Abstract: A method is provided that includes first etching a substrate according to a first mask. The first etching forms a first etch feature in the substrate to a first depth. The first etching also forms a sliver opening in the substrate. The sliver opening may then be filled with a fill material. A second mask may be formed by removing a portion of the first mask. The substrate exposed by the second mask may be etched with a second etch, in which the second etching is selective to the fill material. The second etching extends the first etch feature to a second depth that is greater than the first depth, and the second etch forms a second etch feature. The first etch feature and the second etch feature may then be filled with a conductive metal.

Abstract: A method of forming a fluorine-free tungsten diffusion barrier layer having a reduced resistivity, and a semiconductor device, and method for forming such semiconductor device, using the fluorine-free tungsten diffusion barrier layer.

Abstract: A package-on-package (“PoP”) structure and a method of forming are provided. The PoP structure may be formed by forming a first set of electrical connections on a first substrate. A first material may be applied to the first set of electrical connections. A second substrate may be provided having a second set of electrical connections formed thereon. The first set of electrical connections of the first substrate having the epoxy flux applied may be contacted to the second electrical connections of the second substrate. A reflow process may be performed to electrically connect the first substrate to the second substrate. The epoxy flux applied to the first electrical connections of the first substrate may prohibit electrical bridges or shorts from forming during the reflow process.

Abstract: A splash containment structure for semiconductor structures and associated methods of manufacture are provided. A method includes: forming wire bond pads in an integrated circuit chip and forming at least one passivation layer on the chip. The at least one passivation layer includes first areas having a first thickness and second areas having a second thickness. The second thickness is greater than the first thickness. The first areas having the first thickness extend over a majority of the chip. The second areas having the second thickness are adjacent the wire bond pads.

Abstract: A semiconductor device with a transistor region has a first conductor pattern formed within a multilayer interconnect structure positioned under a signal line and above the transistor region. The first conductor pattern is coupled to ground or a power supply and overlaps the transistor region. The signal line overlaps the first conductor pattern.

Abstract: A method for manufacturing a layer arrangement in accordance with various embodiments may include: providing a first layer having a side; forming one or more nanoholes in the first layer that are open towards the side of the first layer; depositing a second layer over the side of the first layer.

Abstract: Roughly described, an integrated circuit device has a conductor extending entirely through the substrate, connected on one end to the substrate topside surface and on the other end to the substrate backside surface. In various embodiments the conductor is insulated from all RDL conductors on the backside of the substrate, and/or is insulated from all conductors and device features on any below-adjacent chip in a 3D integrated circuit structure. Methods of fabrication are also described.

Abstract: A device includes a polymer, a device die in the polymer, and a plurality of Through Assembly Vias (TAVs) extending from a top surface to a bottom surface of the polymer. A bulk metal feature is located in the polymer and having a top-view size greater than a top-view size of each of the plurality of TAVs. The bulk metal feature is electrically floating. The polymer, the device die, the plurality of TAVs, and the bulk metal feature are portions of a package.

Abstract: A semiconductor device is disclosed allowing detection of a connection state of a Through Silicon Via (TSV) at a wafer level. The semiconductor device includes a first line formed over a Through Silicon Via (TSV), a second line formed over the first line, and a first power line and a second power line formed over the same layer as the second line. Therefore, the semiconductor device can screen not only a chip-to-chip connection state after packaging completion, but also a connection state between the TSV and the chip at a wafer level, so that unnecessary costs and time encountered in packaging of a defective chip are reduced.

Abstract: A semiconductor device including active regions defined in a semiconductor substrate to be non-parallel with a first direction and a second direction which are perpendicular to each other, word lines intersecting active regions and extending in first directions to be spaced apart from each other in the second direction, bit lines crossing over word lines and extending in second directions to be spaced apart from each other in the first direction, first impurity regions disposed in respective ones of central portions of active regions to non-overlap with the word lines, second impurity regions disposed in both ends of each of the active regions to non-overlap with the word lines, and bit line contact plugs disposed between the first impurity regions and the bit lines. The bit line contact plugs having longish shapes including major axes substantially parallel with the second direction and minor axes substantially parallel with the first direction.

