With Indicating, Testing, Inspecting, Or Measuring Means Patents (Class 118/712)
  • Publication number: 20140224425
    Abstract: In accordance with an embodiment, a film thickness monitoring method includes applying light to a substrate, which is a processing target, in a semiconductor manufacturing process involving rotation of the substrate, detecting reflected light from the substrate, and calculating a thickness of a film on the substrate. The thickness of the film is calculated from intensity of the reflected light detected in an identified time zone in which incident light passes a desired region on the substrate during the semiconductor manufacturing process.
    Type: Application
    Filed: September 9, 2013
    Publication date: August 14, 2014
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventor: Toru MIKAMI
  • Patent number: 8800482
    Abstract: An apparatus for printing a conductive ink onto a plastic panel including an articulatable arm having an end that opposes a surface of the panel. A nozzle is mounted via a nozzle height actuator to the end of the arm, and the nozzle is coupled to a source of conductive ink. A flow regulator, coupled to the ink source, regulates the flow rate of ink out of the nozzle and is controlled by the controller. A height sensor is configured to output a height signal relative to the surface and the controller, which is coupled to the arm, the flow regulator, the nozzle height actuator and the sensor, is configured to control the arm, flow regulator, nozzle height actuator, and speed of nozzle movement such that a conductive trace of predetermined height and width is applied to the substrate.
    Type: Grant
    Filed: December 29, 2005
    Date of Patent: August 12, 2014
    Assignee: Exatec LLC
    Inventors: Robert Schwenke, Eric Van der Meulen, Billy Bui, Keith Weiss
  • Publication number: 20140216339
    Abstract: A raw material vaporizing and supplying apparatus including a source tank in which a raw material is stored, a raw material gas supply channel through which raw material gas is supplied from an internal space portion of the source tank to a process chamber, a pressure type flow rate control system which is installed along the way of the supply channel, and controls a flow rate of the raw material gas which is supplied to the process chamber, and a constant temperature heating unit that heats the source tank, the supply channel, and the pressure type flow rate control system to a set temperature, wherein the raw material gas generated in an internal space portion of the source tank is supplied to the process chamber while the pressure type flow rate control system performs flow rate control.
    Type: Application
    Filed: February 3, 2014
    Publication date: August 7, 2014
    Applicant: FUJIKIN INCORPORATED
    Inventors: Masaaki Nagase, Atsushi Hidaka, Kaoru Hirata, Ryousuke Dohi, Kouji Nishino, Nobukazu Ikeda
  • Publication number: 20140220712
    Abstract: There are provided a susceptor having a recessed wafer mounting section, in which a semiconductor wafer is mounted and which is configured to include a circular bottom portion and a side wall portion, on an upper surface, a reaction chamber in which the susceptor is provided, an imaging unit that is provided above the reaction chamber and images the semiconductor wafer and the wafer mounting section, and an image analysis unit that analyzes the deviation of the semiconductor wafer from the wafer mounting section on the basis of an image captured by the imaging unit.
    Type: Application
    Filed: June 6, 2013
    Publication date: August 7, 2014
    Inventors: Akira Okabe, Masanori Tanoguchi, Junichi Tomizawa
  • Publication number: 20140216338
    Abstract: A device to apply and confirm the proper dispensation of conductive glue includes a nozzle vacuum-lifting a photoelectric element having a bonding surface, a base defining a receiving recess, a conductive glue received in the recess, a driver, and a controller controlling the driver to drive the nozzle to dip the photoelectric element into the conductive glue. A first camera module positioned on the base and aimed at the bonding surface takes images of the bonding surface. The controller is in communication with the first camera module and processes the images to determine if the amount of conductive glue and the spread area on the bonding surface are correct and, if yes, control the driver to pass on the photoelectric element, or if no, control the driver to reject the photoelectric element.
    Type: Application
    Filed: June 28, 2013
    Publication date: August 7, 2014
    Inventor: CHIH-CHEN LAI
  • Publication number: 20140216340
    Abstract: Disclosed is a method of producing an insulated electric wire, in which a primary coating layer including at least an enamel-baking layer is formed on a metallic conductor to form a primary coated electric wire, and a secondary coating layer is extrusion-formed on the primary coating layer of the primary coated electric wire. The method includes an electric wire pre-heating process where a surface of the primary coating layer is pre-heated using an electric wire pre-heating unit, and a resin extrusion process where a secondary coating layer is extrusion-formed on the pre-heated primary coating layer using a resin extrusion unit. Further disclosed is an apparatus for producing an insulated electric wire.
    Type: Application
    Filed: April 10, 2014
    Publication date: August 7, 2014
    Applicant: Furukawa Electric Co., Ltd.
