moving device for establishing air flow across at least one primary and at least one secondary heat generating component to be cooled; and a liquid-based cooling subsystem including at least one cold plate, physically coupled to the at least one primary heat generating component, and a thermally conductive coolant-carrying tube in fluid communication with the at least one cold plate. A thermally conductive auxiliary structure is coupled to the coolant-carrying tube and includes a plurality of thermally conductive fins extending from a surface thereof. The plurality of thermally conductive fins are disposed at least partially over the at least one secondary heat generating component to be cooled, and provide supplemental cooling of at least a portion of the air flow established across the multiple components of the electronics system.Type: GrantFiled: March 26, 2008Date of Patent: July 29, 2008Assignee: International Business Machines CorporationInventors: Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt, Robert E. Simons
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Patent number: 7405937Abstract: A heatsink module for dual heat sources for dissipating heat generated by a first and a second heat-generating element disposed on a circuit board is provided. The heatsink module includes a first heat-conducting plate, a second heat-conducting plate, a fixing member, a heat pipe, and a pressing flat spring. The first and second heat-conducting plates contact the first and second heat-generating elements respectively. The fixing member when fixed to the circuit board presses the second heat-conducting plate against the second heat-generating element. One end of the pressing flat spring is under the traction of the fixing member fixed to the circuit board, and presses the first heat-conducting plate against the first heat-generating element. The fixing member and the first heat-conducting plate then clamp the heat pipe, so as to conduct the heat generated by the first and second heat-generating elements to the heat pipe via the connecting elements.Type: GrantFiled: February 16, 2007Date of Patent: July 29, 2008Assignee: Inventec CorporationInventors: Feng-Ku Wang, Chih-Kai Yang, Huang-Cheng Ke
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Patent number: 7405938Abstract: A heat sink assembly (100) and a heat sink clip (20) are provided. The heat sink clip (20) includes a pin (22) and a spring (24) disposed around the pin (22). The pin (22) includes an upper section (22a) and a lower section (22b). The upper section (22a) has a head (222) thereon, and the lower section (22a) has a clamping portion (224) and an abutting portion (226) which is located between the head (222) and the clamping portion (224) and is in the form of an annular flange extending radially outwardly from an outer surface of the pin (22). A plurality of slots (22c) are defined through the clamping portion (224) and the lower section (22b) of the pin. The abutting portion (226) engages with a bottom surface of a heat sink (10) before the clip (20) secures the heat sink assembly (100) to a circuit board (40).Type: GrantFiled: November 30, 2006Date of Patent: July 29, 2008Assignee: Hon Hai Precision Industry Co., Ltd.Inventor: Chih-Hao Yang
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Patent number: 7405939Abstract: A heat sink assembly (100) includes a fastening device (20) and a heat sink (10). The fastening device includes a sleeve (24), a pin (22) received in the sleeve and a biasing means (26) disposed around the sleeve. The sleeve includes a locking portion (246) formed at a bottom end thereof. The pin includes an engaging portion (226) formed at a bottom end thereof. At least a slot (248) is defined through the locking portion of the sleeve (24). The engaging portion extends outwardly through the slot and resiliently abuts against a bottom surface of the heat sink. The biasing means is slightly deformed between a top end of the fastening device and a top surface of the heat sink, thereby keeping the fastening device in a vertical position with respect to the heat sink.Type: GrantFiled: December 22, 2006Date of Patent: July 29, 2008Assignee: Hon Hai Precision Industry Co., Ltd.Inventor: Chih-Hao Yang
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Patent number: 7405940Abstract: Disclosed is a piston reset apparatus for a multichip module that includes a base with multiple projections and two unit associating pegs extending from opposite ends of the base, a hat disposed upwardly of the base and including multiple adjustable pistons vertically adjustable within the hat, each of the plurality of adjustable pistons being disposed in alignment with one of the multiple projections, a mass equivalent plate disposed upwardly of the hat and being configured to hold a spring loaded sleeve, the spring loaded sleeve including a plurality of springs, each of the springs being aligned with and configured to apply pressure upon one of the multiple pistons, a spring loaded clamp disposed upwardly of the plate and including a spring loaded portion and a retaining portion, the retaining portion defining two cavities configured to fixedly associate with an associating groove defined by each of the unit associating pegs.Type: GrantFiled: April 25, 2007Date of Patent: July 29, 2008Assignee: International Business Machines CorporationInventors: Gerald P. Audet, Sylvain Dussault, Pierre LaCasse, Jean-Luc Landreville
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Patent number: 7405941Abstract: A carrier and associated methodology for removably supporting a plurality of data storage devices as a multiple disc array in a distributed storage system. The carrier defines attachment features for fixing each of the data storage devices to the carrier preventing movement of the data storage devices in relation to the carrier in response to a vibration stimulus. This reduction in vibration stimulus allows the individual data storage devices in the multiple disc array to increase the number of track per storage area. This benefit can be used to increase capacity, increase performance and increase reliability of the multiple disc array.Type: GrantFiled: June 3, 2005Date of Patent: July 29, 2008Assignee: Seagate Technology LLCInventors: Fred Wayne Flournoy, David Peter DeCenzo, Erik Riedel