Abstract: Technology that achieves high integration of a semiconductor device employing TSV technology is provided. A through electrode is configured by a small-diameter through electrode having a first diameter and being formed on a main surface side of a semiconductor wafer, and a large-diameter through electrode having a second diameter larger than the above-described first diameter and being formed on a back surface side of the semiconductor wafer, and the small-diameter through electrode is arranged inside the large-diameter through electrode in a planar view so that a center position of the small-diameter through electrode and a center position of the large-diameter through electrode do not overlap with each other in the planar view.

Abstract: Manufacturing stability of a semiconductor device is improved. A method of manufacturing a semiconductor device includes the steps of: forming an etching stopper film over a first interlayer insulating film; forming an inorganic insulating film over the etching stopper film; forming a resist film over the inorganic insulating film; selectively etching the etching stopper film and the inorganic insulating film by using the resist film as a mask to form a first opening in the etching stopper film and to form a second opening in the inorganic insulating film; removing the resist film by O2 plasma ashing; forming a second interlayer insulating film over the inorganic insulating film; and etching the second interlayer insulating film to form a wiring groove that is coupled to the second opening, and etching a portion located under the first opening of the first interlayer insulating film to form a via hole.

Abstract: A method of integrating a first substrate having a first surface with a first insulating material and a first contact structure with a second substrate having a second surface with a second insulating material and a second contact structure. The first insulating material is directly bonded to the second insulating material. A portion of the first substrate is removed to leave a remaining portion. A third substrate having a coefficient of thermal expansion (CTE) substantially the same as a CTE of the first substrate is bonded to the remaining portion. The bonded substrates are heated to facilitate electrical contact between the first and second contact structures. The third substrate is removed after heating to provided a bonded structure with reliable electrical contacts.

Abstract: Roughly described, an integrated circuit device has a conductor extending entirely through the substrate, connected on one end to the substrate topside surface and on the other end to the substrate backside surface. In various embodiments the conductor is insulated from all RDL conductors on the backside of the substrate, and/or is insulated from all conductors and device features on any below-adjacent chip in a 3D integrated circuit structure. Methods of fabrication are also described.

Abstract: A semiconductor device has a semiconductor die mounted to a carrier. A first encapsulant is deposited over the semiconductor die and carrier. A stiffening support member can be disposed over the carrier around the semiconductor die. A plurality of channels or recesses is formed in the first encapsulant. The recesses can be formed by removing a portion of the first encapsulant. Alternatively, the recesses are formed in a chase mold having a plurality of extended surfaces. A second encapsulant can be deposited into the recesses of the first encapsulant. The carrier is removed and an interconnect structure is formed over the semiconductor die and first encapsulant. The thickness of the first encapsulant provides sufficient stiffness to reduce warpage while the recesses provide stress relief during formation of the interconnect structure. A portion of the first encapsulant and recesses are removed to reduce thickness of the semiconductor device.

Abstract: The present application discloses various implementations of a semiconductor package including an organic substrate and one or more interposers having through-semiconductor vias (TSVs). Such a semiconductor package may include a contiguous organic substrate having a lower substrate segment including first and second pluralities of lower interconnect pads, the second plurality of lower interconnect pads being disposed in an opening of the lower substrate segment. The contiguous organic substrate may also include an upper substrate segment having an upper width and including first and second pluralities of upper interconnect pads. In addition, the semiconductor package may include at least one interposer having TSVs for electrically connecting the first and second pluralities of lower interconnect pads to the first and second pluralities of upper interconnect pads. The interposer has an interposer width less than the upper width of the upper substrate segment.