    Inventors: Hiroyuki KUSAKA, Koji KUROMIYA, Satoshi SAITO, Takashi SHIGEMATSU, Akihiro MURAKAMI, Shinji ICHIKAWA, Haruo SAKUMA, Shingo NISHIJIMA
  • Publication number: 20140209021
    Abstract: Provided is a raw material gas supply device which includes: a raw material container; a carrier gas supply unit configured to supply a carrier gas into the container via a carrier gas flow path; a first flow rate measurement unit configured to measure a flow rate of the carrier gas flowing therethrough and output the same as a first flow rate measurement value; a raw material gas supply path configured to supply a raw material gas containing a vaporized raw material into a film forming apparatus; a second flow rate measurement unit configured to measure a flow rate of the raw material gas flowing therethrough and output the same as a second flow rate measurement value; and a flow rate calculation unit configured to calculate a difference between the first and second flow rate measurement values and to convert the difference into a vaporization flow rate of the raw material.
    Type: Application
    Filed: January 29, 2014
    Publication date: July 31, 2014
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Mitsuya INOUE, Makoto TAKADO, Atsushi ANDO
  • Publication number: 20140208565
    Abstract: An apparatus for coating a thin film on a flexible substrate is described. The apparatus includes a coating drum having an outer surface for guiding the flexible substrate through a first vacuum processing region and at least one second vacuum processing region, a gas separation unit for separating the first vacuum processing region and at least one second vacuum processing region and adapted to form a slit through which the flexible substrate can pass between the outer surface of the coating drum and the gas separation unit, wherein the gas separation unit is adapted to control fluid communication between the first processing region and the second processing region by adjusting the position of the gas separation unit.
    Type: Application
    Filed: April 26, 2013
    Publication date: July 31, 2014
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Hans-Georg LOTZ, Neil MORRISON, Jose Manuel DIEGUEZ-CAMPO, Heike LANDGRAF, Tobias STOLLEY, Stefan HEIN, Florian RIES, Wolfgang BUSCHBECK
  • Publication number: 20140209022
    Abstract: Provided is a raw material gas supply device for use in a film forming apparatus, which includes: a raw material container configured to accommodate a solid raw material; a carrier gas supply unit configured to supply a carrier gas to the container; a raw material gas supply path configured to supply a raw material gas containing a vaporized raw material from the container to the film forming apparatus; a flow rate measurement unit configured to measure a flow rate of the vaporized raw material; a pressure control unit configured to control an internal pressure of the container; and a control unit configured to control the pressure control unit to increase the internal pressure of the container when the measured flow rate of the vaporized raw material is higher than a predetermined target value, and to decrease the internal pressure when the measured flow rate is lower than the target value.
    Type: Application
    Filed: January 30, 2014
    Publication date: July 31, 2014
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Mitsuya INOUE, Makoto TAKADO
  • Publication number: 20140212599
    Abstract: An apparatus for depositing a thin film on a substrate is described. The apparatus includes a substrate support having an outer surface for guiding the substrate through a vacuum processing region, a plasma deposition source for depositing the thin film on the substrate in the vacuum processing region, wherein the plasma deposition source comprises an electrode, and an actuator configured for adjusting the distance between the electrode and the outer surface.
    Type: Application
    Filed: April 26, 2013
    Publication date: July 31, 2014
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Wolfgang BUSCHBECK, Florian RIES, Tobias STOLLEY
  • Publication number: 20140209020
    Abstract: A mobile printing apparatus includes a chassis; a first wheel rotatably mounted on the chassis; a second wheel rotatably mounted on the chassis; a motor for rotating the first wheel; an encoder for monitoring an amount of rotation; a first photosensor array; and an array of marking elements disposed proximate the first photosensor array.
    Type: Application
    Filed: January 25, 2013
    Publication date: July 31, 2014
    Inventor: Gregory Michael Burke
  • Publication number: 20140202384
    Abstract: A glue spreading system includes a spreading unit and a control unit. The spreading unit includes a primary pressing roller and a spreading roller. The spreading roller is adjacent to the primary pressing roller. A thin film transports between the primary pressing roller and the spreading roller. The spreading roller is configured for spreading a glue layer on the thin film. An actual thickness of the glue layer is decided by a pressure of the primary pressing roller applied on the spreading roller. The control unit is configured for detecting the actual thickness of the glue layer, and compares the actual thickness with a preset thickness. The control unit controls the pressure of the primary pressing roller applying on the spreading roller according to thickness differences between the actual thickness and the preset thickness.
    Type: Application
    Filed: August 30, 2013
    Publication date: July 24, 2014
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: CHIA-LING HSU
  • Publication number: 20140205744
    Abstract: Herein is an apparatus for overlaying a media stripe onto a media stripe previously applied to a surface (i.e., “old media strip”). The apparatus includes a mobile frame housing controls and an applicator head having a spray nozzle that applies new media. The applicator head also includes sensors and/or a camera that cast a cone of vision onto a surface. The cone of vision is positioned tangentially to a first edge of the old media stripe. If while operating the apparatus, the applicator head moves and the new media stripe is not overlaid onto the old media stripe, the sensors and/or camera will direct an actuator arm (or similar) to reposition the applicator head and spray nozzle so that the new media stripe is once again sprayed on top of the old media stripe.