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Patent number: 7405942Abstract: A device for inserting and/or removing a module into or from an interior region of an assembly, such device comprising a single piece, elongated, having a module mounting region configured to have mounted thereto the module; a handle; and an intermediate region disposed between the module mounting region and the handle, such handle being pivotally mounted to pivot about an axis perpendicular to a longitudinal axis of the structure. The handle portion has a surface positioned perpendicular to a surface of the first portion.Type: GrantFiled: September 29, 2005Date of Patent: July 29, 2008Assignee: EMC CorporationInventor: Jeffrey M. Lewis
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Patent number: 7405943Abstract: An electronic appliance is especially easy to assemble and includes a housing and a circuit carrier which is held in the housing. The circuit carrier is guided in the housing in a displaceable manner and is applied by at least one spring element against a housing abutment which accurately centres the circuit carrier.Type: GrantFiled: September 18, 2003Date of Patent: July 29, 2008Assignee: Siemens AktiengesellschaftInventors: Walter Apfelbacher, Annemarie Lehmeier, Johann Seitz
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Patent number: 7405944Abstract: A retaining device holds a printed circuit board to a structure that has channels for receiving the retaining device. The retaining device includes a body having portions configured for receipt into the channels of the structure, flexible portions and protuberances protruding away from a first surface adjacent each flexible portion. A method for holding the PCB to the heat sink is disclosed. A lighting assembly that includes the retaining device is also disclosed.Type: GrantFiled: January 10, 2007Date of Patent: July 29, 2008Assignee: Lumination LLCInventors: Mark J. Mayer, Alan B. Toot
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Patent number: 7405945Abstract: A four-way lead flat package IC-mount printed circuit board, carrying a four-way lead flat package IC and having front soldering land groups placed in front of the four way lead flat package IC and rear soldering land groups placed in the rear of the four-way lead flat package IC, has solder drawing lands, in a neighboring area, between the front soldering land groups and the rear soldering land groups adjacent to the front soldering land groups, and/or a trailing area of the rear soldering land groups. The solder drawing lands are formed with slits substantially parallel to the lines of soldering lands of the front soldering land groups or the rear soldering land groups placed in front of the solder drawing lands. These result in an advantageous effect of enabling the prevention of the occurrence of soldering bridges and soldering residues in the front soldering land groups or the rear soldering land groups.Type: GrantFiled: August 8, 2006Date of Patent: July 29, 2008Assignee: Mitsubishi Electric CorporationInventor: Tsuyoshi Miura
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Patent number: 7405946Abstract: A pattern of contacts that includes high speed transmitter contacts disposed in a first portion of the pattern, where the high speed transmitter contacts are disposed in first ordered channels of adjacent transmitter differential pairs. High speed receiver contacts are disposed in a second portion of the pattern, where the first portion of the pattern is not interspersed with the second portion of the pattern, and the high speed receiver contacts are disposed in first ordered channels of adjacent receiver differential pairs. At least one unbroken line of other contacts is disposed between the first portion of the pattern and the second portion of the pattern, where the other contacts do not contain any high speed transmitter contacts and high speed receiver contacts. Low speed IO contacts are disposed in a third portion of the pattern.Type: GrantFiled: May 5, 2005Date of Patent: July 29, 2008Assignee: LSI Logic CorporationInventors: Jeffrey A. Hall, Farshad Ghahghahi
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Patent number: 7405947Abstract: For electrical backplanes and the like, a power plane adaptation to improve the propagation of high-speed signals through clearances in an embedded power plane is disclosed. In exemplary embodiments, the power plane is segmented in a high-speed connector region, such that a portion of the metal layer that forms the power plane is retained in the high-speed connector region—but isolated from the power-delivery portion of the power plane. The isolated portion is connected to digital ground, and clearances are formed therein where high-speed signaling throughholes will pass through the region. In some embodiments, various attainable advantages include better manufacturability, better matching and control of high-speed signaling throughhole impedance, and improved noise isolation. Other embodiments are described and claimed.Type: GrantFiled: June 1, 2007Date of Patent: July 29, 2008Assignee: Force 10 Networks, Inc.Inventor: Joel R. Goergen
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Patent number: 7405948Abstract: A circuit board device comprises a first wiring board (79) having plural first electrode terminals (73, 75, 77) for connection row-arranged on a surface layer, a second wiring board (87) having plural second electrode terminals (81, 83, 85) for connection row-arranged on a surface layer, and an anisotropic conductive member (89) disposed therebetween to the electrode terminals (73, 75, 77, 81, 83, 85). A local portion of each of the wiring boards (79, 87) has a step difference to divide and dispose the electrode terminals (73, 75, 77, 81, 83, 85). A local portion of the anisotropic conductive member (89) corresponding to the step difference has a step shape that is capable of contacting with the step difference. A laminate comprising respective wiring boards (79, 87) and the anisotropic conductive member disposed therebetween is pressed and held in a lamination direction.Type: GrantFiled: January 22, 2004Date of Patent: July 29, 2008Assignee: NEC CorporationInventors: Junya Sato, Yoshiyuki Hashimoto, Masakazu Koizumi