Abstract: The present application discloses various implementations of a semiconductor package including an organic substrate and one or more interposers having through-semiconductor vias (TSVs). Such a semiconductor package may include a contiguous organic substrate having a lower substrate segment including first and second pluralities of lower interconnect pads, the second plurality of lower interconnect pads being disposed in an opening of the lower substrate segment. The contiguous organic substrate may also include an upper substrate segment having an upper width and including first and second pluralities of upper interconnect pads. In addition, the semiconductor package may include at least one interposer having TSVs for electrically connecting the first and second pluralities of lower interconnect pads to the first and second pluralities of upper interconnect pads. The interposer has an interposer width less than the upper width of the upper substrate segment.

Abstract: A chip stack structure and a manufacturing method thereof are provided. The chip stack structure comprises a first chip, a second chip and a vertical conductive line. The second chip is disposed above the first chip. The vertical conductive line is electrically connected to the first chip and the second chip. The vertical conductive line is disposed at the outside of a projection area of the first chip and the second chip.

Abstract: A method (80) entails providing (82) a structure (117), providing (100) a controller element (102, 24), and bonding (116) the controller element to an outer surface (52, 64) of the structure (117). The structure includes a sensor wafer (92) and a cap wafer (94). Inner surfaces (34, 36) of the wafers (92, 94) are coupled together, with sensors (30) interposed between the wafers (92, 94). One wafer (94, 92) includes a substrate portion (40, 76) with bond pads (42) formed on its inner surface (34, 36). The other wafer (94, 92) conceals the substrate portion (40, 76). After bonding, methodology (80) entails forming (120) conductive elements (60) on the element (102, 24), removing (126) material sections (96, 98, 107) from the wafers (92, 94, 102) to expose the bond pads (42), forming (130) electrical interconnects (56), applying (134) packaging material (64), and singulating (138) to produce sensor packages (20, 70).

Abstract: A method of integrating a first substrate having a first surface with a first insulating material and a first contact structure with a second substrate having a second surface with a second insulating material and a second contact structure. The first insulating material is directly bonded to the second insulating material. A portion of the first substrate is removed to leave a remaining portion. A third substrate having a coefficient of thermal expansion (CTE) substantially the same as a CTE of the first substrate is bonded to the remaining portion. The bonded substrates are heated to facilitate electrical contact between the first and second contact structures. The third substrate is removed after heating to provided a bonded structure with reliable electrical contacts.

Abstract: In one embodiment, an electronic memory module may be provided to couple two or more stacked memory dies. The memory module may include a first substrate that couples the first memory die in a flip chip configuration. The substrate also includes connectors to couple to a second substrate, which has a flip chip connection to a second memory die. A surface of the first substrate opposite the flip chip connection of the first memory die may include connectors to couple to the first memory die (through the first substrate) and may include connectors to couple to the second memory die (through the connectors that couple to the second substrate, and through the first substrate.

Abstract: A method for manufacturing a package on package structure includes the step of: providing a package body comprising a first package device and a connection substrate, the first package device comprising a number of first solder pads, the connection substrate comprising a substrate main body and a number of first electrically conductive posts, the first electrically conductive posts spatially corresponding to and being connected to the first solder pads, and a solder paste printed on each first electrically conductive post; attaching a second device on the second surface of the connection substrate, thereby obtaining a stacked structure, the second package device comprising a number of second solder pads; and solidifying the solder paste on each first electrically conductive post, such that each second solder pad is soldered to the corresponding first electrically conductive post using the solder paste, thereby obtaining a package on package structure.

Abstract: A method and system for uniquely identifying each semiconductor device die from a wafer is provided. Identifying features are associated with device die bond pads. In one embodiment, one or more tab features are patterned and associated with each of one or more device die bond pads. These features can represent a code (e.g., binary or ternary) that uniquely identifies each device die on the wafer. Each tab feature can be the same shape or different shapes, depending upon the nature of coding desired. Alternatively, portions of the one or more device die bond pads can be omitted as a mechanism for providing coded information, rather than adding portions to the device die bond pads.

Abstract: To provide a semiconductor device having suspension leads with less distortion. In QFN having a plurality of external terminal portions at the periphery of the bottom surface of a sealing body, a plurality of leads is linked to a plurality of long suspension leads of the QFN at an intermediate portion thereof or at between the intermediate portion and a position near the die pad. These long suspension leads are each supported by these leads, making it possible to suppress distortion of each of the suspension leads in a wire bonding step or molding step in the fabrication of the QFN.