    Type: Application
    Filed: January 19, 2014
    Publication date: July 24, 2014
    Inventor: Neal D. McNutt
  • Publication number: 20140202383
    Abstract: A wafer processing system includes at least one metrology chamber, a process chamber, and a controller. The at least one metrology chamber is configured to measure a thickness of a first layer on a back side of a wafer. The process chamber is configured to perform a treatment on a front side of the wafer. The front side is opposite the back side. The process chamber includes therein a multi-zone chuck. The multi-zone chuck is configured to support the back side of the wafer. The multi-zone chuck has a plurality of zones with controllable clamping forces for securing the wafer to the multi-zone chuck. The controller is coupled to the metrology chamber and the multi-zone chuck. The controller is configured to control the clamping forces in the corresponding zones in accordance with measured values of the thickness of the first layer in the corresponding zones.
    Type: Application
    Filed: March 20, 2014
    Publication date: July 24, 2014
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Nai-Han CHENG, Chi-Ming YANG, You-Hua CHOU, Kuo-Sheng CHUANG, Chin-Hsiang LIN
  • Publication number: 20140205743
    Abstract: The invention relates to a device (1) for coating workpieces, comprising a belt conveyor (2) drivable in rotation for transporting workpieces (13) to be coated, at least one paint spraying robot (6) and at least one surface spraying machine (8), wherein the paint spraying robot (6) is set up to coat side surfaces (14) and/or top surfaces (15) of the workpiece (13) and the surface spraying machine (8) is set up to coat the top surfaces (15) and/or side surfaces (14) of the workpiece (13).
    Type: Application
    Filed: December 27, 2013
    Publication date: July 24, 2014
    Applicant: Venjakob Maschinenbau GmbH & Co. KG
    Inventors: Christian Streit, Joachim Voigt
  • Publication number: 20140206119
    Abstract: A method for fabricating an organic light emitting display device includes forming a first electrode on a substrate; forming a pixel-defining film having an opening exposing the first electrode; forming an ink non-reactive solvent portion by discharging of an ink non-reactive solvent at the opening and forming an organic light emitting layer by discharging an organic light emitting ink on the ink non-reactive solvent portion; and forming a second electrode on the organic light emitting layer.
    Type: Application
    Filed: July 17, 2013
    Publication date: July 24, 2014
    Applicant: SAMSUNG DISPLAY CO., LTD.
    Inventor: Yoon Ho KANG
  • Publication number: 20140205742
    Abstract: Techniques disclosed herein include apparatus and processes for real time process control of the Polymer Dispersion Index (PDI) during polymerization processes. By tuning this chain length distribution in real time, a resulting polymer can have predetermined physical properties such as thickness, physical yield strength, decomposition time, thermal stability, etc. Techniques herein can dynamically control chain length distribution through use of a mass density measurement device located within a processing chamber and providing real time feedback of polymer growth. Chamber parameters can be controlled or modified before and during polymerization based on mass density feedback. Such chamber parameters can include pressure, temperature, chemistry, and process gas flow rates and flow periods.
    Type: Application
    Filed: January 24, 2013
    Publication date: July 24, 2014
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Bruce Adair Altemus, Scott W. LeFevre
  • Patent number: 8785216
    Abstract: A substrate processing method which is capable of enhancing productivity in manufacturing product substrates. In process chambers of an etching apparatus, etching is carried out on a substrate as an object to be processed, and dummy processing is carried out on at least one non-product substrate before execution of the etching. A host computer determines whether or not the dummy processing is to be executed. The host computer determines whether or not the interior of each of the process chambers and is in a stable state, and omits the execution of the dummy processing when it is determined that it is in the stable state.
    Type: Grant
    Filed: February 24, 2011
    Date of Patent: July 22, 2014
    Assignee: Tokyo Electron Limited
    Inventors: Satoshi Yamazaki, Mitsuru Hashimoto
  • Publication number: 20140199785
    Abstract: A method and apparatus for processing a semiconductor substrate is described. The apparatus is a process chamber having an optically transparent upper dome and lower dome. Vacuum is maintained in the process chamber during processing. The upper dome is thermally controlled by flowing a thermal control fluid along the upper dome outside the processing region. Thermal lamps are positioned proximate the lower dome, and thermal sensors are disposed among the lamps. The lamps are powered in zones, and a controller adjusts power to the lamp zones based on data received from the thermal sensors.