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Patent number: 7405949Abstract: A memory system has first and second primary memories and first and second secondary memories coupled to the first and second primary memories, respectively, the coupling comprising at least one point-to-point connection. A memory module includes at least two of the first and second primary and first and second secondary memories. A first connection element, such as a connector or solder, connects the memory module to a mother board. A second connection element, such as a connector or solder, connects at least one other of the first and second primary and first and second secondary memories to the mother board. At least one of the memories on the first memory module is coupled to at least one of the other memories. The memory system also includes a memory controller which is connected to the primary memories by a point-to-two-point link.Type: GrantFiled: November 22, 2006Date of Patent: July 29, 2008Assignee: Samsung Electronics Co., Ltd.Inventors: Jae-Jun Lee, Joo-Sun Choi, Kyu-Hyoun Kim, Kwang-Soo Park
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Patent number: 7405950Abstract: A mounting apparatus for mounting two or more types of data storage devices that each defines a locking hole in a sidewall thereof includes a bracket for holding the data storage devices, a fixing member, and a locking member. The bracket includes a first side wall. The first side wall defines a locating hole therein. The locating hole has at least two locating positions. The fixing member is pivotably mounted to the first side wall of the bracket. The locking member is selectively mounted to at least two positions of the fixing member. The locking member includes a locking portion extending therefrom, for selectively being inserted through the at least two locating positions of the locating hole of the bracket to engage in the locking hole of a corresponding type of data storage device.Type: GrantFiled: November 10, 2006Date of Patent: July 29, 2008Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventors: Xue-Cheng Zhang, Qin Guo, Guang-Yao Lee, Chun-Chi Liang
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Patent number: 7405951Abstract: A switching power supply includes: a first series circuit, connected to both terminals of a direct current power supply Vdc1, in which a primary winding 5a of a transformer T, a reactor L3 and a first switch Q1 are connected in series; a second series circuit, connected to both terminals of the primary winding 5a and the reactor L3, which includes a switch Q2 and a capacitor C3; a smoothing circuit D1, D2, L1, C4; and a control circuit 10 alternately turning on and turning off the switches Q1, Q2. The transformer T includes: a main core 21, formed with a magnetic circuit, on which the primary and secondary windings 5a, 5b are wound with a given gap 23; and a plurality of auxiliary cores 24a, 24b disposed in the given gap 23 with a given distance in a circumferential direction of the primary winding 5a. Further, the reactor L3 is formed of a leakage inductance of the transformer T.Type: GrantFiled: June 14, 2004Date of Patent: July 29, 2008Assignee: Sanken Electric Co., Ltd.Inventor: Mamoru Tsuruya
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Patent number: 7405952Abstract: A power supply device has first and second terminals, a transformer, a switching element and an auxiliary power supply element. The first and second terminals receive input power having an input voltage. The transformer has a primary winding and a secondary winding. The primary winding has a pair of winding terminals. One of the pair of winding terminals is connected to the first terminal. The switching element is connected between the second terminal and the other of the pair of winding terminals of the primary winding. The auxiliary power supply element feeds electric power to the transformer when the input voltage decreases to or less than a predetermined value. The auxiliary power supply element has a capacitor and a second switching element for storing energy from the primary winding into the first capacitor during a normal operation of the power supply device.Type: GrantFiled: February 15, 2006Date of Patent: July 29, 2008Assignee: TDK CorporationInventor: Takeshi Uematsu
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Patent number: 7405953Abstract: A driving circuit has a p-channel transistor and an n-channel transistor. A power switching element is set at an on state each time the p-channel transistor sets a charging line at a conductive state in response to a leading edge of an output pulse to supply a positive charge to a gate of the element through the charging line. The element is set at an off state each time the n-channel transistor sets a discharging line at a conductive state in response to a trailing edge of the output pulse to discharge the supplied charge through the discharging line. A through current occasionally flows through the transistors set at the on state together. The driving circuit has resistors between the transistors to suppress the through current.Type: GrantFiled: February 21, 2007Date of Patent: July 29, 2008Inventors: Kimikazu Nakamura, Tsuyoshi Yamashita, Tsuyoshi Hosoda, Yuji Hayashi
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Patent number: 7405954Abstract: Techniques are disclosed to regulate an output of a power converter. One example power converter controller circuit includes a line sense input to be coupled to receive a signal representative of an input voltage of a power converter. A feedback input is included and is to be coupled to receive a feedback signal representative of an output of the power converter. A drive signal generator is included and is to generate a drive signal coupled to control switching of a switch to provide a regulated output parameter at the output of the power converter in response to the feedback signal. The drive signal generator is to latch the power converter into an off state in response to a detection of a loss of regulation of a power converter output parameter if the input voltage of the power converter is above a threshold level. The drive signal generator is to be unresponsive to the signal representative of the input voltage of the power converter while the power converter output parameter is in regulation.Type: GrantFiled: June 7, 2007Date of Patent: July 29, 2008Assignee: Power Integrations, Inc.Inventors: Stefan Bäurle, Alex B. Djenguerian, Kent Wong