Abstract: This disclosure relates generally to a semiconductor device and method of making the semiconductor device by pressing an electrical contact of a chip into a bonding layer on a carrier. The bonding layer is cured and coupled, at least in part, to the electrical contact. A molding layer is applied in contact with the chip and a first major surface of the bonding layer. Distribution circuitry is coupled to the electrical contact.

Abstract: A thermosetting resin sheet for sealing an electronic component, that is excellent in adhesiveness, onto the electric component; a resin-sealed type semiconductor device high in reliability; and a method for producing the device are provided. The present invention relates to a thermosetting resin sheet for sealing an electronic component, comprising one or more resin components, one of the components being allowable to be a thermoplastic resin, and having a content by percentage of the thermoplastic resin of 30% or less by weight of all of the entire resin components.

Abstract: Methods of purifying crude cyclopentadienyl magnesium compounds using a scavenging agent are provided. The purified cyclopentadienyl magnesium compounds have very low levels of metallic impurities.

Abstract: A submerged aerator is provided with a motor-pump assembly installed submerged, supported by a floating structure of a central articulation of a vertical supporting tube and rotating vertical shaft, where the aerator is provided with two propellers, also called rotors, which promote mixing and suction of atmospheric air for incorporation in the effluent, and a upper driving assembly, mounted outside the effluent and on the floatation structure, which enables the motor-pump assembly performing a partial rotating movement under the effluent due to the geometry of the crank rod system.

Abstract: The present disclosure is directed at a system, apparatus and method for concentrating a solution. The system includes a humidification device and a solution flow path for flow of a solution to be concentrated to the humidification device. The humidification device includes humidification media to facilitate evaporation of liquid from the solution to be concentrated to gas as the solution to be concentrated passes through the humidification media thereby concentrating the solution. The method includes flowing a solution to be concentrated along a flow path to a humidification device including humidification media, flowing a gas through the humidification media, and flowing the solution to be concentrated through the humidification media. There is evaporation of liquid from the solution to the gas as the solution passes through the humidification media thereby concentrating the solution and producing a humidified gas. The solution to be concentrated may be salt water and the gas may be air.

Abstract: The present disclosure relates to a method and a device for application of liquid polymeric material onto the active spinning zone of the cord of the spinning member of the spinning electrode, where the application means moving reversibly along the active spinning zone of the cord in the device for production of nanofibres through electrostatic spinning of liquid material in electrostatic field of high intensity between at least one spinning electrode and against it arranged collecting electrode. The liquid polymeric material is applied onto the cord around its whole circumference without any contact with gaseous environment in the spinning space, where the application means reversibly moves, whereas while the cord is leaving the application means the thickness of the layer of the liquid polymeric material is being reduced and immediately after leaving the application means the process of electrostatic spinning of the liquid polymeric material applied on the cord is started.

Abstract: A material handling and mold filling system is provided which directs the flow of molten plastic material from an extruder and allocates the molten material to a plurality of nozzles through the use of independently operated, variable valves. The system therefore provides independent streams of molten plastic material having variable temperatures and flow rates or volumes to particular sections or regions of the mold. This independent temperature or flow of molten plastic material facilitates the complete, rapid and accurate filling of the molds, reducing turbulence and other temperature or flow-related imperfections in the finished components. A multiphase material handling system is also disclosed for expeditious sequential and simultaneous filling and pressing of the mold and extracting the completed component from the system.

Abstract: A method for manufacturing a liquid container, the liquid container including: a case having a containing section for containing liquid; a supply port for supplying the liquid from the containing section to the outside thereof; and a detection member for detecting an amount of the liquid in the containing section, wherein the containing section is divided into a first containing chamber, a second containing chamber, a third containing chamber and a fourth containing chamber in a flow of the liquid from the containing section to the supply port, the method comprising: forming an injection port on an upstream part of the flow from the fourth containing chamber, the injection port being communicated with the inside of the containing section; and injecting the liquid from the injection port.