    Type: Application
    Filed: March 12, 2013
    Publication date: July 17, 2014
    Inventors: Joseph M. RANISH, Paul BRILLHART, Jose Antonio MARIN, Satheesh KUPPURAO, Balasubramanian RAMACHANDRAN, Swaminathan T. SRINIVASAN, Mehmet Tugrul SAMIR
  • Publication number: 20140199788
    Abstract: Disclosed is a process tunnel (102) through which substrates (140) may be transported in a floating condition between two gas bearings (124, 134). To monitor the transport of the substrates through the process tunnel, the upper and lower walls (120, 130) of the tunnel are fitted with at least one substrate detection sensor (S1, . . . , S6) at a respective substrate detection sensor location, said substrate detection sensor being configured to generate a reference signal reflecting a presence of a substrate between said first and second walls near and/or at said substrate detection sensor location. Also provided is a monitoring and control unit (160) that is operably connected to the at least one substrate detection sensor (S1, . . . , S6), and that is configured to record said reference signal as a function of time and to process said reference signal.
    Type: Application
    Filed: July 13, 2012
    Publication date: July 17, 2014
    Applicant: Levitech B.V.
    Inventors: Pascal Gustaaf Vermont, Wilhelmus Gerardus Van Velzen, Vladimir Ivanovich Kuznetsov, Ernst Hendrik August Granneman, Gonzalo Felipe Ramirez Troxler
  • Publication number: 20140199471
    Abstract: There is provided a method for manufacturing an insulated wire, including at least: coating an outer periphery of a running wire with an insulation coating material discharged from a coating material discharging tank; baking the insulation coating material by an incinerator, the insulation coating material being used for coating the outer periphery of the running wire; and cooling the running wire by a cooling mechanism so that a temperature of the running wire before being coated with the insulation coating material, is a specific temperature, based on a temperature of the running wire detected by a temperature detector, wherein the coating, the baking, and the cooling are repeated.
    Type: Application
    Filed: January 16, 2014
    Publication date: July 17, 2014
    Applicant: HITACHI METALS, LTD.
    Inventors: Yasuhiro FUNAYAMA, Yosuke WATANABE
  • Publication number: 20140196662
    Abstract: An in situ apparatus, system, and method for cladding or repairing cladding in installed pipelines are presented. The apparatus can include a coating collar, a material reservoir, a cladding head, an adjustable cladding chamber, and a chamber controller. The coating collar can include an external surface, a first circumferential wall, and a second circumferential wall and forms the adjustable cladding chamber along with interior wall of the pipe. The coating collar can have an aperture to include and allow deployment of the cladding head through it. The cladding head can be operatively coupled with the cladding material reservoir to allow efficient deployment of the cladding material on the pipe surface. The chamber controller can be coupled with the adjustable cladding chamber to control dimensions of the chamber thus restricting and controlling the environment and enabling efficient functioning of the cladding head and limiting grain growth in applied nanoclad materials.
    Type: Application
    Filed: December 20, 2013
    Publication date: July 17, 2014
    Applicant: FLUOR TECHNOLOGIES CORPORATION
    Inventors: Robert Prieto, Lakshmanan Rajagopalan
  • Publication number: 20140196664
    Abstract: Condensable materials, such as but not limited to tungsten fluoride (WF6), can be used deposit films in a chemical vapor deposition (CVD) process. Described herein are methods to collect and reuse the condensable materials that are unreacted in the production process rather than treat these materials as waste. In one embodiment, when a condensable material, such as gaseous WF6, is not supplied to the CVD reactor, it is redirected to a recovery cabinet for capture.
    Type: Application
    Filed: January 7, 2014
    Publication date: July 17, 2014
    Applicant: AIR PRODUCTS AND CHEMICALS, INC.
    Inventors: Andrew David Johnson, Rajiv Krishan Agarwal, Heui-Bok Ahn, William Jack Casteel, JR., Eugene Joseph Karwacki, JR., John Francis Lehmann, David Charles Winchester
  • Publication number: 20140199490
    Abstract: An apparatus for depositing a coating on one or more parts (21) has: a chamber (22); a part holder (64) for carrying the part(s); a bias voltage source (94) coupled to the part(s) to apply a bias voltage to the part(s); a source (34) of the coating material; a plurality of temperature sensors (76); and a plurality of leads (90) passing outputs of the temperature sensors out from the chamber. A temperature monitoring system (150) has a temperature data processor (300). At least one fiber optic link (223) couples the temperature data processor to the temperature sensors so as to electrically isolate the temperature data processor from the bias voltage.
    Type: Application
    Filed: March 17, 2014
    Publication date: July 17, 2014
    Applicant: UNITED TECHNOLOGIES CORPORATION
    Inventors: Richard S. Mullin, Anatoly Kuzmichev, Igor V. Belousov, Yuriy G. Kononenko, Oleg G. Pankov, Dmitriy Ryzhikov
  • Publication number: 20140199472
    Abstract: An aspect of the present invention provides an ejection volume correction method for an inkjet head, including: an arranging step of ejecting functional ink as ink droplets from nozzles of an inkjet head so as to discretely arrange the ink droplets on a front surface of a substrate; a contacting step of filling the functional ink in between a mold and the substrate by causing the mold to contact the ink droplets arranged on the front surface of the substrate; a curing step of curing the filled functional ink so as to generate a functional film ; a separating step of separating the mold from the functional film; a measuring step of measuring a thickness of the functional film; and a correcting step of correcting an ejection volume from the nozzles based on the measured thickness.
    Type: Application
    Filed: March 14, 2014
    Publication date: July 17, 2014
    Applicant: FUJIFILM CORPORATION
    Inventors: Kenichi KODAMA, Tadashi OMATSU
  • Publication number: 20140196663
    Abstract: An aligner includes a plurality of substrate rotators and a shaft member. Each substrate rotator includes a holder, a notch detector, an electromagnetic clutch and a driving belt. Each holder sucks the back surface of the substrate under vacuum and horizontally holds the substrate. Each notch detector detects a notch formed at the substrate, and supplies a detection result to the corresponding electromagnetic clutch as a detection signal. One end of the shaft member is connected to a motor. The shaft member is continuously rotated by the motor. Each electromagnetic clutch switches to a connection state in which rotational force of an inner periphery is transmitted to an outer periphery and a disconnection state in which rotational force of the inner periphery is transmitted to the outer periphery according to a detection signal supplied from the notch detector.
    Type: Application
    Filed: December 18, 2013
    Publication date: July 17, 2014
    Inventor: Masahito KASHIYAMA
  • Patent number: 8777686
    Abstract: A method of jetting a liquid crystal includes loading a substrate on a stage, controlling a surface temperature of an inkjet head and a substrate to be a setting temperature, and jetting the liquid crystal molecules on the substrate having the setting temperature.
    Type: Grant
    Filed: November 16, 2012
    Date of Patent: July 15, 2014
    Assignee: Samsung Display Co., Ltd.
    Inventors: Tae-Gyun Kim, Seung-Yeon Chae, Tae-Woon Cha
  • Publication number: 20140190000
    Abstract: An approach to refurbishing or remanufacturing an electronic device may involve exposing electrical components that are situated within an interior of the electronic device. The approach may also involve replacing one or more defective electronic components of the electronic device with one or more replacement components and applying a protective coating to at least a portion of the interior of the electronic device. The protective coating may cover the circuit board and the electronic components it carries. The protective coating may also cover at least some of the electrical connections of the electronic device. The protective coating may also be applied to the replacement component prior to reassembly. The resulting refurbished or remanufactured electronic device may thus be provided with moisture resistance to help protect the electronic device from damage caused by exposure to moisture.
    Type: Application
    Filed: January 17, 2014
    Publication date: July 10, 2014
    Applicant: HzO, Inc.
    Inventors: Blake Stevens, Max Sorenson, Scott B. Gordon
  • Publication number: 20140190408
    Abstract: A catheter tip coating assembly includes a housing defining a fluid reservoir and having a fluid outlet configured to dispense fluid to an end of a piece of tubing. The catheter tip coating assembly includes a valve assembly carried by the housing and at least partly disposed in fluid communication with the fluid reservoir. The valve assembly is configured to receive the piece of tubing and configured to move between a first position to limit fluid communication between the fluid reservoir and the fluid outlet and a second position to provide fluid communication between the fluid reservoir and the fluid outlet to dispense fluid to the end of the piece of tubing. The assembly provides for careful control over the amount of liquid that is applied and the depth of the wetting.
    Type: Application
    Filed: December 31, 2013
    Publication date: July 10, 2014
    Applicant: Fishman Corporation
    Inventor: W. Scott Beebe
  • Publication number: 20140185061
    Abstract: A method and system for real-time, in-line measurements of thicknesses of semiconductor layers of photovoltaic devices is provided. The method and system include taking ex-situ optical data measurements after deposition of the semiconductor layers. The measurements are then used to calculate the thicknesses of the layers in real-time using optical modeling software.
    Type: Application
    Filed: December 19, 2013
    Publication date: July 3, 2014
    Applicant: FIRST SOLAR, INC
    Inventors: Benyamin Buller, David Hwang, Benjamin Milliron, Dale Roberts, Rui Shao, Zhibo Zhao
  • Publication number: 20140182514
    Abstract: A display panel manufacturing device including a stage slider, a first stage configured to slide on the stage slider and to receive a test substrate, a second stage on the stage slider and configured to receive a main substrate, and a patterning unit located at a distance from the stage slider and configured to discharge organic drops onto the test substrate, configured to analyze patterns of the organic drops, configured to modify the patterns of the discharged organic drops according to an analysis of the patterns of the organic drops, and configured to discharge the organic drops onto the main substrate.