Abstract: Porosity causing gas-based defects are detected, located, identified, and/or characterized by the use of defect information generated from gas flow data corresponding to gas flow characteristics measured by one or more sensors on a composite part processing piece such as a mould or membrane used during a composite manufacturing process. The defect information is generated using techniques including one or more of profiling the gas flow data, fingerprinting, line leak detection, analytical triangulation.

Abstract: The present disclosure provides a method of stiffening an outer layer of a wet extrudate, where the extrudate has a honeycomb cellular structure. The method includes extruding the extrudate through an extrusion apparatus and directing a substantially uniform flow of fluid onto the outer layer of the extrudate. The method also includes increasing the temperature of a binder material of the extrudate to its gelation point and stiffening at least the outer layer of the extrudate.

Abstract: A method includes refining and heating a foamable material with a petroleum resin, making the foamable material into particles by a granulating equipment, pouring the particles into a first die and heating the particles, placing at least one flexible fiber cloth layer into the first die to abut the particles, clamping the particles and the fiber cloth layer between the first die and a second die to proceed a vulcanization process so that the particles are foamed to form a composite foamed element which is combined with the fiber cloth layer to construct a gas permeable composite foam pad, and removing the gas permeable composite foam pad. Thus, the composite foamed element has a surface formed with a plurality of clearances which are located between the composite foamed element and the fiber cloth layer.

Abstract: A radiation shielding material contains ground scrap tire rubber, granulated iron or other metals of moderate cost, and a suitable binder, such as polyurethane or asphalt. The rubber particles can also have a metallic coating.

Abstract: In an embodiment, a method of processing a polymer comprises: mixing polymer and solid carbon dioxide; introducing the polymer and solid carbon dioxide mixture to a hopper of a vented extruder; plasticizing the mixture to form a polymer melt with dissolved carbon dioxide; venting carbon dioxide as a gas before the die exit; and extruding the polymer melt through a die. In an embodiment, a method of making an article comprises: introducing a polymer powder to an extruder; introducing solid carbon dioxide powder to the extruder at the hopper; plasticizing and extruding the polymer and solid carbon dioxide mixture; venting the solid carbon dioxide before the die exit; extruding the polymer melt through a die to form pellets; and injection molding the polymer pellets without solid carbon dioxide to form molded articles.

Abstract: A polymer composite and its method of manufacture using a recycled multilayer material. An example of the recycled multilayer material is comprised of a polyethylene/polyethylene terephthalate/aluminum film that may be extruded with organic filler to obtain desirable performance in wood-substitute products such as deck boards, railing, fencing, pergolas, residential cladding/siding, sheet products, and other applications.

Abstract: A manufacturing method of a bearing housing of a washing machine using a first mold and a second mold to form an external appearance of the bearing housing and a central core to form a shaft support part of the bearing housing includes inserting a bearing bush onto the outer circumferential surface of the central core, and fixing the bearing bush inserted onto the outer circumferential surface of the central core by at least one bush fixing rib formed on one of the first mold and the second mold.

Abstract: According to one embodiment, a patterning method includes releasing the template from the cured imprint resist, aligning an alignment mark formed in the non-imprint portion of the template with the transfer pattern of the alignment pattern without causing the alignment mark to contact the imprint resist, and causing the main pattern and the alignment pattern of the template to contact an imprint resist that is supplied to a shot region adjacent to the cured imprint resist and uncured. The method includes curing the imprint resist of the adjacent shot region in the state of the template being in contact to form the transfer pattern of the main pattern and the transfer pattern of the alignment pattern in the imprint resist.