    Type: Application
    Filed: June 13, 2013
    Publication date: July 3, 2014
    Inventor: Hyea-Weon Shin
  • Publication number: 20140186974
    Abstract: In vapour deposition applications, especially OLED mass production, where it is necessary to measure and/or control the deposition rate of evaporation sources within specific tolerances, a measurement system is adapted to use robust and accurate optical thickness measurement methods at high and low rate sources, so that the thickness of a layer deposited on a substrate can be measured and controlled. A first evaporation source (11) deposits a layer of material on a substrate (20). A mobile element (41) is provided, On which a film is deposited from a second evaporation source (12b) in a deposition location (D1). Subsequently the mobile element is conveyed to a measurement location (D2) where the thickness of the film is measured by a thickness detector (45). The measurement apparatus is arranged to control the deposition of the first evaporation source in dependence on the thickness of the film deposited on the mobile element.
    Type: Application
    Filed: April 16, 2012
    Publication date: July 3, 2014
    Applicant: KONINKLIJKE PHILIPS N.V.
    Inventors: Johannes Krijne, Jürgen Eser
  • Publication number: 20140174349
    Abstract: Improved methods and apparatus for forming thin-film layers of semiconductor material absorber layers on a substrate web. According to the present teachings, a semiconductor layer may be formed in a multi-zone process whereby various layers are deposited sequentially onto a moving substrate web. At least one layer is deposited from a mixed gallium indium source.
    Type: Application
    Filed: February 28, 2014
    Publication date: June 26, 2014
    Applicant: Global Solar Energy, Inc.
    Inventors: Jeffrey S. BRITT, Scott WIEDEMAN
  • Publication number: 20140178566
    Abstract: A pattern forming apparatus includes: a laser irradiation device configured to emit and direct a beam of laser light to enter a hole through an opening section thereof formed in a substrate; a light reflection device having a reflective surface configured to reflect the laser light to irradiate an inner surface of the hole with the reflected laser light, the reflective surface being arranged on a bottom of the hole to face toward the opening section; a droplet ejection device configured to eject and deposit droplets of conductive ink into the hole; and a control device configured to control the laser irradiation device to irradiate and modify the inner surface of the hole with the laser light reflected on the reflective surface, and to control the droplet ejection device to eject and deposit the droplets of the conductive ink into the hole of which the inner surface has been modified.
    Type: Application
    Filed: February 26, 2014
    Publication date: June 26, 2014
    Applicant: FUJIFILM CORPORATION
    Inventor: Jun KODAMA
  • Publication number: 20140174350
    Abstract: There is provided a vapor phase deposition apparatus including: a reaction chamber having a susceptor with a wafer mounted thereon and depositing and growing an epitaxial thin film on the wafer; a housing having the reaction chamber disposed therein and having a window opened and closed to allow the wafer to be loaded into or unloaded from the wafer reaction chamber; and an exhaust unit discharging gas from within the housing to the outside to adjust internal pressure of the housing.
    Type: Application
    Filed: August 9, 2011
    Publication date: June 26, 2014
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sang Kyu Bang, Chin Wook Chon, Kyung Don Han, Jong Wook Suk, Sung Il Han
  • Publication number: 20140169402
    Abstract: An ion implant apparatus configured to measure the temperature or monitor the degradation of components in the apparatus is provided. The ion implant apparatus may include a platen configured to move in a first direction, a mask frame to hold one or more masks disposed on the platen, a first optical sensor configured to project an optical beam to a second optical sensor, and a measurement bar disposed on the mask frame, the measurement bar raised above the surface of the mask frame to interrupt the optical beam when the platen moves in the first direction.
    Type: Application
    Filed: December 10, 2013
    Publication date: June 19, 2014
    Applicant: Varian Semiconductor Equipment Associates, Inc.
    Inventors: Aaron P. Webb, Benjamin B. Riordon, Charles T. Carlson, Christopher N. Grant, Luke Bonecutter, William T. Weaver
  • Publication number: 20140170301
    Abstract: A thin film deposition apparatus and method are disclosed. In one aspect, the deposition apparatus comprises a deposition source emitting a deposition material that is to be deposited on a surface of a substrate, a transfer unit moving the deposition source, a thickness measurement sensor measuring a thickness of the deposition material deposited on the surface of the substrate, and a transfer controller adjusting a moving speed of the transfer unit according to the thickness of the deposition material deposited on the surface of the substrate per unit of time.
    Type: Application
    Filed: March 12, 2013
    Publication date: June 19, 2014
    Applicant: Samsung Display co., Ltd.
    Inventors: Yong Hun Jo, Jae Hong Ahn, Jong Woo Lee
  • Publication number: 20140166989
    Abstract: A method of forming microelectronic systems on a flexible substrate includes depositing (typically sequentially) on a first side of the flexible substrate at least one organic thin film layer, at least one electrode and at least one thin film encapsulation layer over the at least one organic thin film layer and the at least one electrode, wherein depositing the at least one organic thin film layer, depositing the at least one electrode and depositing the at least one thin film encapsulation layer each occur under vacuum and wherein no physical contact of the at least one organic thin film layer or the at least one electrode with another solid material occurs prior to depositing the at least one thin film encapsulation layer.
    Type: Application
    Filed: December 17, 2012
    Publication date: June 19, 2014
    Applicant: UNIVERSAL DISPLAY CORPORATION
    Inventors: Ruiqing Ma, Jeff Silvernail, Prashant Mandlik, Julia J. Brown, John Felts
  • Publication number: 20140161966
    Abstract: A monomer vaporizing device and a method of controlling the same are disclosed. The monomer vaporizing device includes: a first vaporizer and a second vaporizer that receive a purge gas and vaporize a first monomer and a second monomer, respectively; a first flow pipe and a second flow pipe that are connected to the respective vaporizers and allow the first monomer and the second monomer, vaporized by the respective vaporizers, to flow therethrough; a transition tube that is connected to the first flow pipe and the second flow pipe and supplies at least one of the first monomer and the second monomer to a deposition chamber; and a control valve apparatus that regulates monomer flow into the deposition chamber. The device facilitates smooth and uninterrupted application of monomer to the interior of a deposition chamber.
    Type: Application
    Filed: August 27, 2013
    Publication date: June 12, 2014
    Inventors: Yong-Suk Lee, Myung-Soo Huh, Suk-Won Jung, Jeong-Ho Yi, Mi-Ra An
  • Publication number: 20140162383
    Abstract: The invention includes: a first process of forming a texture structure on both surfaces of a semiconductor substrate of a first conductivity type; a second process of measuring a reflectance distribution of the both surfaces of the semiconductor substrate on which the texture structure is formed; a third process of forming an impurity diffusion layer, in which an impurity element of a second conductivity type is diffused, on one of the both surfaces of the semiconductor substrate which is narrower in the reflectance distribution; a fourth process of forming, on the impurity diffusion layer, a light receiving surface-side electrode having a predetermined pattern and electrically connected to the impurity diffusion layer; and a fifth process of forming a back surface-side electrode on another of the both surfaces of the semiconductor substrate which is wider in the reflectance distribution.
    Type: Application
    Filed: August 2, 2011
    Publication date: June 12, 2014
    Applicant: Mitsubishi Electric Corporation
    Inventor: Shoichi Karakida
  • Publication number: 20140158041
    Abstract: The invention concerns a method for fabricating a substrate in semiconductor material characterized in that it comprises the steps of: starting from a donor substrate in a first semiconductor material at an initial temperature, contacting a surface of the donor substrate with a bath of a second semiconductor material held in the liquid state at a temperature higher than the initial temperature, the second semiconductor material being chosen so that its melting point is equal to or lower than the melting point of the first semiconductor material, solidifying the bath material on the surface to thicken the donor substrate with a solidified layer. The invention also concerns a device for implementing the method.
    Type: Application
    Filed: July 25, 2012
    Publication date: June 12, 2014
    Applicant: SOITEC
    Inventor: Michel Bruel
  • Publication number: 20140162385
    Abstract: A deposition apparatus for performing a deposition process by using a mask with respect to a substrate, the deposition apparatus includes a chamber, a support unit in the chamber, the support unit including first holes and being configured to support the substrate, a supply unit configured to supply at least one deposition raw material toward the substrate, and movable alignment units through the first holes of the support unit, the alignment units being configured to support the mask and to align the mask with respect to the substrate.
    Type: Application
    Filed: September 8, 2013
    Publication date: June 12, 2014
    Applicant: SAMSUNG DISPLAY CO., LTD.
    Inventors: Myung-Soo HUH, Suk-Won JUNG, Jeong-Ho YI, Sang-Hyuk HONG, Yong-Suk LEE
  • Publication number: 20140160650
    Abstract: Methods for applying protective coatings to electronic devices that have already been assembled, and are in a consumer-ready or aftermarket form, are disclosed. In such a method, an electronic device may be at least partially disassembled to expose at least a portion of an interior of the electronic device. A protective coating is applied to some or all of the exposed surfaces of the electronic devices, including one or more internal surfaces, features or components of the electronic device. Thereafter, the electronic device may be reassembled. During and after reassembly, the protective coating resides internally within the electronic device. Systems for applying protective coatings to interior components of previously assembled electronic devices are also disclosed.
    Type: Application
    Filed: February 11, 2014
    Publication date: June 12, 2014
    Applicant: HzO, Inc.
    Inventors: Blake Stevens, Max Sorenson, Paul S. Clayson, Scott B. Gordon
  • Patent number: 8747949
    Abstract: A coating and developing system includes a cassette station, a processing station and an inspection station interposed between the cassette station and the processing station. Time for which a substrate is held uselessly in the inspection module is reduced. A substrate carrying means disposed in the inspection module places priority to transferring a substrate between the cassette station and the processing station, and transfers a substrate to an inspection module in a part of a cycle time in which a substrate carrying means disposed in the processing station carries out one carrying cycle. It is permitted to carry out a substrate from the inspection module in a skip carrying mode, in which a substrate specified by a larger ordinal numeral is carried ahead of a substrate specified by a smaller ordinal numeral. It is inhibited to carry a substrate to the inspection module in the skip carrying mode.