Abstract: The present invention provides a nanoimprint curable composition to be used in “nanoimprint lithography” in which a nanoimprint mold is pressed to transfer a fine concave-convex pattern, the nanoimprint curable composition containing a composite resin which has a polysiloxane segment and a polymer segment other than the polysiloxane segment, the polysiloxane segment containing a silanol group and/or hydrolyzable silyl group and having a polymerizable double bond. In addition, the present invention provides a nanoimprint-lithographic molded product, resist film, resin mold, and method for forming a pattern, which each involves use of the nanoimprint composition.

Abstract: A promotional item has a moldable dough in a container where the container and the moldable dough have a three-dimensional indicia associated with or representing a business and/or a product.

Abstract: Described herein are polymer low profile microtiter plates suitable for use in a variety of laboratory and clinical settings. The microtiter plates described herein also are compatible with automated or manual liquid dispensing devices and high throughput robotic biological work stations.

Abstract: A device and method for molding a plastic component, comprising a slide movable in a translational movement between a position in which the slide is open and a position in which the slide is closed, the slide comprising a cold runner opening into the molding cavity and the device comprising an ejection member for ejecting plastic sprue formed in the cold runner. The ejection member comprises at least two parts, the first part being borne by the mobile part and the second part being borne by the slide, the slide being movable between a position in which the two parts of the ejection member are offset and a position in which the two parts of the ejection member are more or less aligned so that they can collaborate with one another. The molding cavity comprises a region intended to form a rib or a tab of the plastic component, the cold runner opening into this region.

Abstract: A method and apparatus for the additive manufacturing of three-dimensional objects are disclosed. Two or more materials are extruded simultaneously as a composite, with at least one material in liquid form and at least one material in a solid continuous strand completely encased within the liquid material. A means of curing the liquid material after extrusion hardens the composite. A part is constructed using a series of extruded composite paths. The strand material within the composite contains specific chemical, mechanical, or electrical characteristics that instill the object with enhanced capabilities not possible with only one material.

Abstract: A process and an apparatus for performing a UV nano-imprint lithography are provided. The process uses a polymer pad which allows a uniform application of pressure to a patterned template and an easy removal of a residual resin layer. The apparatus includes a tilt and decentering corrector which allows an accurate alignment of layers during the nano-imprint lithography process.

Abstract: For the production of embossed microstructures in radiation-curing materials, use is made of a micro embossing form fixed to a reflective or scattering cylinder surface. Via a press nip, the micro embossing form comes into contact with the substrate guided over a cylinder or a deflection roller. The radiation-curing material is acted on in one or both pockets, before or after the press nip, with radiation which penetrates into the press nip by reflection or scattering.

Abstract: A device for producing a three dimensional object from a powdery material by solidifying the powdery material through the application of energy includes a working surface, an application device for applying the powdery material onto the working surface, and a solidifying device for solidifying the powdery material applied onto the working surface. The application device can apply predefined, locally different amounts of powdery material and includes a transfer device, which can be magnetized and/or electrostatically charged and discharged, as well as a magnetizing and/or charging device.

Abstract: A light irradiation molding apparatus includes a pair of rubber molds through which light passes, and a light-irradiating means for emitting light from surfaces of the pair of rubber molds to a particulate thermoplastic resin placed in the cavity. The light irradiation molding apparatus relatively and sequentially moves the pair of rubber molds and the light-irradiating means so that an irradiation position of light emitted from the light-irradiating means moves from a melted portion to an unmelted portion of the thermoplastic resin, and the light irradiation molding apparatus sequentially melts portions of the thermoplastic resin.

Abstract: A method of forming a single-mode polymer waveguide array connector that provides precise alignment of a plurality of cores of polymer waveguide arrays with respect to an absolute reference position, such as a guide pin hole in a ferrule, when the polymer waveguide array connector is connected to another polymer waveguide array connector or provides precise alignment of a plurality of cores of a polymer waveguide array and a fiber array with respect to the absolute reference position when the polymer waveguide array connector is connected to a single-mode fiber array connector. A plurality of cores of single-mode polymer waveguide arrays or single-mode fiber arrays is precisely aligned with each other. In addition, there is provided a combination of a plurality of molds, e.g., a first mold (A) and a second mold (B), used in a plurality of processes in a specific method.