    Type: Grant
    Filed: October 12, 2010
    Date of Patent: June 10, 2014
    Assignee: Tokyo Electron Limited
    Inventors: Tomohiro Kaneko, Akira Miyata
  • Patent number: 8747608
    Abstract: A plasma processing apparatus includes a detector for detecting interference light of multiple wavelengths from a surface of a sample during processing, a pattern comparator for comparing actual deviation pattern data on the interference light obtained at a given time during processing and a plurality of standard deviation patterns corresponding to two or more thicknesses of the film, and calculating a deviation, the standard deviation patterns corresponding to interference light data of multiple wavelengths obtained, before the processing of the sample, for processing of another sample, a deviation comparator for comparing the deviation between the data and a predetermined deviation and outputting data on a thickness of the film of the sample at that time, a recorder for recording, as time series data, the data on the thickness of the film, and an endpoint decision unit.
    Type: Grant
    Filed: December 28, 2011
    Date of Patent: June 10, 2014
    Assignee: Hitachi High-Technologies Corporation
    Inventors: Tatehito Usui, Kazuhiro Joo, Takashi Fujii
  • Patent number: 8751046
    Abstract: A rotary coupling for a multi-axial robot hand (19) is provided with a rotatable hand housing (20) and an output element (21) that is rotatable on said housing. The rotary coupling (62) includes connections (65, 66, 68) for the output element (21), a tool (23) and an accessory unit (30). The tool (23) and the accessory unit (30) can be rotated relative to each other, and the accessory unit (30) can be coupled to the hand housing (20) or to the tool (23) or to the output element (21) via the rotary coupling (62). The rotary coupling (62) is provided for an application device (11) which is used to apply a sealant (8) on a lock seam (7) of an add-on piece (4) of a vehicle body (3).
    Type: Grant
    Filed: July 28, 2008
    Date of Patent: June 10, 2014
    Assignee: KUKA Systems GmbH
    Inventors: Gerhard Hartmann, Andreas Bernsau, Jürgen Radler
  • Publication number: 20140151333
    Abstract: A plasma deposition chamber is disclosed. A substrate support for supporting a surface to be processed is in the chamber. A processing head including an array of plasma microchambers is also in the chamber. Each of the plasma microchambers includes an open side disposed over at least a first portion of the surface to be processed. The open side has an area less than an entire area of the surface to be processed. A process gas source is coupled to the chamber to provide a process gas the array of plasma microchambers. A radio frequency power supply is connected to at least one electrode of the processing head. The array of plasma microchambers is configured to generate a plasma using the process gas to deposit a layer over the at least first portion of the surface to be processed. A method for performing a plasma deposition is also disclosed.
    Type: Application
    Filed: February 10, 2014
    Publication date: June 5, 2014
    Applicant: Lam Research Corporation
    Inventors: Richard Gottscho, Rajinder Dhindsa, Mukund Srinivasan
  • Publication number: 20140154515
    Abstract: An engineering or constructional member comprising at least two strips bonded with an adhesive; each of the strips comprises bamboo impregnated or treated with a polymer derived from one or more furfuryl alcohol resin precursors.
    Type: Application
    Filed: May 2, 2012
    Publication date: June 5, 2014
    Inventors: Per Brynildsen, Stig Lande
  • Publication number: 20140150722
    Abstract: A coating machine for applying a coating to screws is described. The coating machine has an operating space along which the screws to be coated are fed. A fixed surface is defined, which is fixed relative to the frame of the machine and is designed for abutment and positioning of the screws in the section upstream from said operating space and in said operating space.
    Type: Application
    Filed: November 14, 2013
    Publication date: June 5, 2014
    Applicant: TECNOLOGIC 3 S.R.L.
    Inventor: Antonio CALASSO
  • Publication number: 20140144380
    Abstract: A gas supply pipe and a chemical vapor deposition (CVD) apparatus including the gas supply pipe. The gas supply pipe includes: a first pipe connected to a gas storage apparatus via a gas supply line to supply a reacting gas into a reacting furnace; and a second pipe thermally contacting the first pipe to cool the first pipe, wherein a first end of the second pipe is connected to a cooling medium supplying unit via a cooling medium line such that a cooling medium circulates inside the second pipe, and a second, opposite end of the second pipe is connected to a cooling medium collecting unit.
    Type: Application
    Filed: November 28, 2012
    Publication date: May 29, 2014
    Inventors: Sung-ho Kang, Bong-jin Kuh, Ki-chul Kim, Jin-kwon Bok, Yong-kyu Joo, Sang-cheol Ha